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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/1304
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last 30 patents
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Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method of the same
Patent number
11,967,553
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with isolated heat spreader
Patent number
11,923,281
Issue date
Mar 5, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,916,028
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro device arrangement in donor substrate
Patent number
11,892,497
Issue date
Feb 6, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component, electric device including the same
Patent number
11,877,485
Issue date
Jan 16, 2024
Samsung Display Co., Ltd.
Chung-seok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for heat dissipation
Patent number
11,854,785
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an integrated circuit package including an integra...
Patent number
11,842,955
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with top circuit and an IC with a gap over th...
Patent number
11,837,529
Issue date
Dec 5, 2023
Texas Instruments Incorporated
Barry Jon Male
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked dies and methods for forming bonded structures
Patent number
11,837,596
Issue date
Dec 5, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including a thick metal layer and a bump
Patent number
11,817,408
Issue date
Nov 14, 2023
Samsung Electronics Co., Ltd.
Minjung Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die package and method of forming a die package
Patent number
11,791,255
Issue date
Oct 17, 2023
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
11,791,301
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
11,791,324
Issue date
Oct 17, 2023
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with fan-out structures
Patent number
11,764,159
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,742,279
Issue date
Aug 29, 2023
Rohm Co., Ltd.
Kota Ise
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for bond wave propagation control
Patent number
11,742,321
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
11,742,305
Issue date
Aug 29, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory
Patent number
11,729,973
Issue date
Aug 15, 2023
Kioxia Corporation
Masayoshi Tagami
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of manufacturing semiconductor package structure
Patent number
11,699,694
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low warpage high density trench capacitor
Patent number
11,688,762
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jyun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip
Patent number
11,676,825
Issue date
Jun 13, 2023
Murata Manufacturing Co., Ltd.
Kenichi Shimamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked dies and methods for forming bonded structures
Patent number
11,658,173
Issue date
May 23, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid bonding with through substrate via (TSV)
Patent number
11,658,172
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro device arrangement in donor substrate
Patent number
11,624,770
Issue date
Apr 11, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out structure and method of fabricating the same
Patent number
11,626,296
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
Patent number
11,605,609
Issue date
Mar 14, 2023
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip package manufacturing process
Patent number
11,587,923
Issue date
Feb 21, 2023
EGALAX_EMPIA TECHNOLOGY INC.
Po-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20240145458
Publication date
May 2, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
Publication number
20240133940
Publication date
Apr 25, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...
Publication number
20240096761
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
BARRY JON MALE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
Publication number
20240047390
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Minjung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
Publication number
20240021512
Publication date
Jan 18, 2024
INFINEON TECHNOLOGIES AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20230402336
Publication date
Dec 14, 2023
Fuji Electric Co., Ltd.
Hiroyuki NOGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
Publication number
20230378078
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Low Warpage High Density Trench Capacitor
Publication number
20230361166
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Co. Ltd.
Jyun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
Publication number
20230341456
Publication date
Oct 26, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE
Publication number
20230335457
Publication date
Oct 19, 2023
BYD SEMICONDUCTOR COMPANY LIMITED
Shoucao SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE
Publication number
20230335472
Publication date
Oct 19, 2023
Hitachi Energy Switzerland AG
Juergen SCHUDERER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
Publication number
20230154876
Publication date
May 18, 2023
Samsung Electronics Co., Ltd.
Minjung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20230131849
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20230130580
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
Publication number
20230098830
Publication date
Mar 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230092229
Publication date
Mar 23, 2023
Kabushiki Kaisha Toshiba
Tomohiro IGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
Publication number
20220418104
Publication date
Dec 29, 2022
Xerox Corporation
Naveen CHOPRA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
Publication number
20220399262
Publication date
Dec 15, 2022
INFINEON TECHNOLOGIES AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
Publication number
20220344273
Publication date
Oct 27, 2022
Intel Corporation
Toshihiro TOMITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
Publication number
20220302060
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Anhao CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
Publication number
20220238424
Publication date
Jul 28, 2022
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20220216146
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing company Ltd.
MING-FA CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...
Publication number
20220208657
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
BARRY JON MALE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP PACKAGE MANUFACTURING PROCESS
Publication number
20220028851
Publication date
Jan 27, 2022
EGALAX_EMPIA TECHNOLOGY INC.
Po-Chuan LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
Publication number
20220020709
Publication date
Jan 20, 2022
NVIDIA Corporation
Yuanjing Jane Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20210343666
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
Publication number
20210320069
Publication date
Oct 14, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
Publication number
20210280541
Publication date
Sep 9, 2021
Samsung Electronics Co., Ltd.
Minjung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE WITH A PROGRAMMABLE C...
Publication number
20210265476
Publication date
Aug 26, 2021
NANYA TECHNOLOGY CORPORATION
CHIN-LING HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
Publication number
20210202357
Publication date
Jul 1, 2021
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS