Treating holes after another process

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CPC
H05K2203/1438

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1438Treating holes after another process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,956,897
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,399,429
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,811,210
- Issue date Oct 20, 2020
- Sanmina Corporation
- Shinichi Iketani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,687,419
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,446,356
- Issue date Oct 15, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuses with integrated metals
- Patent number 10,276,337
- Issue date Apr 30, 2019
- Littelfuse, Inc.
- Michael Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming vias on printed circuit boards
- Patent number 9,999,137
- Issue date Jun 12, 2018
- Intrinsiq Materials, Inc.
- David Ciufo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission board and method for manufacturing the same
- Patent number 9,706,656
- Issue date Jul 11, 2017
- Industrial Technology Research Institute
- Chien-Min Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impact absorption member and display device including the same
- Patent number 9,370,112
- Issue date Jun 14, 2016
- Samsung Display Co., Ltd.
- Jae-Chun Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 8,240,033
- Issue date Aug 14, 2012
- Imbera Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,459,202
- Issue date Dec 2, 2008
- Motorola, Inc.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board and a method for making the same
- Patent number 6,838,623
- Issue date Jan 4, 2005
- Visteon Global Technologies, Inc.
- Lawrence Kneisel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for creating a connection within a multilayer circuit board...
- Patent number 6,612,025
- Issue date Sep 2, 2003
- Visteon Global Tech., Inc.
- Zhong-You (Joe) Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, substrate for a semiconductor device, method...
- Patent number 6,586,274
- Issue date Jul 1, 2003
- Seiko Epson Corporation
- Akihiro Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board and a method for making the same
- Patent number 6,501,031
- Issue date Dec 31, 2002
- Visteon Global Tech., Inc.
- Andrew Z. Glovatsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board and a method for making the same
- Patent number 6,495,053
- Issue date Dec 17, 2002
- Visteon Global Tech, Inc.
- Lawrence Leroy Kneisel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate including a metal portion and a resin portion
- Patent number 6,400,010
- Issue date Jun 4, 2002
- Seiko Epson Corporation
- Akihiro Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a printed circuit board
- Patent number 6,378,201
- Issue date Apr 30, 2002
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for electrical devices having RF components,...
- Patent number 6,370,034
- Issue date Apr 9, 2002
- Siemens Aktiengesellschaft
- Georg Busch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating double sided ceramic circuit boards using a...
- Patent number 6,286,204
- Issue date Sep 11, 2001
- Sarnoff Corporation
- Attiganal Narayanaswamy Sreeram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and printed circuit board base material
- Patent number 6,013,588
- Issue date Jan 11, 2000
- O.K Print Corporation
- Yosuke Ozaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for providing a selective reference layer isolation techniqu...
- Patent number 5,863,447
- Issue date Jan 26, 1999
- International Business Machines Corporation
- Paul William Coteus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level circuit card structure
- Patent number 5,786,986
- Issue date Jul 28, 1998
- International Business Machines Corporation
- Mark Fielding Bregman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical feedthroughs for ceramic circuit board support substrates
- Patent number 5,681,444
- Issue date Oct 28, 1997
- David Sarnoff Research Center, Inc.
- Thomas Peter Azzaro
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Process for making electrical feedthroughs for ceramic circuit boar...
- Patent number 5,653,834
- Issue date Aug 5, 1997
- David Sarnoff Research Center, Inc.
- Thomas Peter Azzaro
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Electrical feedthroughs for ceramic circuit board support substrates
- Patent number 5,565,262
- Issue date Oct 15, 1996
- David Sarnoff Research Center, Inc.
- Thomas P. Azzaro
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multilayer printed circuit board and method for fabricating same
- Patent number 5,451,721
- Issue date Sep 19, 1995
- International Business Machines Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240260181
- Publication date Aug 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220361326
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
- Publication number 20210112669
- Publication date Apr 15, 2021
- National Taiwan University of Science and Technology
- CHIH-WEI CHIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200296827
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20200043690
- Publication date Feb 6, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
- Publication number 20190208643
- Publication date Jul 4, 2019
- Intel Corporation
- Tin Poay CHUAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180359853
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20180160525
- Publication date Jun 7, 2018
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki SATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140029173
- Publication date Jan 30, 2014
- Jae-Chun PARK
- G02 - OPTICS
Information Patent Application
Layered ceramic electronic component and manufacturing method therefor
- Publication number 20100038120
- Publication date Feb 18, 2010
- TDK Corporation
- Tatsuya Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Circuit Board And Method Of Fabricating The Same
- Publication number 20090000808
- Publication date Jan 1, 2009
- Te-Sheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Circuit Board Structure, and a Circuit B...
- Publication number 20080196930
- Publication date Aug 21, 2008
- IMBERA ELECTRONICS OY
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20080003414
- Publication date Jan 3, 2008
- MOTOROLA, INC.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical circuit board and a method for making the same
- Publication number 20030102152
- Publication date Jun 5, 2003
- Lawrence Leroy Kneisel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, substrate for a semiconductor device, method...
- Publication number 20020030266
- Publication date Mar 14, 2002
- SEIKO EPSON CORPORATION
- Akihiro Murata
- H01 - BASIC ELECTRIC ELEMENTS

Treating holes after another process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Semiconductor package device and method of manufacturing the same

Semiconductor package device

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Multilayer printed circuit board via hole registration and accuracy

Semiconductor package device and method of manufacturing the same

Multilayer printed circuit board via hole registration and accuracy

Fuses with integrated metals

Method for forming vias on printed circuit boards

Signal transmission board and method for manufacturing the same

Impact absorption member and display device including the same

Method for manufacturing a circuit board

Printed circuit board

Electrical circuit board and a method for making the same

Method for creating a connection within a multilayer circuit board...

Semiconductor device, substrate for a semiconductor device, method...

Electrical circuit board and a method for making the same

Electrical circuit board and a method for making the same

Substrate including a metal portion and a resin portion

Method for making a printed circuit board

Printed circuit board for electrical devices having RF components,...

Method for fabricating double sided ceramic circuit boards using a...

Printed circuit board and printed circuit board base material

Method for providing a selective reference layer isolation techniqu...

Multi-level circuit card structure

Electrical feedthroughs for ceramic circuit board support substrates

Process for making electrical feedthroughs for ceramic circuit boar...

Electrical feedthroughs for ceramic circuit board support substrates

Multilayer printed circuit board and method for fabricating same

Patents Applicationslast 30 patents

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD DEVICE

IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

Layered ceramic electronic component and manufacturing method therefor

Flexible Printed Circuit Board And Method Of Fabricating The Same

Method for Manufacturing a Circuit Board Structure, and a Circuit B...

PRINTED CIRCUIT BOARD

Electrical circuit board and a method for making the same

Semiconductor device, substrate for a semiconductor device, method...