the whole bump connector protruding from the surface

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H01L2224/16113

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16113the whole bump connector protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 12,224,264
- Issue date Feb 11, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable embedded silicon bridge via pillars in lithographically de...
- Patent number 12,199,067
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 12,142,598
- Issue date Nov 12, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,068,234
- Issue date Aug 20, 2024
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 11,842,981
- Issue date Dec 12, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 11,791,269
- Issue date Oct 17, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,699,646
- Issue date Jul 11, 2023
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 11,646,295
- Issue date May 9, 2023
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 11,631,656
- Issue date Apr 18, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising semiconductor die and interposer an...
- Patent number 11,527,496
- Issue date Dec 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,482,485
- Issue date Oct 25, 2022
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages and related methods
- Patent number 11,462,580
- Issue date Oct 4, 2022
- Semiconductor Components Industries, LLC
- Oswald L. Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,342,307
- Issue date May 24, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 11,171,113
- Issue date Nov 9, 2021
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and methods of forming same
- Patent number 11,152,344
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrates, a semiconductor device and a method fo...
- Patent number 11,139,264
- Issue date Oct 5, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 11,094,612
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20250226342
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...
- Publication number 20250158006
- Publication date May 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20250149501
- Publication date May 8, 2025
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...
- Publication number 20250149420
- Publication date May 8, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250096097
- Publication date Mar 20, 2025
- Hana Micron Inc.
- Jae-Sung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...
- Publication number 20250096197
- Publication date Mar 20, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379429
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20240063173
- Publication date Feb 22, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20230361043
- Publication date Nov 9, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230290719
- Publication date Sep 14, 2023
- UNITED MICROELECTRONICS CORP.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...
- Publication number 20230197684
- Publication date Jun 22, 2023
- MEDIATEK INC.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230005833
- Publication date Jan 5, 2023
- UNITED MICROELECTRONICS CORP.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20220102320
- Publication date Mar 31, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220084928
- Publication date Mar 17, 2022
- UNITED MICROELECTRONICS CORP.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...
- Publication number 20210398941
- Publication date Dec 23, 2021
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...
- Publication number 20210225807
- Publication date Jul 22, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210217736
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111158
- Publication date Apr 15, 2021
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS

the whole bump connector protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging structure and related inner lead bonding method

Die interconnect substrates, a semiconductor device and a method fo...

Scalable embedded silicon bridge via pillars in lithographically de...

Electrical interconnect bridge

Semiconductor package structure having an annular frame with trunca...

Semiconductor structure

Stackable via package and method

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor device and manufacturing method of the same

Die interconnect substrates, a semiconductor device and a method fo...

Electrical interconnect bridge

Stackable via package and method

Semiconductor structure

System-in-package with double-sided molding

Semiconductor package structure having an annular frame with trunca...

Method for manufacturing semiconductor structure

Interconnect structure with redundant electrical connectors and ass...

Semiconductor device comprising semiconductor die and interposer an...

Semiconductor structure having counductive bump with tapered portio...

Semiconductor structure

Image sensor packages and related methods

Semiconductor die singulation and structures formed thereby

Semiconductor structure and manufacturing method thereof

Interconnect structure with redundant electrical connectors and ass...

Semiconductor package structure having an annular frame with trunca...

Integrated circuit package and methods of forming same

Die interconnect substrates, a semiconductor device and a method fo...

Semiconductor devices including through-silicon-vias and methods of...

Stackable via package and method

Semiconductor structure having a conductive bump with a plurality o...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH SUBSTRATE FOR EL...

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

SEMICONDUCTOR PACKAGE WITH AT LEAST ONE PRE-MADE CONDUCTIVE UNIT AN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRICAL INTERCONNECT BRIDGE

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

Selectively Dispensed Underfill and Edge Bond Patterns

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

ELECTRICAL INTERCONNECT BRIDGE

STACKABLE VIA PACKAGE AND METHOD

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCA...

SEMICONDUCTOR STRUCTURE

STACKABLE VIA PACKAGE AND METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

DIE INTERCONNECT SUBSTRATES, A SEMICONDUCTOR DEVICE AND A METHOD FO...

SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF