Titanium (Ti) as principal constituent

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H01L2224/48666

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48666Titanium (Ti) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 10,636,703
- Issue date Apr 28, 2020
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for preventing crack in pad region and fabrica...
- Patent number 9,373,591
- Issue date Jun 21, 2016
- MagnaChip Semiconductor, Ltd.
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and packaged semiconductor devices
- Patent number 9,263,412
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having copper interconnect for bonding
- Patent number 8,759,970
- Issue date Jun 24, 2014
- Round Rock Research, LLC
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,446,019
- Issue date May 21, 2013
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 8,314,491
- Issue date Nov 20, 2012
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,294,254
- Issue date Oct 23, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having contact elements with a specified cross se...
- Patent number 8,227,908
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale surface mounted semiconductor device package and process...
- Patent number 8,222,078
- Issue date Jul 17, 2012
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved contact interface reliability...
- Patent number 8,193,624
- Issue date Jun 5, 2012
- Amkor Technology, Inc.
- Eun Sook Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,188,606
- Issue date May 29, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect for improved mechanical and thermo-mechani...
- Patent number 7,973,418
- Issue date Jul 5, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,964,911
- Issue date Jun 21, 2011
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond structure and method to connect to a microelectronic die
- Patent number 7,855,103
- Issue date Dec 21, 2010
- Intel Corporation
- Robert J. Gleixner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of producing a semiconductor device by forming an oxide film...
- Patent number 7,833,882
- Issue date Nov 16, 2010
- Sumitomo Electric Industries, Ltd.
- Yukihiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer structure and method for...
- Patent number 7,825,446
- Issue date Nov 2, 2010
- Fujitsu Semiconductor Limited
- Yasufumi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,791,308
- Issue date Sep 7, 2010
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-base circuit board and its manufacturing method
- Patent number 7,709,939
- Issue date May 4, 2010
- Denki Kagaku Kogyo Kabushiki Kaisha
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad structure for wire bonding
- Patent number 7,592,710
- Issue date Sep 22, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and semiconductor device having copper interconnect for bonding
- Patent number 7,592,246
- Issue date Sep 22, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect
- Patent number 7,569,934
- Issue date Aug 4, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating board on chip (BOC) semiconductor package wi...
- Patent number 7,537,966
- Issue date May 26, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION
- Publication number 20130043598
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20120228765
- Publication date Sep 13, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20120217660
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20120161307
- Publication date Jun 28, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FOR PREVENTING CRACK IN PAD REGION AND FABRICA...
- Publication number 20110272818
- Publication date Nov 10, 2011
- Jong-yeul Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20110186995
- Publication date Aug 4, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110024901
- Publication date Feb 3, 2011
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...
- Publication number 20110018116
- Publication date Jan 27, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148244
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148718
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING
- Publication number 20090309222
- Publication date Dec 17, 2009
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...
- Publication number 20080308934
- Publication date Dec 18, 2008
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER STRUCTURE AND METHOD FOR...
- Publication number 20080277705
- Publication date Nov 13, 2008
- Fujitsu Limited
- Yasufumi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE
- Publication number 20080227285
- Publication date Sep 18, 2008
- ROBERT J. GLEIXNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20080122079
- Publication date May 29, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Bo-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bond pad structure for wire bonding
- Publication number 20070205508
- Publication date Sep 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and production method thereof
- Publication number 20070187707
- Publication date Aug 16, 2007
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Yukihiro Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-base circuit board and its manufacturing method
- Publication number 20070128772
- Publication date Jun 7, 2007
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Naomi Yonemura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Titanium (Ti) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device for preventing crack in pad region and fabrica...

Semiconductor component support and semiconductor device

Semiconductor device for preventing crack in pad region and fabrica...

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Packaging methods and packaged semiconductor devices

Manufacturing electronic device having contact elements with a spec...

Chip package and a method for manufacturing a chip package

Semiconductor device having copper interconnect for bonding

Power semiconductor chip having two metal layers on one face

Solder bump interconnect

Manufacturing method of semiconductor device and semiconductor device

Chip scale surface mounted semiconductor device package and process...

Electronic device having contact elements with a specified cross se...

Chip scale surface mounted semiconductor device package and process...

Semiconductor device having improved contact interface reliability...

Solder bump interconnect

Wafer and semiconductor package

Bond pad structure having dummy plugs and/or patterns formed therea...

Solder bump interconnect for improved mechanical and thermo-mechani...

Semiconductor element and electrical apparatus

Wirebond structure and method to connect to a microelectronic die

Method of producing a semiconductor device by forming an oxide film...

Semiconductor device, semiconductor wafer structure and method for...

Semiconductor element and electrical apparatus

Metal-base circuit board and its manufacturing method

Bond pad structure for wire bonding

Method and semiconductor device having copper interconnect for bonding

Copper interconnect

Method for fabricating board on chip (BOC) semiconductor package wi...

Patents Applicationslast 30 patents

Packaging Methods and Packaged Semiconductor Devices

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Device Including a Semiconductor Chip and Wires

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SOLDER BUMP INTERCONNECT

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

SEMICONDUCTOR DEVICE FOR PREVENTING CRACK IN PAD REGION AND FABRICA...

SOLDER BUMP INTERCONNECT

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

CHIP SCALE SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGE AND PROCESS...

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

WAFER AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

METHOD AND SEMICONDUCTOR DEVICE HAVING COPPER INTERCONNECT FOR BONDING

SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER STRUCTURE AND METHOD FOR...

WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Bond pad structure for wire bonding

Semiconductor device and production method thereof

Metal-base circuit board and its manufacturing method