Two-layer arrangements

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H01L2224/13082

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13082Two-layer arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 12,315,834
- Issue date May 27, 2025
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neutral pH copper plating solution for undercut reduction
- Patent number 12,312,703
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and package structure
- Patent number 12,300,652
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
- Patent number 12,293,983
- Issue date May 6, 2025
- DIC Corporation
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,237,282
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Huan Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 12,218,026
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members for die attach in flip chip packages
- Patent number 12,100,678
- Issue date Sep 24, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
- Publication number 20250239500
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-SHELL BALL GRID ARRAY MATERIALS FOR LARGE FORM FACTOR INTEGRAT...
- Publication number 20250218992
- Publication date Jul 3, 2025
- Intel Corporation
- Rui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE
- Publication number 20250210561
- Publication date Jun 26, 2025
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192083
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174585
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250176104
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENTS WITH WETTABLE FLANKS
- Publication number 20250174588
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167056
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20250157876
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250157981
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Naohiro OGUSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149490
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132275
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH DIELECTRIC LAYER HAVING SELECTIVELY IMPLANT...
- Publication number 20250105171
- Publication date Mar 27, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE
- Publication number 20250096177
- Publication date Mar 20, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Two-layer arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electroplated indium bump stacks for cryogenic electronics

Neutral pH copper plating solution for undercut reduction

Semiconductor die with tapered sidewall in package

Substrate and package structure

Conductive pillar, method for manufacturing the same, and method fo...

Semiconductor packages and methods of forming same

Substrate bonding method

Electronic devices in semiconductor package cavities

Wire bond wires for interference shielding

Integrated circuit package and method of forming same

Semiconductor device and method of forming the same

Chip package structure having molding layer

Semiconductor package and method of forming the same

Package structure for heat dissipation

Semiconductor package with intermetallic-compound solder-joint comp...

Microwave integrated quantum circuits with cap wafers and their met...

Fine pitch copper pillar package and method

Pre-molded leadframes in semiconductor devices

Leadframes in semiconductor devices

Semiconductor device

Low cost package warpage solution

Logic drive with brain-like elasticity and integrality based on sta...

Single-shot encapsulation

Semiconductor device assembly with die support structures

Display device and method for fabricating the same

Semiconductor device and method of manufacturing semiconductor device

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Conductive members for die attach in flip chip packages

Semiconductor device assembly with surface-mount die support struct...

Bump structure having a side recess and semiconductor structure inc...

Patents Applicationslast 30 patents

LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING

Semiconductor Packages and Methods of Forming Same

Semiconductor Device and Method of Making a Molded IPD-CoW

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CORE-SHELL BALL GRID ARRAY MATERIALS FOR LARGE FORM FACTOR INTEGRAT...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

BONDED STRUCTURE

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS WITH WETTABLE FLANKS

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE FOR HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

INTEGRATED CIRCUIT WITH DIELECTRIC LAYER HAVING SELECTIVELY IMPLANT...

DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE

LOW COST PACKAGE WARPAGE SOLUTION