Three dimensional processing

Industry

CPC
Y10S148/164

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

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Y10S148/164Three dimensional processing

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,405,225
- Issue date Mar 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,148,826
- Issue date Apr 3, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,053,277
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 7,812,459
- Issue date Oct 12, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Forming a plurality of thin-film devices
- Patent number 7,195,950
- Issue date Mar 27, 2007
- Hewlett-Packard Development Company, L.P.
- Carl Philip Taussig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional processor using transferred thin film circuits
- Patent number 6,624,046
- Issue date Sep 23, 2003
- Kopin Corporation
- Paul M. Zavracky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor having a multi-layer stacked channel and its m...
- Patent number 6,291,863
- Issue date Sep 18, 2001
- Hyundai Electronics Industries Co., Ltd.
- Ha Hyoung Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked devices
- Patent number 6,020,250
- Issue date Feb 1, 2000
- International Business Machines Corporation
- Donald McAlpine Kenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional processor using transferred thin film circuits
- Patent number 5,976,953
- Issue date Nov 2, 1999
- Kopin Corporation
- Paul M. Zavracky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked devices
- Patent number 5,801,089
- Issue date Sep 1, 1998
- International Business Machines Corporation
- Donald McAlpine Kenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional processor using transferred thin film circuits
- Patent number 5,793,115
- Issue date Aug 11, 1998
- Kopin Corporation
- Paul M. Zavracky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electrical connect above an integrated ci...
- Patent number 5,691,239
- Issue date Nov 25, 1997
- International Business Machines Corporation
- Mark Charles Hakey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor on insulating substrate, and a...
- Patent number 5,668,046
- Issue date Sep 16, 1997
- NEC Corporation
- Risho Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming three dimensional processor using transferred th...
- Patent number 5,656,548
- Issue date Aug 12, 1997
- Kopin Corporation
- Paul M. Zavracky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion device
- Patent number 5,610,094
- Issue date Mar 11, 1997
- Canon Kabushiki Kaisha
- Masaharu Ozaki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Stacked devices
- Patent number 5,583,368
- Issue date Dec 10, 1996
- International Business Machines Corporation
- Donald M. Kenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connect and method of fabrication for semiconductor cube...
- Patent number 5,532,518
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Mark C. Hakey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor on insulating substrate, and a...
- Patent number 5,427,976
- Issue date Jun 27, 1995
- NEC Corporation
- Risho Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a three-dimensional semiconductor device
- Patent number 5,422,302
- Issue date Jun 6, 1995
- Takao Yonehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for production of an integrated circuit
- Patent number 5,409,857
- Issue date Apr 25, 1995
- Sony Corporation
- Seiichi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reach-through isolation silicon-on-insulator device
- Patent number 5,391,911
- Issue date Feb 21, 1995
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor having a multi-layer stacked channel and its m...
- Patent number 5,372,959
- Issue date Dec 13, 1994
- Hyundai Electronics Industries Co., Ltd.
- Ha H. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming deep conductive feedthroughs
- Patent number 5,322,816
- Issue date Jun 21, 1994
- Hughes Aircraft Company
- Jerald F. Pinter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating three dimensional gallium arsenide microelect...
- Patent number 5,312,765
- Issue date May 17, 1994
- Hughes Aircraft Company
- Hilda Kanber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reach-through isolation etching method for silicon-on-insulator dev...
- Patent number 5,306,659
- Issue date Apr 26, 1994
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating surface micromachined structures
- Patent number 5,130,276
- Issue date Jul 14, 1992
- Motorola Inc.
- Victor J. Adams
- G01 - MEASURING TESTING
Information Patent Grant
Filling contact hole with selectively deposited EPI and poly silicon
- Patent number 5,124,276
- Issue date Jun 23, 1992
- Kabushiki Kaisha Toshiba
- Shuichi Samata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,120,666
- Issue date Jun 9, 1992
- Fujitsu Limited
- Hiroshi Gotou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked tungsten gate PFET devices and structures...
- Patent number 5,112,765
- Issue date May 12, 1992
- International Business Machines Corporation
- Carl Cederbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved wiring contact portion
- Patent number 5,057,899
- Issue date Oct 15, 1991
- Kabushiki Kaisha Toshiba
- Shuichi Samata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-Dimensional Integrated Circuits with Protection Layers
- Publication number 20120187576
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH PROTECTION LAYERS
- Publication number 20120032348
- Publication date Feb 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuits with Protection Layers
- Publication number 20100330743
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated circuits with protection layers
- Publication number 20080142990
- Publication date Jun 19, 2008
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a plurality of thin-film devices
- Publication number 20060019504
- Publication date Jan 26, 2006
- Carl Philip Taussig
- B82 - NANO-TECHNOLOGY

Three dimensional processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional integrated circuits with protection layers

Three-dimensional integrated circuits with protection layers

Three-dimensional integrated circuits with protection layers

Three-dimensional integrated circuits with protection layers

Forming a plurality of thin-film devices

Three dimensional processor using transferred thin film circuits

Thin film transistor having a multi-layer stacked channel and its m...

Stacked devices

Three dimensional processor using transferred thin film circuits

Method of forming stacked devices

Three dimensional processor using transferred thin film circuits

Method for fabricating an electrical connect above an integrated ci...

Method of producing a semiconductor on insulating substrate, and a...

Method for forming three dimensional processor using transferred th...

Photoelectric conversion device

Stacked devices

Electrical connect and method of fabrication for semiconductor cube...

Method of producing a semiconductor on insulating substrate, and a...

Method for producing a three-dimensional semiconductor device

Process for production of an integrated circuit

Reach-through isolation silicon-on-insulator device

Thin film transistor having a multi-layer stacked channel and its m...

Method for forming deep conductive feedthroughs

Method of fabricating three dimensional gallium arsenide microelect...

Reach-through isolation etching method for silicon-on-insulator dev...

Method of fabricating surface micromachined structures

Filling contact hole with selectively deposited EPI and poly silicon

Manufacturing method for semiconductor device

Method of forming stacked tungsten gate PFET devices and structures...

Semiconductor device with improved wiring contact portion

Patents Applicationslast 30 patents

Three-Dimensional Integrated Circuits with Protection Layers

THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH PROTECTION LAYERS

Three-Dimensional Integrated Circuits with Protection Layers

Three-dimensional integrated circuits with protection layers

Forming a plurality of thin-film devices