Treatments involving charged particles

Industry

CPC
H05K2203/09

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/09Treatments involving charged particles

Industries

Patents Grantslast 30 patents

Information Patent Grant
Plasma treatments for flexures of hard disk drives
- Patent number 12,129,567
- Issue date Oct 29, 2024
- Hutchinson Technology Incorporated
- Kurt F. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Base material for printed circuit board and method of manufacturing...
- Patent number 12,016,132
- Issue date Jun 18, 2024
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma ashing for coated devices
- Patent number 11,849,543
- Issue date Dec 19, 2023
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective coating
- Patent number 11,786,930
- Issue date Oct 17, 2023
- Shailendra Vikram Singh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrostatic trap mass spectrometer with improved ion injection
- Patent number 11,742,192
- Issue date Aug 29, 2023
- Leco Corporation
- Anatoly N. Verenchikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit electrode array and method of manufacturing the same
- Patent number 11,627,664
- Issue date Apr 11, 2023
- Cortigent, Inc.
- Robert Jay Greenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective coating for electrical components and method of making t...
- Patent number 11,589,464
- Issue date Feb 21, 2023
- Hamilton Sundstrand Corporation
- Haralambos Cordatos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,570,907
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam lithography method based on ion beam lithography system
- Patent number 11,538,653
- Issue date Dec 27, 2022
- Beijing Normal University
- Bin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wiring substrate
- Patent number 11,510,320
- Issue date Nov 22, 2022
- Ulvac, Inc.
- Muneyuki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Method and equipment for the treatment of panels
- Patent number 11,483,933
- Issue date Oct 25, 2022
- WISE S.R.L.
- Massimo Fiorani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing water resistant printed circuit board
- Patent number 11,439,024
- Issue date Sep 6, 2022
- Steering Solutions IP Holding Corporation
- Shawn M. Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer coatings and methods for depositing polymer coatings
- Patent number 11,419,220
- Issue date Aug 16, 2022
- Europlasma NV
- Samir Loulidi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition comprising directly written metal features and method o...
- Patent number 11,230,132
- Issue date Jan 25, 2022
- Case Western Reserve University
- Christopher J. Miller
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thin film transistor, display panel and fabricating method thereof
- Patent number 11,233,153
- Issue date Jan 25, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Huafei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing flexible printed circuit...
- Patent number 11,178,754
- Issue date Nov 16, 2021
- Samsung Display Co., Ltd.
- Wi Jin Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-production substrate modification with FIB deposition
- Patent number 11,139,217
- Issue date Oct 5, 2021
- BAE Systems Information and Electronic Systems Integration Inc.
- Jeffrey A. Zimmerman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 11,129,277
- Issue date Sep 21, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,096,289
- Issue date Aug 17, 2021
- Samsung Display Co. Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal coating of objects using plasma polymerisation pretreatment
- Patent number 10,934,617
- Issue date Mar 2, 2021
- Cuptronic Technology Ltd.
- Sven Göthe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface polymer coatings
- Patent number 10,923,330
- Issue date Feb 16, 2021
- Europlasma NV
- Filip Legein
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Decapsulation of electronic devices
- Patent number 10,879,079
- Issue date Dec 29, 2020
- JIACO Instruments Holding B.V.
- Jiaqi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RIDING LAWN MOWER
- Publication number 20240172588
- Publication date May 30, 2024
- Nanjing Chervon Industry Co., Ltd.
- Zhen Wang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
- Publication number 20240164016
- Publication date May 16, 2024
- Aviv Mordechai RONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES
- Publication number 20240138061
- Publication date Apr 25, 2024
- Saudi Arabian Oil Company
- Sahil P. Wankhede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240128093
- Publication date Apr 18, 2024
- ASUSTek COMPUTER INC.
- Xu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240057253
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Sang Myung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...
- Publication number 20230383030
- Publication date Nov 30, 2023
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20230309244
- Publication date Sep 28, 2023
- IBIDEN CO., LTD.
- Atsushi ISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230164925
- Publication date May 25, 2023
- IBIDEN CO., LTD.
- Katsuhiko TANNO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...
- Publication number 20230120298
- Publication date Apr 20, 2023
- Heraeus Deutschland GmbH & Co. KG
- Alan Paul STADNIK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20230073563
- Publication date Mar 9, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE
- Publication number 20220399192
- Publication date Dec 15, 2022
- Hanwha Corporation
- Su Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR...
- Publication number 20220330436
- Publication date Oct 13, 2022
- PROTEC CO., LTD.
- Seung Min HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND...
- Publication number 20220304163
- Publication date Sep 22, 2022
- AJINOMOTO CO., INC.
- Habib HICHRI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROTECTIVE COATING FOR ELECTRICAL COMPONENTS AND METHOD OF MAKING T...
- Publication number 20220201869
- Publication date Jun 23, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Haralambos Cordatos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20220151081
- Publication date May 12, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20220046803
- Publication date Feb 10, 2022
- HZO, Inc.
- Andrew Simon Hall Brooks
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220046806
- Publication date Feb 10, 2022
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WATER RESISTANT PRINTED CIRCUIT BOARD
- Publication number 20220022324
- Publication date Jan 20, 2022
- STEERING SOLUTIONS IP HOLDING CORPORATION
- Shawn M. Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE
- Publication number 20210368632
- Publication date Nov 25, 2021
- P2i Ltd.
- Stephen Richard COULSON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20210368622
- Publication date Nov 25, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...
- Publication number 20210345497
- Publication date Nov 4, 2021
- Samsung Display Co. Ltd.
- Jun Hee LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIDING LAWN MOWER
- Publication number 20210329836
- Publication date Oct 28, 2021
- Nanjing Chervon Industry Co., Ltd.
- Zhen Wang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...
- Publication number 20210136922
- Publication date May 6, 2021
- SHENZHEN DANBOND TECHNOLOGY CO., LTD
- Ping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Ashing for Coated Devices
- Publication number 20210127497
- Publication date Apr 29, 2021
- HZO, Inc.
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...
- Publication number 20210074595
- Publication date Mar 11, 2021
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey A. Zimmerman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...
- Publication number 20210014978
- Publication date Jan 14, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treatments involving charged particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma treatments for flexures of hard disk drives

