Three-dimensional arrangements

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H01L27/11578

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11578Three-dimensional arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices and related methods of forming microelectro...
- Patent number 11,690,234
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Bo Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 11,670,592
- Issue date Jun 6, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 11,665,892
- Issue date May 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and photomask
- Patent number 11,665,898
- Issue date May 30, 2023
- Kioxia Corporation
- Daisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell pillar including source junction plug
- Patent number 11,653,494
- Issue date May 16, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,647,628
- Issue date May 9, 2023
- Kioxia Corporation
- Yuta Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 11,647,629
- Issue date May 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,646,265
- Issue date May 9, 2023
- SK hynix Inc.
- Dong Hyuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,641,738
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Woosung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with ferroelectric material
- Patent number 11,631,698
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and hybrid spacer thereof
- Patent number 11,626,412
- Issue date Apr 11, 2023
- Yangtze Memory Technologies Co., Ltd.
- Liheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,621,278
- Issue date Apr 4, 2023
- Kioxia Corporation
- Toshifumi Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,616,072
- Issue date Mar 28, 2023
- Kioxia Corporation
- Tetsuya Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 11,615,977
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,616,004
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure with s...
- Patent number 11,610,802
- Issue date Mar 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,610,913
- Issue date Mar 21, 2023
- SK hynix Inc.
- Yoo Hyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 11,605,643
- Issue date Mar 14, 2023
- Kioxia Corporation
- Daisuke Ikeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit device and structure with hybrid bonding
- Patent number 11,605,630
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method to produce 3D semiconductor devices and structures with memory
- Patent number 11,600,667
- Issue date Mar 7, 2023
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,594,473
- Issue date Feb 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of manufacturing semiconduct...
- Patent number 11,594,545
- Issue date Feb 28, 2023
- Kioxia Corporation
- Fumie Kikushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,594,549
- Issue date Feb 28, 2023
- Kioxia Corporation
- Ayumi Watarai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional ferroelectric memory device containing lattice-ma...
- Patent number 11,594,553
- Issue date Feb 28, 2023
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,587,944
- Issue date Feb 21, 2023
- Kioxia Corporation
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of forming the same
- Patent number 11,587,950
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory devices and methods of fabri...
- Patent number 11,588,032
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Kwang Soo Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device and manufacturing method thereof
- Patent number 11,581,323
- Issue date Feb 14, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jin Yong Oh
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory devices and fabrication methods thereof
- Patent number 11,581,332
- Issue date Feb 14, 2023
- Yangtze Memory Technologies Co., Ltd.
- Li Hong Xiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS
- Publication number 20240130128
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Yongjun Hu
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...
- Publication number 20240090217
- Publication date Mar 14, 2024
- SANDISK TECHNOLOGIES LLC
- Kyohei NABESAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240079057
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240074202
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED STAIRCASE VIA ROUTING FOR MEMORY
- Publication number 20240071902
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240074176
- Publication date Feb 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shasha LIU
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071502
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE
- Publication number 20240023335
- Publication date Jan 18, 2024
- KIOXIA Corporation
- Takahiro KOTOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230413548
- Publication date Dec 21, 2023
- Macronix International Co., Ltd.
- Chen-Yu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230397417
- Publication date Dec 7, 2023
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICES COMPRISING SEGMENTED HIGH-K DIELECTRIC MATERIALS...
- Publication number 20230389311
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH REDUCED AREA
- Publication number 20230386577
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ying Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230389310
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Keunnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20230371253
- Publication date Nov 16, 2023
- SK HYNIX INC.
- Jin Ho BIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, CIRCUIT STRUCTURE AND PRODUCTION METHOD THEREOF
- Publication number 20230371252
- Publication date Nov 16, 2023
- Macronix International Co., Ltd.
- Kuan-Yuan Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20230361030
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20230361031
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Lei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...
- Publication number 20230326737
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE TRANSISTOR ARCHITECTURE FOR THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20230307042
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Ferdinando Bedeschi
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230307362
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Takuya INATSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230307361
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230301084
- Publication date Sep 21, 2023
- Macronix International Co., Ltd.
- Shih-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230301107
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Takuya NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230301085
- Publication date Sep 21, 2023
- Macronix International Co., Ltd.
- Shih-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20230282576
- Publication date Sep 7, 2023
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...
- Publication number 20230282594
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230269938
- Publication date Aug 24, 2023
- Macronix International Co., Ltd.
- Jung-Yi Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230262983
- Publication date Aug 17, 2023
- KIOXIA Corporation
- Hisashi HARADA
- G11 - INFORMATION STORAGE
Information Patent Application
PARALLEL STAIRCASE 3D NAND
- Publication number 20230200063
- Publication date Jun 22, 2023
- Intel Corporation
- Deepak Thimmegowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230187279
- Publication date Jun 15, 2023
- KIOXIA Corporation
- Takanobu ONO
- H01 - BASIC ELECTRIC ELEMENTS

Three-dimensional arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices and related methods of forming microelectro...

Staircase structure in three-dimensional memory device and method f...

Staircase structure in three-dimensional memory device and method f...

Semiconductor device and photomask

Memory cell pillar including source junction plug

Semiconductor memory device

Three-dimensional memory devices and methods for forming the same

Semiconductor device

Three-dimensional semiconductor memory device

Bonded unified semiconductor chips and fabrication and operation me...

Three-dimensional memory device with ferroelectric material

Memory device and hybrid spacer thereof

Semiconductor memory device

Semiconductor memory device

3D semiconductor memory device and structure

3D semiconductor device and structure with metal layers and a conne...

Method for producing a 3D semiconductor device and structure with s...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor memory device and manufacturing method thereof

3D integrated circuit device and structure with hybrid bonding

Method to produce 3D semiconductor devices and structures with memory

3D semiconductor device and structure with metal layers and a conne...

Semiconductor memory device and method of manufacturing semiconduct...

Semiconductor memory device

Three-dimensional ferroelectric memory device containing lattice-ma...

Semiconductor storage device

Memory device and method of forming the same

Three-dimensional semiconductor memory devices and methods of fabri...

Non-volatile memory device and manufacturing method thereof

Three-dimensional memory devices and fabrication methods thereof

Patents Applicationslast 30 patents

SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A PILLAR CONTACT BETWEEN...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

Memory Circuitry And Method Used In Forming Memory Circuitry

FOLDED STAIRCASE VIA ROUTING FOR MEMORY

THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME

STAIRCASE FORMATION IN A MEMORY ARRAY

MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMORY DEVICE

ELECTRONIC DEVICES COMPRISING SEGMENTED HIGH-K DIELECTRIC MATERIALS...

MEMORY DEVICE WITH REDUCED AREA

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

MEMORY DEVICE, CIRCUIT STRUCTURE AND PRODUCTION METHOD THEREOF

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

TECHNOLOGIES FOR HIGH ASPECT RATIO CARBON ETCHING WITH INSERTED CHA...

MULTIPLE TRANSISTOR ARCHITECTURE FOR THREE-DIMENSIONAL MEMORY ARRAYS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MEMORY DEVICE

SEMICONDUCTOR STORAGE DEVICE

MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MEMORY DEVICE

PARALLEL STAIRCASE 3D NAND

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE