Tools for reworking

Industry

CPC
H01L2224/749

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/749Tools for reworking

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bumps, semiconductor device and method for manuf...
- Patent number 8,962,470
- Issue date Feb 24, 2015
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of patterning resin insulation laye...
- Patent number 8,405,218
- Issue date Mar 26, 2013
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and apparatus
- Patent number 7,659,148
- Issue date Feb 9, 2010
- Panasonic Corporation
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head assembly, disk unit, and bonding method and apparatus
- Patent number 7,347,347
- Issue date Mar 25, 2008
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip bonder
- Patent number 7,222,772
- Issue date May 29, 2007
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 7,174,629
- Issue date Feb 13, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Head assembly having integrated circuit chip covered by layer which...
- Patent number 6,885,522
- Issue date Apr 26, 2005
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 6,555,764
- Issue date Apr 29, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Methods of making bondable contacts and a tool for making such cont...
- Patent number 6,527,163
- Issue date Mar 4, 2003
- Tessera, Inc.
- Hamid Eslampour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an electronic circuit device and apparatus fo...
- Patent number 6,227,436
- Issue date May 8, 2001
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating electronic circuit device and apparatus for p...
- Patent number 5,816,473
- Issue date Oct 6, 1998
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device and fabrication method thereof
- Patent number 5,616,520
- Issue date Apr 1, 1997
- Hitachi, Ltd.
- Masahiko Nishiuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electronic circuit device and apparatus for p...
- Patent number 5,341,980
- Issue date Aug 30, 1994
- Hitachi, Ltd.
- Toru Nishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATE...
- Publication number 20170023617
- Publication date Jan 26, 2017
- TRANSLARITY, INC.
- Jens Ruffler
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR EUTECTIC BONDING
- Publication number 20150235982
- Publication date Aug 20, 2015
- ROBERT BOSCH GmbH
- Ralf HAUSNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...
- Publication number 20110198733
- Publication date Aug 18, 2011
- DENSO CORPORATION
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...
- Publication number 20090186425
- Publication date Jul 23, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20070193682
- Publication date Aug 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tatsuo Sasaoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming bumps, semiconductor device and method for manuf...
- Publication number 20050161814
- Publication date Jul 28, 2005
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Head assembly, disk unit, and bonding method and apparatus
- Publication number 20050057856
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Flip chip bonder
- Publication number 20040206800
- Publication date Oct 21, 2004
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit contactor, and method and apparatus for producti...
- Publication number 20030132027
- Publication date Jul 17, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Tools for reworking

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for eutectic bonding

Method for forming bumps, semiconductor device and method for manuf...

Semiconductor device and method of patterning resin insulation laye...

Bonding method and apparatus

Head assembly, disk unit, and bonding method and apparatus

Flip chip bonder

Integrated circuit contactor, and method and apparatus for producti...

Head assembly having integrated circuit chip covered by layer which...

Integrated circuit contactor, and method and apparatus for producti...

Methods of making bondable contacts and a tool for making such cont...

Method of fabricating an electronic circuit device and apparatus fo...

Method of fabricating electronic circuit device and apparatus for p...

Semiconductor integrated circuit device and fabrication method thereof

Method of fabricating electronic circuit device and apparatus for p...

Patents Applicationslast 30 patents

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATE...

APPARATUS FOR EUTECTIC BONDING

Bonded System with Coated Copper Conductor

SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAY...

METHOD FOR FORMING BUMPS, SEMICONDUCTOR DEVICE AND METHOD FOR MANUF...

Bonding method and apparatus

Method for forming bumps, semiconductor device and method for manuf...

Head assembly, disk unit, and bonding method and apparatus

Flip chip bonder

Integrated circuit contactor, and method and apparatus for producti...