Tin [Sn] as principal constituent

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H01L2224/29411

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29411Tin [Sn] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display module and manufacturing method thereof
- Patent number 11,817,414
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,024,439
- Issue date Jun 1, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Particles, connecting material and connection structure
- Patent number 11,017,916
- Issue date May 25, 2021
- Sekisui Chemical Co., Ltd.
- Mai Yamagami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, bonded body and semiconductor device
- Patent number 10,249,591
- Issue date Apr 2, 2019
- Mitsubishi Materials Corporation
- Hiroto Akaike
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,865,558
- Issue date Jan 9, 2018
- Samsung SDI Co., Ltd.
- Young Ju Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device bonded by an anisotropic conductive film
- Patent number 8,896,117
- Issue date Nov 25, 2014
- Cheil Industries, Inc.
- Youn Jo Ko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroconductive fine particles, anisotropic electroconductive mat...
- Patent number 8,609,246
- Issue date Dec 17, 2013
- Sekisui Chemical Co., Ltd.
- Ren-de Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,638,883
- Issue date Dec 29, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,531,387
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded anisotropic conductive film
- Patent number 6,806,581
- Issue date Oct 19, 2004
- Au Optronics Corporation
- Kuan-Sheng Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Product using Zn-Al alloy solder
- Patent number 6,563,225
- Issue date May 13, 2003
- Hitachi, Ltd.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High conductivity, high strength, lead-free, low cost, electrically...
- Patent number 6,238,599
- Issue date May 29, 2001
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer with transient liquid phase bondable particles
- Patent number 6,199,751
- Issue date Mar 13, 2001
- International Business Machines Corporation
- Michael A. Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conducting materials and applications for microelectronic...
- Patent number 6,114,413
- Issue date Sep 5, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polymer with transient liquid phase bondable particles
- Patent number 6,087,021
- Issue date Jul 11, 2000
- International Business Machines Corporation
- Michael A. Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating coated powder materials and their use for hig...
- Patent number 6,059,952
- Issue date May 9, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bonding electrical leads to pads with particles
- Patent number 5,076,485
- Issue date Dec 31, 1991
- Microelectronics and Computer Technology Corporation
- Colin A. MacKay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS
Information Patent Grant
Bonding electrical leads to pads on electrical components
- Patent number 4,995,551
- Issue date Feb 26, 1991
- Microelectronics and Computer Technology Corporation
- Colin A. MacKay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20240021565
- Publication date Jan 18, 2024
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED STRUCTURE
- Publication number 20220093553
- Publication date Mar 24, 2022
- MITSUBISHI MATERIALS CORPORATION
- Fumiaki Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant Electronic Component Interconnection
- Publication number 20220052012
- Publication date Feb 17, 2022
- Paricon Technologies Corporation
- Larre H. Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220013489
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED TRANSIENT LIQUID PHASE BONDING
- Publication number 20200146155
- Publication date May 7, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE
- Publication number 20180297154
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd
- Mai YAMAGAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE
- Publication number 20180286829
- Publication date Oct 4, 2018
- MITSUBISHI MATERIALS CORPORATION
- Hiroto Akaike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION
- Publication number 20180247885
- Publication date Aug 30, 2018
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM
- Publication number 20130127038
- Publication date May 23, 2013
- Youn Jo KO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20120235162
- Publication date Sep 20, 2012
- KABUSHIKI KAISHA YASKAWA DENKI
- Tasuku ISOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MAT...
- Publication number 20100112353
- Publication date May 6, 2010
- Sekisui Chemical Co., Ltd.
- Ren-de Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and bump forming method
- Publication number 20080284046
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO...
- Publication number 20070226995
- Publication date Oct 4, 2007
- Gregory Alan Bone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and materials for printing particle-enhanced electrical cont...
- Publication number 20040087128
- Publication date May 6, 2004
- Herbert J Neuhaus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive fillers and conductive polymers made therefrom
- Publication number 20030113531
- Publication date Jun 19, 2003
- Karel Hajmrle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Bonded anisotropic conductive film
- Publication number 20030038375
- Publication date Feb 27, 2003
- Kuan-Sheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Product using Zn-Al alloy solder
- Publication number 20020149114
- Publication date Oct 17, 2002
- Tasao Soga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS
- Publication number 20020005247
- Publication date Jan 17, 2002
- TERESITA ORDONEZ GRAHAM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Tin [Sn] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display module and manufacturing method thereof

Hybrid bonding structures and semiconductor devices including the same

Multilayered transient liquid phase bonding

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Particles, connecting material and connection structure

Particles, connecting material and connection structure

Nanoscale interconnect array for stacked dies

Resin composition, bonded body and semiconductor device

Semiconductor device connected by anisotropic conductive film

Interconnect structures with polymer core

Anisotropic conductive film including conductive adhesive layer and...

Electroconductive microparticles, anisotropic electroconductive mat...

Connection device, method for manufacturing connection structure, m...

Junction and electrical connection

Circuit component and method of making the same

Semiconductor device bonded by an anisotropic conductive film

Electroconductive fine particles, anisotropic electroconductive mat...

Flip chip mounting method and bump forming method

Flip chip mounting method and bump forming method

Bonded anisotropic conductive film

Product using Zn-Al alloy solder

High conductivity, high strength, lead-free, low cost, electrically...

Polymer with transient liquid phase bondable particles

Thermally conducting materials and applications for microelectronic...

Polymer with transient liquid phase bondable particles

Method of fabricating coated powder materials and their use for hig...

Bonding electrical leads to pads with particles

Method of producing connection electrodes

Bonding electrical leads to pads on electrical components

Patents Applicationslast 30 patents

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

JOINED STRUCTURE

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

Compliant Electronic Component Interconnection

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

MULTILAYERED TRANSIENT LIQUID PHASE BONDING

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE

RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE

ELECTRONIC ASSEMBLY WITH ENHANCED THERMAL DISSIPATION

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

INTERCONNECT STRUCTURES WITH POLYMER CORE

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

SEMICONDUCTOR DEVICE BONDED BY AN ANISOTROPIC CONDUCTIVE FILM

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

POWER CONVERTER

ELECTROCONDUCTIVE FINE PARTICLES, ANISOTROPIC ELECTROCONDUCTIVE MAT...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

Flip chip mounting method and bump forming method

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO...

Method and materials for printing particle-enhanced electrical cont...

Conductive fillers and conductive polymers made therefrom

Bonded anisotropic conductive film

Product using Zn-Al alloy solder

ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS