Totta et al, "SLT Device Metallurgy and Its Monolithic Extension", IBM Journal of Research Development, pp. 226-238 (May, 1969). |
Miller, "Controlled Collapse Reflow Chip Joining", IBM Journal of Research Development pp. 239-250 (May, 1969). |
Hatada et al, "New Film Carrier Assembly Technology" Transferred Bump Tab, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-10, No. 3, pp. 335-340 (Sep., 1987). |
Hatada et al, "Application to the Electronic Instrument by Transferred Bump-TAB Technology", Proceedings of the 1987 International Symposium on Microelectronics, pp. 649-653 (Sep. 1987). |
Hatada et al, "Application to the Electronic Instrument by Transferred Bump-TAB Technology", Proceedings of the Third IEEE/CHMT International Electronic Manufacturing Technology Symposium, pp. 81-86 (Oct., 1987). |
Hatada et al, "Bump Property for High Bondability and Reliability in Transferred Bump Tab Assembly Technology", IMC 1988 Proceedings, pp. 440-443, (May 1988). |