Ultrasonic bonding

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H01L2224/81205

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81205Ultrasonic bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component
- Patent number 11,817,846
- Issue date Nov 14, 2023
- Murata Manufacturing Co., Ltd.
- Yasuaki Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method for same
- Patent number 11,776,943
- Issue date Oct 3, 2023
- Samsung Display Co., Ltd.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,694,990
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,616,042
- Issue date Mar 28, 2023
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 11,552,044
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G02 - OPTICS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 11,527,507
- Issue date Dec 13, 2022
- Intel Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 11,515,275
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,489,138
- Issue date Nov 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass interposer module, imaging device, and electronic apparatus
- Patent number 11,410,896
- Issue date Aug 9, 2022
- Sony Corporation
- Mitsuo Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,967
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,205,633
- Issue date Dec 21, 2021
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Display device
- Patent number 11,031,446
- Issue date Jun 8, 2021
- Samsung Display Co., Ltd.
- Jung Yun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 10,923,453
- Issue date Feb 16, 2021
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,886,348
- Issue date Jan 5, 2021
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with high integration microelectronic dice...
- Patent number 10,872,881
- Issue date Dec 22, 2020
- Intel IP Corporation
- Richard Patten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,847,746
- Issue date Nov 24, 2020
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having individual wrapping of electronic package...
- Patent number 10,797,034
- Issue date Oct 6, 2020
- Gio Optoelectronics Corp.
- Chin-Tang Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...
- Publication number 20240145428
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- KAZUHIDE TERAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...
- Publication number 20240113068
- Publication date Apr 4, 2024
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20230225055
- Publication date Jul 13, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20230086535
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220328451
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME
- Publication number 20220013517
- Publication date Jan 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- HYUN A LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210391297
- Publication date Dec 16, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20210313291
- Publication date Oct 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...
- Publication number 20210098414
- Publication date Apr 1, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210074948
- Publication date Mar 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210043600
- Publication date Feb 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...
- Publication number 20210035950
- Publication date Feb 4, 2021
- Intel IP Corporation
- Richard PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...
- Publication number 20200219844
- Publication date Jul 9, 2020
- Intel IP Corporation
- Richard PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190348487
- Publication date Nov 14, 2019
- SAMSUNG DISPLAY CO., LTD.
- Byoung Yong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190348485
- Publication date Nov 14, 2019
- SAMSUNG DISPLAY CO., LTD.
- Jung Yun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190333978
- Publication date Oct 31, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD FOR USING THE SAME
- Publication number 20190198476
- Publication date Jun 27, 2019
- Samsung Display Co. Ltd.
- Byoung Yong KIM
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190035762
- Publication date Jan 31, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device

Electronic component

Circuit board structure and method for manufacturing a circuit boar...

Display panel and manufacturing method for same

Display device and method of manufacturing the same

Methods of bonding of semiconductor elements to substrates, and rel...

Systems for direct transfer of semiconductor device die

Bonding apparatus and method for using the same

Method and apparatus for embedding semiconductor devices

Microelectronic packages with high integration microelectronic dice...

Copper wire bond on gold bump on semiconductor die bond pad

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Display device

Chip integration module, chip package structure, and chip integrati...

Glass interposer module, imaging device, and electronic apparatus

Display device and method of manufacturing the same

Method for fabricating a semiconductor flip-chip package

Systems and methods for bonding semiconductor elements

Methods of bonding of semiconductor elements to substrates, and rel...

Method for improved transfer of semiconductor die

Circuit board structure and method for manufacturing a circuit boar...

Device-bonded body, image pickup module, endoscope and method for m...

Display device

Bonding apparatus and method for using the same

Apparatus for direct transfer of semiconductor device die

Display device

Microelectronic packages with high integration microelectronic dice...

Display device

Electronic device having individual wrapping of electronic package...

Patents Applicationslast 30 patents

FLIP CONNECTION STRUCTURE, ROOM-TEMPERATURE FLIP CONNECTION STRUCTU...

ULTRAFINE-PITCH ALL-COPPER INTERCONNECT STRUCTURE AND FORMING METHO...

ELECTRONIC MODULE

COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

DISPLAY PANEL AND MANUFACTURING METHOD FOR SAME

Circuit board structure and method for manufacturing a circuit boar...

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD

METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND REL...

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...

Method for Fabricating a Semiconductor Flip-Chip Package

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE...

Apparatus and Method for Direct Transfer of Semiconductor Devices

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

DISPLAY DEVICE

DISPLAY DEVICE

DISPLAY DEVICE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

BONDING APPARATUS AND METHOD FOR USING THE SAME

METHOD AND APPARATUS FOR LIGHT DIFFUSION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE