Thermocompression bonding

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H01L2224/83203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83203Thermocompression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
- Patent number 12,286,564
- Issue date Apr 29, 2025
- LG Chem, Ltd.
- Youngsam Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing nitride mesas each intended to form an electro...
- Patent number 12,278,224
- Issue date Apr 15, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Guy Feuillet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 12,272,667
- Issue date Apr 8, 2025
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing group for a sintering press for sintering electronic compo...
- Patent number 12,257,801
- Issue date Mar 25, 2025
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Package structure with stacked semiconductor dies
- Patent number 12,255,155
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,243,844
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible hybrid electronic system processing method and flexible hy...
- Patent number 12,224,246
- Issue date Feb 11, 2025
- Peking University
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC module and method of manufacturing IC module
- Patent number 12,183,706
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting device array and method of manufacturing the s...
- Patent number 12,166,021
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,119,337
- Issue date Oct 15, 2024
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,100,697
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film
- Patent number 12,087,722
- Issue date Sep 10, 2024
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...
- Publication number 20250239565
- Publication date Jul 24, 2025
- BOSCHMAN TECHNOLOGIES B.V.
- Franciscus Gerardus Johannes BOSCHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233107
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING STRUCTURE
- Publication number 20250219004
- Publication date Jul 3, 2025
- NITTO DENKO CORPORATION
- Masatoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250219007
- Publication date Jul 3, 2025
- Mitsubishi Electric Corporation
- Hiroya SANNAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250197687
- Publication date Jun 19, 2025
- Resonac Corporation
- Yui KUNITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...
- Publication number 20250201752
- Publication date Jun 19, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...
- Publication number 20250157976
- Publication date May 15, 2025
- Resonac Corporation
- Tomoyo KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...
- Publication number 20250157954
- Publication date May 15, 2025
- GE AVIATION SYSTEMS LIMITED
- Robert James MacDonald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE
- Publication number 20250149521
- Publication date May 8, 2025
- MaxLinear, Inc.
- Abdelkrim El Amili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...
- Publication number 20250149492
- Publication date May 8, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132276
- Publication date Apr 24, 2025
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
- Publication number 20250125302
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250079395
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...
- Publication number 20250070084
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250054892
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20250022784
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250015069
- Publication date Jan 9, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS

Thermocompression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a conductive layer on an IC using non-lithogr...

Semiconductor package and method of fabricating the same

Adhesive composition for semiconductor circuit connection, adhesive...

Flexible electronic structure

Method for producing nitride mesas each intended to form an electro...

Adhesive member, display device, and manufacturing method of displa...

Method of manufacturing substrate layered body and layered body

Pressing group for a sintering press for sintering electronic compo...

Package structure with stacked semiconductor dies

Display device and method of manufacturing the same

Display device using micro LED, and manufacturing method therefor

Flexible electronic structure including a support element

Method of manufacturing semiconductor package, and semiconductor pa...

Flexible hybrid electronic system processing method and flexible hy...

Semiconductor device

Semiconductor package and method for fabricating a semiconductor pa...

Semiconductor device with enhanced thermal dissipation and method f...

IC module and method of manufacturing IC module

Dicing die attach film, and semiconductor package using the same an...

Micro light emitting device array and method of manufacturing the s...

Method for manufacturing semiconductor device

Semiconductor device package and manufacturing method thereof

Die on die bonding structure

Method of manufacturing a semiconductor device

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor package structure

Diffusion soldering with contaminant protection

Anisotropic electrically conductive film

Patents Applicationslast 30 patents

PRESSURE SINTERING METHOD AND CORRESPONDING PRESSURE SINTERING APPA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONNECTING STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

SEMICONDUCTOR PACKAGE STRUCTURE AND BYPRODUCT OF SEMICONDUCTOR COMP...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

FILM-LIKE ADHESIVE AND METHOD FOR PRODUCING SAME, INTEGRATED DICING...

METHOD OF FABRICATING RADIO-FREQUENCY MULTI-LAYER CIRCUITS ON FUSED...

DIGITAL SIGNAL PROCESSOR TO PHOTONICS INTERFACE

COPPER PASTE FOR PRESSURE BONDING, SEMICONDUCTOR DEVICE, METHOD FOR...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE