Translational mechanism

Industry

CPC
H01L2224/75824

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75824Translational mechanism

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond head apparatus with die holder motion table
- Patent number 11,776,930
- Issue date Oct 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chung Sheung Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
- Patent number 11,515,283
- Issue date Nov 29, 2022
- Samsung Display Co., Ltd.
- Chung-Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonder
- Patent number 11,367,702
- Issue date Jun 21, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component handling device for removing components from a structured...
- Patent number 11,232,961
- Issue date Jan 25, 2022
- Muehlbauer GmbH & Co. KG
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,062,923
- Issue date Jul 13, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component handling system
- Patent number 10,804,123
- Issue date Oct 13, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically die-stacked bonder and method using the same
- Patent number 10,643,968
- Issue date May 5, 2020
- GALLANT MICRO. MACHNING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Receiving system for components
- Patent number 10,529,601
- Issue date Jan 7, 2020
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component handling unit
- Patent number 10,497,590
- Issue date Dec 3, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mounting apparatus
- Patent number 10,477,697
- Issue date Nov 12, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 10,468,373
- Issue date Nov 5, 2019
- Kulicke and Sofia Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
- Publication number 20230031977
- Publication date Feb 2, 2023
- Disco Corporation
- Hiromitsu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220415845
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Alexander DZHANGIROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20210343558
- Publication date Nov 4, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE
- Publication number 20210183809
- Publication date Jun 17, 2021
- ASM Technology Singapore Pte Ltd
- Chung Sheung YUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...
- Publication number 20200373276
- Publication date Nov 26, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chung-Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20200105551
- Publication date Apr 2, 2020
- Rohinni, LLC.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...
- Publication number 20200035521
- Publication date Jan 30, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDER
- Publication number 20190393185
- Publication date Dec 26, 2019
- TAZMO CO., LTD.
- Masaaki TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HANDLING UNIT
- Publication number 20190006211
- Publication date Jan 3, 2019
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT HANDLING SYSTEM
- Publication number 20180308727
- Publication date Oct 25, 2018
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20180174997
- Publication date Jun 21, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Translational mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Die bonding for chip conveying apparatus

Die bond head apparatus with die holder motion table

Apparatus to control transfer parameters during transfer of semicon...

Systems for direct transfer of semiconductor device die

Flexible circuit film bonding apparatus and method of bonding flexi...

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Chip bonding apparatus

Bonder

Component handling device for removing components from a structured...

Method for improved transfer of semiconductor die

Apparatus to control transfer parameters during transfer of semicon...

Semiconductor element bonding apparatus and semiconductor element b...

Apparatus for direct transfer of semiconductor device die

Component handling system

Mounting Method of a semiconductor device using a colored auxiliary...

Vertically die-stacked bonder and method using the same

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Electronic-component mounting apparatus

Apparatus for direct transfer of semiconductor device die

Receiving system for components

Electronic component handling unit

Apparatus and method for direct transfer of semiconductor devices

Sintering device

Mounting apparatus

Bonding machines for bonding semiconductor elements, methods of ope...

Patents Applicationslast 30 patents

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

CHIP CONVEYING APPARATUS AND DIE BONDER

MOUNTING APPARATUS

BONDING APPARATUS AND BONDING METHOD

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

Actuator for a Bonding Head

DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE

FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

DIE BONDING APPARATUS AND DIE BONDING METHOD

SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...

BONDER

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

Hybrid Bonding Systems and Methods for Semiconductor Wafers

ELECTRONIC COMPONENT HANDLING UNIT

COMPONENT HANDLING SYSTEM

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

DIE BONDING APPARATUS AND DIE BONDING METHOD

Hybrid Bonding Systems and Methods for Semiconductor Wafers