treatment by exposure to a gas or vapour

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H01L21/02337

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02337treatment by exposure to a gas or vapour

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Carbon film deposition method and deposition apparatus
- Patent number 12,217,956
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Yosuke Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 12,176,206
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide layer for oxidation resistance and method forming same
- Patent number 12,148,652
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate
- Patent number 12,125,717
- Issue date Oct 22, 2024
- Semes Co., Ltd.
- Ki Sang Eum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for finFET well doping
- Patent number 12,112,975
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,087,598
- Issue date Sep 10, 2024
- Kokusai Electric Corporation
- Hideto Tateno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,057,342
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions and methods using same for deposition of silicon-conta...
- Patent number 12,049,695
- Issue date Jul 30, 2024
- VERSUM MATERIALS US, LLC
- Raymond Nicholas Vrtis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate
- Patent number 12,024,777
- Issue date Jul 2, 2024
- Wonik IPS Co., Ltd.
- Dae Seong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abatement system, abatement device, and system control device
- Patent number 12,007,744
- Issue date Jun 11, 2024
- Edwards Japan Limited
- Kobayashi Kenichiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for deposition of low-k films
- Patent number 11,990,332
- Issue date May 21, 2024
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Purge ring for pedestal assembly
- Patent number 11,976,363
- Issue date May 7, 2024
- Applied Materials, Inc.
- Muhannad Mustafa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing low-K gate spacer
- Patent number 11,948,841
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,901,437
- Issue date Feb 13, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,887,861
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Jaewon Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method and non...
- Patent number 11,869,764
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Akinori Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and display device including the same
- Patent number 11,862,454
- Issue date Jan 2, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation features and methods of fabricating the same
- Patent number 11,843,028
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- I-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure with high aspect ratio
- Patent number 11,823,960
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and methods using same for carbon doped silicon contain...
- Patent number 11,742,200
- Issue date Aug 29, 2023
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanism for FinFET well doping
- Patent number 11,742,237
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method
- Patent number 11,735,430
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,735,412
- Issue date Aug 22, 2023
- Kokusai Electric Corporation
- Atsushi Sano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Varying temperature anneal for film and structures formed thereby
- Patent number 11,715,637
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,688,647
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bwo-Ning Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing high-density, nitrogen-doped carbon films for...
- Patent number 11,664,214
- Issue date May 30, 2023
- Applied Materials, Inc.
- Jui-Yuan Hsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Strain enhancement for FinFETs
- Patent number 11,626,328
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 11,615,984
- Issue date Mar 28, 2023
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor device and methods of fabr...
- Patent number 11,610,841
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME
- Publication number 20240387238
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20240387187
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICALLY ETCHING A TARGET LAYER
- Publication number 20240363358
- Publication date Oct 31, 2024
- ASM IP HOLDING B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material For Forming Organic Film, Substrate For Manufacturing Semi...
- Publication number 20240363335
- Publication date Oct 31, 2024
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20240304438
- Publication date Sep 12, 2024
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH DEPOSITED GATE DIELECTRIC LAYERS
- Publication number 20240290879
- Publication date Aug 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC DENSIFICATION
- Publication number 20240266166
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPITAXIAL NITRIDE FERROELECTRONICS
- Publication number 20240242963
- Publication date Jul 18, 2024
- The Regents of the University of Michigan
- Zetian Mi
- C30 - CRYSTAL GROWTH
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240234133
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Steven C. H. HUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING THIN FILM USING MATERIAL OF CHEMICAL PURGE
- Publication number 20240194481
- Publication date Jun 13, 2024
- EGTM Co., Ltd.
- Kyu Ho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, GAS SUPPLY METHOD, SU...
- Publication number 20240177991
- Publication date May 30, 2024
- Kokusai Electric Corporation
- Yukinori ABURATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE
- Publication number 20240177992
- Publication date May 30, 2024
- ASM IP HOLDING B.V.
- Andrea Illiberi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240154026
- Publication date May 9, 2024
- Marlin Semiconductor Limited
- Te-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240154041
- Publication date May 9, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ETCHING OF RUTHENIUM
- Publication number 20240153781
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Hisashi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...
- Publication number 20240096615
- Publication date Mar 21, 2024
- Kokusai Electric Corporation
- Akinori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Volume-less Fluorine Incorporation Method
- Publication number 20240071767
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsueh-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS
- Publication number 20240071817
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION FOR SUB 20 NM PITCH EUV PATTERNING
- Publication number 20240055255
- Publication date Feb 15, 2024
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230411343
- Publication date Dec 21, 2023
- United Microelectronics Corp.
- Sheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...
- Publication number 20230377874
- Publication date Nov 23, 2023
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20230377898
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230343580
- Publication date Oct 26, 2023
- Kokusai Electric Corporation
- Atsushi SANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Mechanism for FinFET Well Doping
- Publication number 20230343634
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230326977
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Koji AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Varying Temperature Anneal for Film and Structures Formed Thereby
- Publication number 20230317448
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MODIFYING INSULATING FILM AND METHOD FOR MANUFACTURING S...
- Publication number 20230317832
- Publication date Oct 5, 2023
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