Resilient micro lattice electrical interconnection assembly

Base material for printed circuit board and method of manufacturing...

Redistribution plate

Single-layer circuit board, multi-layer circuit board, and manufact...

Plasma ashing for coated devices

Protective coating

Electrostatic trap mass spectrometer with improved ion injection

Flexible circuit electrode array and method of manufacturing the same

Protective coating for electrical components and method of making t...

Manufacturing apparatus for display device and method of using the...

Ion beam lithography method based on ion beam lithography system

Circuit board structure and manufacturing method thereof

Method of processing wiring substrate

Redistribution plate

Method and equipment for the treatment of panels

Method for manufacturing water resistant printed circuit board

Polymer coatings and methods for depositing polymer coatings

Single-layer circuit board, multi-layer circuit board, and manufact...

Composition comprising directly written metal features and method o...

Thin film transistor, display panel and fabricating method thereof

Display device and method of manufacturing flexible printed circuit...

Post-production substrate modification with FIB deposition

Resilient micro lattice electrical interconnection assembly

Manufacturing apparatus for display device and method of using the...

Single-layer circuit board, multi-layer circuit board, and manufact...

Metal coating of objects using plasma polymerisation pretreatment

Surface polymer coatings

Structure, wiring board, substrate for wiring board, copper clad la...

Decapsulation of electronic devices

Patents Applicationslast 30 patents

RIDING LAWN MOWER

SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES

MANUFACTURING METHOD OF ELECTRONIC DEVICE

CIRCUIT BOARD

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...

PRODUCING METHOD OF WIRED CIRCUIT BOARD

REDISTRIBUTION PLATE

SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR...

METHOD FOR MAKING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND...

PROTECTIVE COATING FOR ELECTRICAL COMPONENTS AND METHOD OF MAKING T...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

COATED ELECTRICAL ASSEMBLY

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WATER RESISTANT PRINTED CIRCUIT BOARD

METHOD FOR FORMING A COATING ON AN ELECTRONIC OR ELECTRICAL DEVICE

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...

RIDING LAWN MOWER

ULTRAMICRO CIRCUIT BOARD BASED ON ULTRATHIN ADHESIVELESS FLEXIBLE C...

Plasma Ashing for Coated Devices

POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING...