Thermal treatments

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H01L2224/27848

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27848Thermal treatments

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor apparatus and semiconductor...
- Patent number 11,769,754
- Issue date Sep 26, 2023
- Canon Kabushiki Kaisha
- Tatsuya Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
- Patent number 11,373,925
- Issue date Jun 28, 2022
- LIGHT-MED (USA), INC.
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that uses bonding layer to join semiconductor...
- Patent number 11,088,131
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of device chip
- Patent number 11,024,542
- Issue date Jun 1, 2021
- Disco Corporation
- Heidi Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Filler particle position and density manipulation with applications...
- Patent number 10,903,184
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device that uses bonding laye...
- Patent number 10,727,217
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,707,184
- Issue date Jul 7, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with preferred heat dissipating eff...
- Patent number 10,679,965
- Issue date Jun 9, 2020
- ZOWIE TECHNOLOGY CORPORATION
- Chia-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,629,439
- Issue date Apr 21, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor apparatus, method for manufa...
- Patent number 10,416,557
- Issue date Sep 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kyoko Soga
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for positioning a semiconductor chip on a carrier and method...
- Patent number 10,020,278
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct metal bonding method
- Patent number 10,020,283
- Issue date Jul 10, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Floriane Baudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including oblique region having lower c...
- Patent number 9,997,486
- Issue date Jun 12, 2018
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
- Publication number 20240347367
- Publication date Oct 17, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS
- Publication number 20240153862
- Publication date May 9, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER
- Publication number 20230317666
- Publication date Oct 5, 2023
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20230026052
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...
- Publication number 20220084903
- Publication date Mar 17, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...
- Publication number 20220005744
- Publication date Jan 6, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20200176421
- Publication date Jun 4, 2020
- Canon Kabushiki Kaisha
- Tatsuya Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...
- Publication number 20200066669
- Publication date Feb 27, 2020
- International Business Machines Corporation
- Jonathan Fry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...
- Publication number 20180331065
- Publication date Nov 15, 2018
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
- Publication number 20180269175
- Publication date Sep 20, 2018
- NITTO DENKO CORPORATION
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MANUFACTURING METHOD FOR PACKAGE DEVICE
- Publication number 20180204818
- Publication date Jul 19, 2018
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE REACTIVE CROSSLINKABLE COPOLYMERS
- Publication number 20180105627
- Publication date Apr 19, 2018
- Henkel AG & Co. KGaA
- Rainer Schoenfeld
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR
- Publication number 20180006022
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDED ASSEMBLY OF ELECTRONIC COMPONENT, SEMICONDUCTOR D...
- Publication number 20170317048
- Publication date Nov 2, 2017
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Norie MATSUBARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE
- Publication number 20170170137
- Publication date Jun 15, 2017
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077056
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077055
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20170033072
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning a Semiconductor Chip on a Carrier and Method...
- Publication number 20170025373
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS

Thermal treatments

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Atomic layer deposition bonding layer for joining two semiconductor...

Semiconductor structure having silver-indium transient liquid phase...

Manufacturing method for semiconductor apparatus and semiconductor...

Sintering materials and attachment methods using same

Silver-indium transient liquid phase method of bonding semiconducto...

Semiconductor device that uses bonding layer to join semiconductor...

Manufacturing method of device chip

Inkjet adhesive, manufacturing method for semiconductor device, and...

Filler particle position and density manipulation with applications...

Bonding material and bonding method using same

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Method of manufacturing semiconductor device that uses bonding laye...

Thermal bonding sheet and thermal bonding sheet with dicing tape

Semiconductor package structure with preferred heat dissipating eff...

Method for minimizing average surface roughness of soft metal layer...

Method for producing a substrate arrangement, substrate arrangement...

Method for producing a connecting medium on an assembly partner, me...

Thermally conductive sheet, production method for thermally conduct...

Die with integrated microphone device using through-silicon vias (T...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Method for manufacturing semiconductor apparatus, method for manufa...

Method for polymer-assisted chip transfer

Carrier and clip each having sinterable, solidified paste for conne...

Bonding structure and method for producing bonding structure

Electronic sandwich structure with two parts joined together by mea...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Method for simultaneously bonding multiple chips of different heigh...

Method for positioning a semiconductor chip on a carrier and method...

Direct metal bonding method

Anisotropic conductive film including oblique region having lower c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

SINTERING FILM FRAMES AND RELATED METHODS

OPTICAL SENSOR PACKAGE

DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS

ELECTRONIC DEVICE

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DEVICE WITH METAL SILICIDE LAYER

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...

SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTO...

MANUFACTURING METHOD FOR SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

FILLER PARTICLE POSITION AND DENSITY MANIPULATION WITH APPLICATIONS...

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

ELECTRONIC SANDWICH STRUCTURE WITH TWO PARTS JOINED TOGETHER BY MEA...

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape

MANUFACTURING METHOD FOR PACKAGE DEVICE

SURFACE REACTIVE CROSSLINKABLE COPOLYMERS

3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR

Packaged IC With Solderable Sidewalls

CONDUCTIVE BONDED ASSEMBLY OF ELECTRONIC COMPONENT, SEMICONDUCTOR D...

BONDING STRUCTURE AND METHOD FOR PRODUCING BONDING STRUCTURE

Packaged IC with Solderable Sidewalls

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

Method for Positioning a Semiconductor Chip on a Carrier and Method...