Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

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B81C2203/037

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/037Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates and separating a portion of the bonded...
- Patent number 12,116,303
- Issue date Oct 15, 2024
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS sensor
- Patent number 11,390,519
- Issue date Jul 19, 2022
- Robert Bosch GmbH
- Sebastian Schuler-Watkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 11,292,715
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming hermetic seals in MEMS devices
- Patent number 11,161,737
- Issue date Nov 2, 2021
- Elbit Systems of America, LLC
- Arlynn W. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via (TSV) formation in integrated circuits
- Patent number 11,097,942
- Issue date Aug 24, 2021
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective wafer including inclined optical windows and device
- Patent number 10,996,461
- Issue date May 4, 2021
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package moisture control and leak mitigation for high vacuum sealed...
- Patent number 10,968,099
- Issue date Apr 6, 2021
- Texas Instruments Incorporated
- Kathryn Anne Schuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device formed by at least two bonded structural layers and man...
- Patent number 10,954,121
- Issue date Mar 23, 2021
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Rough anti-stiction layer for MEMS device
- Patent number 10,759,654
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Combined ambient pressure and acoustic MEMS sensor
- Patent number 10,623,867
- Issue date Apr 14, 2020
- Apple Inc.
- Neal D. Evans
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a protective wafer including inclined opti...
- Patent number 10,591,721
- Issue date Mar 17, 2020
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming hermetic seals in MEMS devices
- Patent number 10,584,027
- Issue date Mar 10, 2020
- Elbit Systems of America, LLC
- Arlynn W. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device formed by at least two bonded structural layers and man...
- Patent number 10,570,009
- Issue date Feb 25, 2020
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,556,792
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component arrangement with at least two components and method for p...
- Patent number 10,551,262
- Issue date Feb 4, 2020
- ENDRESS+HAUSER SE+CO.KG
- Anh Tuan Tham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,532,925
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic circuit element comprising microfluidic channel with n...
- Patent number 10,471,424
- Issue date Nov 12, 2019
- INCYTO CO., LTD.
- Sin Kil Cho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 10,457,549
- Issue date Oct 29, 2019
- TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device formed by at least two bonded structural layers and man...
- Patent number 10,227,233
- Issue date Mar 12, 2019
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240418510
- Publication date Dec 19, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE
- Publication number 20220340416
- Publication date Oct 27, 2022
- TOP TECHNOLOGY LTD
- Youngho LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF BONDING SUBSTRATES AND SEPARATING A PORTION OF THE BONDED...
- Publication number 20220289615
- Publication date Sep 15, 2022
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS, AND A WAFER
- Publication number 20220289567
- Publication date Sep 15, 2022
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20220219973
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED GLASS PACKAGE
- Publication number 20220219972
- Publication date Jul 14, 2022
- SCHOTT AG
- Robert Hettler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor Arrangement and Method for Producing a Sensor Arrangement
- Publication number 20220127137
- Publication date Apr 28, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210395076
- Publication date Dec 23, 2021
- RF360 Europe GmbH
- Manuel HOFER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS SENSOR
- Publication number 20210309512
- Publication date Oct 7, 2021
- ROBERT BOSCH GmbH
- Sebastian Schuler-Watkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20210188624
- Publication date Jun 24, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20200407220
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
- Publication number 20200385264
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE MOISTURE CONTROL AND LEAK MITIGATION FOR HIGH VACUUM SEALED...
- Publication number 20200207614
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kathryn Anne Schuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...
- Publication number 20200166743
- Publication date May 28, 2020
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Forming Hermetic Seals in MEMS Devices
- Publication number 20200156932
- Publication date May 21, 2020
- Elbit Systems of America, LLC
- Arlynn W. SMITH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MAN...
- Publication number 20200123004
- Publication date Apr 23, 2020
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200031662
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-CHENG LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024136
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024137
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MAN...
- Publication number 20190185318
- Publication date Jun 20, 2019
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Forming Hermetic Seals in MEMS Devices
- Publication number 20190169023
- Publication date Jun 6, 2019
- Eagle Technology, LLC
- Arlynn W. SMITH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20190161346
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE
- Publication number 20190119099
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for bonding wafers, and a wafer

Conductive bond structure to increase membrane sensitivity in MEMS...

Microelectronics package with vertically stacked MEMS device and co...

Method of bonding substrates and separating a portion of the bonded...

Micro-acoustic wafer-level package and method of manufacture

Microelectromechanical structure with bonded cover

Semiconductive structure and manufacturing method thereof

Inter-poly connection for parasitic capacitor and die size improvement

Method for manufacturing a MEMS sensor

Conductive bond structure to increase membrane sensitivity in MEMS...

Method for forming hermetic seals in MEMS devices

Through silicon via (TSV) formation in integrated circuits

Protective wafer including inclined optical windows and device

Package moisture control and leak mitigation for high vacuum sealed...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

MEMS device formed by at least two bonded structural layers and man...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Encapsulated microelectromechanical structure

Rough anti-stiction layer for MEMS device

Combined ambient pressure and acoustic MEMS sensor

Method for manufacturing a protective wafer including inclined opti...

Method for forming hermetic seals in MEMS devices

MEMS device formed by at least two bonded structural layers and man...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Component arrangement with at least two components and method for p...

Heater design for MEMS chamber pressure control

Microfluidic circuit element comprising microfluidic channel with n...

Semiconductive structure and manufacturing method thereof

Encapsulated microelectromechanical structure

MEMS device formed by at least two bonded structural layers and man...

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

MICROMECHANICAL STRUCTURE WITH BONDED COVER

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE

METHOD OF BONDING SUBSTRATES AND SEPARATING A PORTION OF THE BONDED...

METHOD FOR BONDING WAFERS, AND A WAFER

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

HERMETICALLY SEALED GLASS PACKAGE

Sensor Arrangement and Method for Producing a Sensor Arrangement

MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE

METHOD FOR MANUFACTURING A MEMS SENSOR

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE

PACKAGE MOISTURE CONTROL AND LEAK MITIGATION FOR HIGH VACUUM SEALED...

METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...

Method for Forming Hermetic Seals in MEMS Devices

MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MAN...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

SEMICONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MAN...

Method for Forming Hermetic Seals in MEMS Devices

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

ROUGH ANTI-STICTION LAYER FOR MEMS DEVICE