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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83203
Thermocompression bonding
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last 30 patents
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Patent Grant
Adhesive composition, film-like adhesive and production method ther...
Patent number
11,952,513
Issue date
Apr 9, 2024
Furukawa Electric Co., Ltd.
Minoru Morita
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Conductive feature with non-uniform critical dimension and method o...
Patent number
11,935,816
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and connected structure
Patent number
11,923,335
Issue date
Mar 5, 2024
Dexerials Corporation
Seiichiro Shinohara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic electrically conductive film
Patent number
11,923,333
Issue date
Mar 5, 2024
Dexerials Corporation
Yasushi Akutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Profiled thermode
Patent number
11,910,533
Issue date
Feb 20, 2024
Pragmatic Printing Ltd
Neil Davies
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer substrate
Patent number
11,901,325
Issue date
Feb 13, 2024
Dexerials Corporation
Seiichiro Shinohara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,887,975
Issue date
Jan 30, 2024
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack and integrated device structure including improved bondin...
Patent number
11,869,859
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method of transferring electronic element usi...
Patent number
11,848,303
Issue date
Dec 19, 2023
Seoul National University R&DB Foundation
Yongtaek Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering press for sintering electronic components on a substrate
Patent number
11,820,095
Issue date
Nov 21, 2023
AMX—AUTOMATRIX S.R.L.
Nicola Schivalocchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating semiconductor device with stacked dies
Patent number
11,824,047
Issue date
Nov 21, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
Patent number
11,817,415
Issue date
Nov 14, 2023
Nitto Denko Corporation
Satoshi Honda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
11,791,314
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Seoeun Kyung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode display with redundancy scheme
Patent number
11,778,842
Issue date
Oct 3, 2023
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Printed circuit film, display device, and method of fabricating pri...
Patent number
11,737,215
Issue date
Aug 22, 2023
Samsung Display Co., Ltd.
Dong Hyun Lee
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
Patent number
11,728,201
Issue date
Aug 15, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer on wafer bonding structure
Patent number
11,715,723
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display module and method of manufacturing the same
Patent number
11,715,729
Issue date
Aug 1, 2023
Samsung Electronics Co., Ltd.
Yoonsuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bond tips and related apparatus and methods
Patent number
11,705,425
Issue date
Jul 18, 2023
Micron Technology, Inc.
Benjamin L. McClain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
Patent number
11,699,640
Issue date
Jul 11, 2023
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film
Patent number
11,694,988
Issue date
Jul 4, 2023
Dexerials Corporation
Reiji Tsukao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
Patent number
11,688,670
Issue date
Jun 27, 2023
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and display device using the same
Patent number
11,683,963
Issue date
Jun 20, 2023
SAMSUNG DISPLAY CO., LTD.
Chungseok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement and method for joining at least two joining partners
Patent number
11,676,933
Issue date
Jun 13, 2023
Infineon Technologies AG
Steffen Hartmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting apparatus
Patent number
11,664,344
Issue date
May 30, 2023
Shinkawa Ltd.
Kohei Seyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,658,169
Issue date
May 23, 2023
Kioxia Corporation
Junichi Shibata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Uniform pressure gang bonding method
Patent number
11,637,082
Issue date
Apr 25, 2023
eLux, Inc.
Wei-Yuan Ma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
Patent number
11,626,343
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yang-Che Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20240120306
Publication date
Apr 11, 2024
UNITED MICROELECTRONICS CORP.
Kai-Kuang Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating a Power Semiconductor Device
Publication number
20240096842
Publication date
Mar 21, 2024
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
Publication number
20240079365
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Seungryong HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
Publication number
20240079371
Publication date
Mar 7, 2024
GLOBALFOUNDRIES U.S. Inc.
John C. MALINOWSKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
Publication number
20240063167
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Hyunsoo CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240063096
Publication date
Feb 22, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Shigeki TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
Publication number
20240038627
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
Publication number
20240038619
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240014166
Publication date
Jan 11, 2024
Samsung Electronics Co., Ltd.
Youngdeuk KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
Publication number
20230420437
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chieh-Yen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CU-CU DIRECT WELDING FOR PACKAGING APPLICATION IN SEMICONDUCTOR IND...
Publication number
20230411347
Publication date
Dec 21, 2023
The University of Hong Kong
Mingxin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
Publication number
20230395395
Publication date
Dec 7, 2023
TOPPAN INC.
Takashi KIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
Publication number
20230377936
Publication date
Nov 23, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
Publication number
20230378209
Publication date
Nov 23, 2023
Semiconductor Components Industries, LLC
Chee Peng NEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT
Publication number
20230361076
Publication date
Nov 9, 2023
INFINEON TECHNOLOGIES AG
Hermann Bechert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE AGENT FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND MET...
Publication number
20230348764
Publication date
Nov 2, 2023
Resonac Corporation
Toshiyasu AKIYOSHI
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD FOR CONTACTING A POWER SEMICONDUCTOR ON A SUBSTRATE
Publication number
20230343745
Publication date
Oct 26, 2023
SIEMENS AKTIENGESELLSCHAFT
Claus Florian Wagner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230335527
Publication date
Oct 19, 2023
Fuji Electric Co., Ltd.
Takashi SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
Publication number
20230326897
Publication date
Oct 12, 2023
Wolfspeed, Inc.
Daniel Richter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED ELECTRONIC DEVICES HAVING TRANSIENT LIQUID PHASE SOLDER JO...
Publication number
20230317670
Publication date
Oct 5, 2023
Wolfspeed, Inc.
Sayan Seal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
Publication number
20230290751
Publication date
Sep 14, 2023
SAMSUNG DISPLAY CO., LTD.
Joo Nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
Publication number
20230290709
Publication date
Sep 14, 2023
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230282633
Publication date
Sep 7, 2023
KIOXIA Corporation
Junichi SHIBATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER ELECTRONIC ASSEMBLY AND POWER MODULE FOR EMBEDDING IN A PRINT...
Publication number
20230282553
Publication date
Sep 7, 2023
INFINEON TECHNOLOGIES AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD
Publication number
20230268312
Publication date
Aug 24, 2023
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
Peter M. Wallace
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR
Publication number
20230246143
Publication date
Aug 3, 2023
Samsung Electronics Co., Ltd.
Seungryong HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230231087
Publication date
Jul 20, 2023
Unimicron Technology Corp.
Hao-Wei TSENG
H01 - BASIC ELECTRIC ELEMENTS