Two-layer arrangements

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H01L2224/05082

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05082Two-layer arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,159,882
- Issue date Dec 3, 2024
- KYOCERA Coporation
- Hiroaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,119,314
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi Kimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor structure
- Patent number 12,009,324
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bonded substrates
- Patent number 12,002,777
- Issue date Jun 4, 2024
- Kioxia Corporation
- Kotaro Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFT array substrate and display panel including the same
- Patent number 11,978,743
- Issue date May 7, 2024
- Everdisplay Optronics (Shanghai) Co., Ltd
- Keitaro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of providing the same
- Patent number 11,950,467
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRUCTURE FOR BOND PAD
- Publication number 20240387424
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Julie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
- Publication number 20240321927
- Publication date Sep 26, 2024
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304576
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Yuya KIYOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...
- Publication number 20240304648
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
- Publication number 20240282726
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...
- Publication number 20240222315
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD
- Publication number 20240194623
- Publication date Jun 13, 2024
- TDK Electronics AG
- Mehrdad Shayganpoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT
- Publication number 20240178165
- Publication date May 30, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ranjan RAJOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162343
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Yuji ENARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120304
- Publication date Apr 11, 2024
- Innolux Corporation
- Tzu-Sheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240096853
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Two-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Light emitting diode and display apparatus having the same

Display device

Integrated chip for standard logic performance improvement having a...

Method of fabricating a semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Split RDL connection between die and UBM

High reliability lead-free solder alloys for harsh environment elec...

Methods and devices for fabricating and assembling printable semico...

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor structure and method for forming semiconductor structure

Semiconductor device with composite conductive features and method...

Semiconductor device with bonded substrates

Packaged die and RDL with bonding structures therebetween

Interposer, method for fabricating the same, and semiconductor pack...

TFT array substrate and display panel including the same

Semiconductor device

Display device and method of providing the same

Semiconductor device with thermal release layer and method for fabr...

Semiconductor structure having polygonal bonding pad

Silicon photonic interposer with two metal redistribution layers

Display device

Contact pad for semiconductor device

Multi-metal contact structure

Bond pad layout including floating conductive sections

Semiconductor device having a metallization structure

Semiconductor device and method of manufacturing the same

Conductive barrier direct hybrid bonding

Connector structure and method of forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

FILM STRUCTURE FOR BOND PAD

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

Lead-Free Solder Ball

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SILICON CARBIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...

ALLOY FOR METAL UNDERCUT REDUCTION

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

DIRECTLY BONDED METAL STRUCTURES HAVING ALUMINUM FEATURES AND METHO...

MULTI-METAL CONTACT STRUCTURE

METALLIZED SEMICONDUCTOR DIE AND MANUFACTURING METHOD

STRUCTURE WITH COPPER BOND PAD AND COPPER INTERCONNECT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

Method for Fabricating a Power Semiconductor Device