treatment by exposure to a gas or vapour

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Carbon film deposition method and deposition apparatus

Varying temperature anneal for film and structures formed thereby

Silicon oxide layer for oxidation resistance and method forming same

Apparatus for treating substrate

Mechanism for finFET well doping

Substrate processing apparatus

Semiconductor device and method

Compositions and methods using same for deposition of silicon-conta...

Method of dielectric material fill and treatment

Method of processing substrate

Abatement system, abatement device, and system control device

Methods and apparatus for deposition of low-k films

Purge ring for pedestal assembly

Forming nitrogen-containing low-K gate spacer

Semiconductor device and method for fabricating the same

Substrate processing method and substrate processing apparatus

Substrate processing apparatus, substrate processing method and non...

Semiconductor device and display device including the same

Isolation features and methods of fabricating the same

Method for forming semiconductor structure with high aspect ratio

Composition and methods using same for carbon doped silicon contain...

Mechanism for FinFET well doping

Fin field-effect transistor device and method

Method of manufacturing semiconductor device, substrate processing...

Varying temperature anneal for film and structures formed thereby

Semiconductor device and method for manufacturing the same

Methods for producing high-density, nitrogen-doped carbon films for...

Strain enhancement for FinFETs

Method of dielectric material fill and treatment

Interconnect structure for semiconductor device and methods of fabr...

Patents Applicationslast 30 patents

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

Semiconductor Device and Method

SILICON OXIDE LAYER FOR OXIDATION RESISTANCE AND METHOD FORMING SAME

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

METHODS FOR CHEMICALLY ETCHING A TARGET LAYER

Material For Forming Organic Film, Substrate For Manufacturing Semi...

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

FIELD-EFFECT TRANSISTORS WITH DEPOSITED GATE DIELECTRIC LAYERS

DIELECTRIC DENSIFICATION

EPITAXIAL NITRIDE FERROELECTRONICS

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

METHOD OF FORMING THIN FILM USING MATERIAL OF CHEMICAL PURGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, GAS SUPPLY METHOD, SU...

METHOD OF FORMING AN ORGANIC POLYMER COMPRISING POLYIMIDE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SAME

THERMAL ETCHING OF RUTHENIUM

SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITO...

Volume-less Fluorine Incorporation Method

ADHESION IMPROVEMENT BETWEEN LOW-K MATERIALS AND CAP LAYERS

SELECTIVE DEPOSITION FOR SUB 20 NM PITCH EUV PATTERNING

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

COMPOSITION AND METHODS USING SAME FOR CARBON DOPED SILICON CONTAIN...

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Mechanism for FinFET Well Doping

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Varying Temperature Anneal for Film and Structures Formed Thereby

METHOD FOR MODIFYING INSULATING FILM AND METHOD FOR MANUFACTURING S...