Ultrasonic frequency [f] 100 Khz=<f< 125 KHz

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H01L2924/20305

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20305Ultrasonic frequency [f] 100 Khz=<f< 125 KHz

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connecting device and circuit chip connecting method using connecti...
- Patent number 10,756,045
- Issue date Aug 25, 2020
- Samsung Display Co., Ltd.
- Seung Hwa Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper bond wire and method of making the same
- Patent number 9,966,355
- Issue date May 8, 2018
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum coated copper ribbon
- Patent number 9,214,444
- Issue date Dec 15, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
- Patent number 8,513,060
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
- Patent number 8,365,977
- Issue date Feb 5, 2013
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
- Patent number 8,251,275
- Issue date Aug 28, 2012
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for controlling the generation of ultrasonic wire...
- Patent number 8,020,746
- Issue date Sep 20, 2011
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding simulation
- Patent number 7,085,699
- Issue date Aug 1, 2006
- Texas Instruments Incorporated
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature gold wire bonding
- Patent number 6,698,646
- Issue date Mar 2, 2004
- Agilent Technologies, Inc.
- Kim H Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,685,083
- Issue date Feb 3, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the reliability of thermosonic gold to aluminum w...
- Patent number 6,593,222
- Issue date Jul 15, 2003
- Lattice Corporation
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,367,685
- Issue date Apr 9, 2002
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration mode for wire bonding
- Patent number 6,244,498
- Issue date Jun 12, 2001
- Micron Semiconductor, Inc.
- Tongbi Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for high frequency bonding
- Patent number 6,079,607
- Issue date Jun 27, 2000
- Texas Instruments Incorporated
- Larry W. Nichter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency, low temperature thermosonic ribbon bonding process...
- Patent number 5,894,983
- Issue date Apr 20, 1999
- Harris Corporation
- Donald J. Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 5,884,835
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding process
- Patent number 5,660,319
- Issue date Aug 26, 1997
- Texas Instruments Incorporated
- Robert J. Falcone
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for enhanced intermetallic growth in IC interconnections
- Patent number 5,201,454
- Issue date Apr 13, 1993
- Texas Instruments Incorporated
- Rafael C. Alfaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transducer heating in low temperature bonding
- Patent number 5,186,378
- Issue date Feb 16, 1993
- Texas Instruments Incorporated
- Rafael C. Alfaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
- Publication number 20180211933
- Publication date Jul 26, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung Hwa HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...
- Publication number 20130040426
- Publication date Feb 14, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROAKI NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
- Publication number 20120286023
- Publication date Nov 15, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
- Publication number 20120125977
- Publication date May 24, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressure-Sensitive Adhesive Tape
- Publication number 20100323191
- Publication date Dec 23, 2010
- Nitto Denko Corporation
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100167468
- Publication date Jul 1, 2010
- Renesas Technology Corp.
- Hirohisa Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD F...
- Publication number 20100047968
- Publication date Feb 25, 2010
- Yasuhiro Amano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...
- Publication number 20100025453
- Publication date Feb 4, 2010
- Technische Universitaet Berlin
- Ute Geissler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WIRE BONDING
- Publication number 20080191367
- Publication date Aug 14, 2008
- STATS ChipPAC, Ltd.
- Taehun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070187823
- Publication date Aug 16, 2007
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20070178623
- Publication date Aug 2, 2007
- RENESAS TECHNOLOGY CORP.
- Hirohisa Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and liquid-jet head
- Publication number 20050195247
- Publication date Sep 8, 2005
- Seiko Epson Corporation
- Isao Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding simulation
- Publication number 20050133566
- Publication date Jun 23, 2005
- Manjula N. Variyam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20050001314
- Publication date Jan 6, 2005
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve the reliability of thermosonic gold to aluminum w...
- Publication number 20030049923
- Publication date Mar 13, 2003
- Richard C. Smoak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room temperature gold wire bonding
- Publication number 20030006271
- Publication date Jan 9, 2003
- Kim H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room temperature gold wire bonding
- Publication number 20030006267
- Publication date Jan 9, 2003
- Kim H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel ultrasonic vibration mode for wire bonding
- Publication number 20020096554
- Publication date Jul 25, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Ultrasonic frequency [f] 100 Khz=<f< 125 KHz

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting device and circuit chip connecting method using connecti...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Aluminum coated copper bond wire and method of making the same

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Aluminum coated copper ribbon

Manufacturing method using multi-step adhesive curing for sealed se...

Ultrasonic transducers for wire bonding and methods of forming wire...

Ultrasonic transducers for wire bonding and methods of forming wire...

Method and device for controlling the generation of ultrasonic wire...

Wire bonding simulation

Semiconductor device and a method of manufacturing the same

Room temperature gold wire bonding

Ultrasonic vibration mode for wire bonding

Interconnections to copper IC&#x00027;s

Method to improve the reliability of thermosonic gold to aluminum w...

Ultrasonic vibration mode for wire bonding

Ultrasonic vibration mode for wire bonding

Method for high frequency bonding

High frequency, low temperature thermosonic ribbon bonding process...

Ultrasonic bonding method and ultrasonic bonding apparatus

Ultrasonic bonding process

Process for enhanced intermetallic growth in IC interconnections

Method and apparatus for transducer heating in low temperature bonding

Patents Applicationslast 30 patents

CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...

ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...

ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...

Pressure-Sensitive Adhesive Tape

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD F...

METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...

SEMICONDUCTOR PACKAGE WIRE BONDING

Semiconductor device

Method of manufacturing semiconductor device

Wire bonding method and liquid-jet head

Wire bonding simulation

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Method to improve the reliability of thermosonic gold to aluminum w...

Room temperature gold wire bonding

Room temperature gold wire bonding

Novel ultrasonic vibration mode for wire bonding

Interconnections to copper IC's