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H01L27/11519

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11519Top-view layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,688,682
- Issue date Jun 27, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,682,736
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sense line structures in capacitive sense NAND memory
- Patent number 11,670,379
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,672,114
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Page buffer and memory device including the same
- Patent number 11,670,377
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Se Won Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for converting a floating gate non-volatile memory cell to a...
- Patent number 11,665,915
- Issue date May 30, 2023
- STMICROELECTRONICS INTERNATIONAL N.V.
- Fabio De Santis
- G11 - INFORMATION STORAGE
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 11,665,892
- Issue date May 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and photomask
- Patent number 11,665,898
- Issue date May 30, 2023
- Kioxia Corporation
- Daisuke Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,658,113
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,658,132
- Issue date May 23, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Access operations in capacitive sense NAND memory
- Patent number 11,657,880
- Issue date May 23, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device
- Patent number 11,647,631
- Issue date May 9, 2023
- KIOXIA CORPORATION
- Shota Kashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor storage device
- Patent number 11,646,354
- Issue date May 9, 2023
- Kioxia Corporation
- Shinya Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,641,742
- Issue date May 2, 2023
- Micron Technology, Inc.
- Cole Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,641,738
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Woosung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,637,116
- Issue date Apr 25, 2023
- Kioxia Corporation
- Takuya Inatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,637,125
- Issue date Apr 25, 2023
- Macronix International Co., Ltd.
- Chien-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) semiconductor memory device
- Patent number 11,637,121
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including isolation structures neighboring...
- Patent number 11,637,178
- Issue date Apr 25, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array and method used in forming a memory array comprising s...
- Patent number 11,631,740
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,631,683
- Issue date Apr 18, 2023
- Kioxia Corporation
- Naoya Yoshimura
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device containing composite word lines con...
- Patent number 11,631,695
- Issue date Apr 18, 2023
- SanDisk Technologies LLC
- Rahul Sharangpani
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,631,697
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 11,626,380
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Hyunjun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of manufacturing the same, and...
- Patent number 11,626,498
- Issue date Apr 11, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,626,419
- Issue date Apr 11, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device and method of fabrica...
- Patent number 11,626,417
- Issue date Apr 11, 2023
- Samsung Electronics Co, Ltd.
- Dong-Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,420
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Young-Jin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,626,423
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Xiaosong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Non-volatile Memory Cell
- Publication number 20240179900
- Publication date May 30, 2024
- AMIC Technology Corporation
- Hsiao-Hua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...
- Publication number 20240107758
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107760
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107761
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240098989
- Publication date Mar 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhengliang Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240079057
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240074181
- Publication date Feb 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20240074200
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240074174
- Publication date Feb 29, 2024
- UNITED MICROELECTRONICS CORP.
- Liang Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED STAIRCASE VIA ROUTING FOR MEMORY
- Publication number 20240071902
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071498
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yongjun Jeff Hu
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...
- Publication number 20240074170
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Takashi YUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240071496
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...
- Publication number 20240074171
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A STEPPED PILLAR REGION, AND RELATED...
- Publication number 20240074184
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Masaaki Higuchi
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR ISOLATION DEVICE AND METHOD
- Publication number 20240064976
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Michael Andrew Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057332
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057331
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240029794
- Publication date Jan 25, 2024
- Micron Technology, Inc.
- Lifang Xu
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240029795
- Publication date Jan 25, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICES COMPRISING AN OXIDE FILL REGION, AND RELATED ELE...
- Publication number 20240032294
- Publication date Jan 25, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023329
- Publication date Jan 18, 2024
- SK HYNIX INC.
- Jae Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20240021219
- Publication date Jan 18, 2024
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Application
Control Gate Structures in Three-Dimensional Memory Devices and Met...
- Publication number 20240015961
- Publication date Jan 11, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...
- Publication number 20240015959
- Publication date Jan 11, 2024
- SANDISK TECHNOLOGIES LLC
- Yusuke Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...
- Publication number 20240015960
- Publication date Jan 11, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroaki Namba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...
- Publication number 20240005990
- Publication date Jan 4, 2024
- SANDISK TECHNOLOGIES LLC
- Hirofumi TOKITA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230422498
- Publication date Dec 28, 2023
- KIOXIA Corporation
- Daisuke KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DUMMY STACK EDGE SEAL ST...
- Publication number 20230413551
- Publication date Dec 21, 2023
- SANDISK TECHNOLOGIES LLC
- Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...
- Publication number 20230403850
- Publication date Dec 14, 2023
- SANDISK TECHNOLOGIES LLC
- Fumitaka AMANO
- H01 - BASIC ELECTRIC ELEMENTS

Top-view layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device and manufacturing method of the semicon...

Semiconductor device

Semiconductor device

Sense line structures in capacitive sense NAND memory

Memory arrays and methods used in forming a memory array comprising...

Page buffer and memory device including the same

Method for converting a floating gate non-volatile memory cell to a...

Staircase structure in three-dimensional memory device and method f...

Semiconductor device and photomask

Semiconductor memory device and manufacturing method of the semicon...

Integrated assemblies

Access operations in capacitive sense NAND memory

Semiconductor memory device

Semiconductor device and semiconductor storage device

Memory arrays and methods used in forming a memory array comprising...

Three-dimensional semiconductor memory device

Semiconductor memory device

Memory device

Three-dimensional (3D) semiconductor memory device

Microelectronic devices including isolation structures neighboring...

Memory array and method used in forming a memory array comprising s...

Semiconductor storage device

Three-dimensional memory device containing composite word lines con...

Integrated assemblies having vertically-extending channel material...

Semiconductor package

Semiconductor memory device, method of manufacturing the same, and...

Semiconductor memory device

Three-dimensional semiconductor memory device and method of fabrica...

Semiconductor device

Memory arrays and methods used in forming a memory array comprising...

Patents Applicationslast 30 patents

Non-volatile Memory Cell

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

MEMORY DEVICE

FOLDED STAIRCASE VIA ROUTING FOR MEMORY

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...

Memory Circuitry And Method Used In Forming Memory Circuitry

BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...

ELECTRONIC DEVICES COMPRISING A STEPPED PILLAR REGION, AND RELATED...

SEMICONDUCTOR ISOLATION DEVICE AND METHOD

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

Memory Circuitry And Method Used In Forming Memory Circuitry

Memory Circuitry And Method Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING AN OXIDE FILL REGION, AND RELATED ELE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

Control Gate Structures in Three-Dimensional Memory Devices and Met...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ETCH STOP METAL PLATES F...

THREE-DIMENSIONAL MEMORY DEVICE WITH HIGH CONTACT VIA DENSITY AND M...

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DUMMY STACK EDGE SEAL ST...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE BACKSIDE METAL...