the whole layer connector protruding from the surface

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H01L2224/29023

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29023the whole layer connector protruding from the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating the electronic component, and method for tra...
- Patent number 11,069,638
- Issue date Jul 20, 2021
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,004,697
- Issue date May 11, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,763,131
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,622,223
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, transposing component, method for fabricating...
- Patent number 10,438,911
- Issue date Oct 8, 2019
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,211,178
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,020,279
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with flip chip structure and fabrication metho...
- Patent number 9,673,163
- Issue date Jun 6, 2017
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 9,536,853
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and packaging method of wafer level chip scale pa...
- Patent number 9,299,592
- Issue date Mar 29, 2016
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform including a groove extending to an edge of the preform
- Patent number 9,190,384
- Issue date Nov 17, 2015
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 9,024,205
- Issue date May 5, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,018,664
- Issue date Apr 28, 2015
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated sheet and method of manufacturing semiconductor device us...
- Patent number 8,951,843
- Issue date Feb 10, 2015
- Nitto Denko Corporation
- Hiroyuki Senzai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including cap
- Patent number 8,946,877
- Issue date Feb 3, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip device with solder diffusion protection
- Patent number 8,759,962
- Issue date Jun 24, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153913
- Publication date May 9, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME
- Publication number 20230387373
- Publication date Nov 30, 2023
- Nichia Corporation.
- Hiroki TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE
- Publication number 20230246060
- Publication date Aug 3, 2023
- Fujian Prima Optoelectronics Co., Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
- Publication number 20230111320
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220216178
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220020725
- Publication date Jan 20, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210335745
- Publication date Oct 28, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME
- Publication number 20210313244
- Publication date Oct 7, 2021
- SOCLE TECHNOLOGY CORP.
- HSIANG-HUA LU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20210257226
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066243
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Byunghoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190311918
- Publication date Oct 10, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157112
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157111
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20160322324
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160172265
- Publication date Jun 16, 2016
- J-DEVICES CORPORATION
- Kiyoaki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE
- Publication number 20160141263
- Publication date May 19, 2016
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME
- Publication number 20160007464
- Publication date Jan 7, 2016
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...
- Publication number 20150262843
- Publication date Sep 17, 2015
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MODULE
- Publication number 20150262915
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Miwako SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Electrically Conducting Layer
- Publication number 20150145107
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20150091192
- Publication date Apr 2, 2015
- Samsung SDI Co., Ltd.
- Young Ju SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

the whole layer connector protruding from the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced device assembly structures and methods

Semiconductor device with a multi-layered encapsulant and associate...

Method for fabricating the electronic component, and method for tra...

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor device including built-in crack-arresting film structure

Electronic component, transposing component, method for fabricating...

Hermetically sealed MEMS device and its fabrication

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Semiconductor device including built-in crack-arresting film structure

Semiconductor device including built-in crack-arresting film structure

Method for producing structured sintered connection layers, and sem...

Semiconductor device with flip chip structure and fabrication metho...

Method for bonding metallic contact areas with solution of a sacrif...

Method for processing a wafer and wafer structure

Semiconductor device including built-in crack-arresting film structure

III-Nitride device with solderable front metal

Package structure and packaging method of wafer level chip scale pa...

Hermetically sealed wafer packages

Preform including a groove extending to an edge of the preform

Advanced device assembly structures and methods

Semiconductor device and production method therefor

Hermetically sealed wafer packages

Laminated sheet and method of manufacturing semiconductor device us...

Semiconductor package including cap

Power device with solderable front metal

Chip package and a method for manufacturing a chip package

Semiconductor chip device with solder diffusion protection

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

FERROMAGNETIC CONTROL OF WAFER BONDING

3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

ELECTRONIC DEVICE

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING COLOR MICRO LED DISPLAY CHIP MODULE

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Advanced Device Assembly Structures And Methods

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

MICRO LED DISPLAY AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

ELECTRONIC DEVICE AND MOUNTING STRUCTURE OF THE SAME

PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...

SEMICONDUCTOR DEVICE AND MODULE

Semiconductor Chip with Electrically Conducting Layer

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

CHIP AND CHIP ARRANGEMENT