Three-layer arrangements

Industry

CPC
H01L2224/13083

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13083Three-layer arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 12,154,881
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing same
- Patent number 12,100,680
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, optical structure and method for manufacturing t...
- Patent number 12,033,934
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions
- Patent number 12,033,968
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced bump height variation
- Patent number 11,935,866
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display backplate and method for manufacturing same, display panel...
- Patent number 11,929,358
- Issue date Mar 12, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having distinguishable electrodes
- Patent number 11,817,439
- Issue date Nov 14, 2023
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,711,985
- Issue date Jul 25, 2023
- SeeQC Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display backplate and method for manufacturing same, display panel...
- Patent number 11,688,724
- Issue date Jun 27, 2023
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stacked pillar portions on a semiconductor structure
- Patent number 11,682,645
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 11,640,951
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421112
- Publication date Dec 19, 2024
- Rohm Co., Ltd.
- Yuta KASHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404971
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION
- Publication number 20240395768
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Jiexiong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363572
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Akinori NII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...
- Publication number 20240321796
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20240297086
- Publication date Sep 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS
- Publication number 20240234356
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234288
- Publication date Jul 11, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...
- Publication number 20240222318
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...
- Publication number 20240162180
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240096833
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021592
- Publication date Jan 18, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006362
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20230380302
- Publication date Nov 23, 2023
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING T...
- Publication number 20230317589
- Publication date Oct 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...
- Publication number 20230275055
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLATE AND METHOD FOR MANUFACTURING SAME, DISPLAY PANEL...
- Publication number 20230260982
- Publication date Aug 17, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
- Publication number 20230253395
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230238346
- Publication date Jul 27, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20230223374
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Three-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit device having redistribution pattern

Bonding structures and methods for forming the same

Semiconductor device assembly with die support structures

Method for forming semiconductor package and semiconductor package

Method for manufacturing a structure

Semiconductor structure and method for preparing same

Bump structure having a side recess and semiconductor structure inc...

Joint structure in semiconductor package and manufacturing method t...

Method for forming conductive layer, and conductive structure and f...

Package structure, optical structure and method for manufacturing t...

Package structure including stacked pillar portions

Advanced device assembly structures and methods

Packaged die and RDL with bonding structures therebetween

Package structure with a barrier layer

Electronic package including electronic structure and electronic co...

Solderless interconnection structure and method of forming same

Semiconductor device having reduced bump height variation

Display backplate and method for manufacturing same, display panel...

Silicon photonic interposer with two metal redistribution layers

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor device and package assembly including the same

Semiconductor device having through silicon vias and manufacturing...

Semiconductor device having distinguishable electrodes

Microwave integrated quantum circuits with cap wafers and their met...

Methods and systems for manufacturing pillar structures on semicond...

System and method for superconducting multi-chip module

Display backplate and method for manufacturing same, display panel...

Plurality of stacked pillar portions on a semiconductor structure

Memory devices with controllers under memory packages and associate...

Integrated circuit device having redistribution pattern

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...

PACKAGE STRUCTURE WITH A BARRIER LAYER

INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE

ALLOY FOR METAL UNDERCUT REDUCTION

CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS

SEMICONDUCTOR PACKAGE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

PACKAGE STRUCTURE, OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING T...

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

PACKAGE STRUCTURE INCLUDING STACKED PILLAR PORTIONS AND METHOD FOR...

DISPLAY BACKPLATE AND METHOD FOR MANUFACTURING SAME, DISPLAY PANEL...

PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...