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Ultrasonic frequency [f] 100 Khz=<f< 125 KHz
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H01L2924/20305
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/20305
Ultrasonic frequency [f] 100 Khz=<f< 125 KHz
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Patents Grants
last 30 patents
Information
Patent Grant
Connecting device and circuit chip connecting method using connecti...
Patent number
10,756,045
Issue date
Aug 25, 2020
Samsung Display Co., Ltd.
Seung Hwa Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
10,312,216
Issue date
Jun 4, 2019
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
10,297,568
Issue date
May 21, 2019
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum coated copper bond wire and method of making the same
Patent number
9,966,355
Issue date
May 8, 2018
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
9,905,530
Issue date
Feb 27, 2018
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for bonding semiconductor elements
Patent number
9,633,981
Issue date
Apr 25, 2017
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum coated copper ribbon
Patent number
9,214,444
Issue date
Dec 15, 2015
Heraeus Deutschland GmbH & Co. KG
Eugen Milke
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
Patent number
8,513,060
Issue date
Aug 20, 2013
Renesas Electronics Corporation
Hiroaki Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
Patent number
8,365,977
Issue date
Feb 5, 2013
Kulicke and Soffa Industries, Inc.
Dominick A. DeAngelis
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic transducers for wire bonding and methods of forming wire...
Patent number
8,251,275
Issue date
Aug 28, 2012
Kulicke and Soffa Industries, Inc.
Dominick A. DeAngelis
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and device for controlling the generation of ultrasonic wire...
Patent number
8,020,746
Issue date
Sep 20, 2011
Technische Universitaet Berlin
Ute Geissler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wire bonding simulation
Patent number
7,085,699
Issue date
Aug 1, 2006
Texas Instruments Incorporated
Manjula N. Variyam
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
7,015,127
Issue date
Mar 21, 2006
Renesas Technology Corp.
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Room temperature gold wire bonding
Patent number
6,698,646
Issue date
Mar 2, 2004
Agilent Technologies, Inc.
Kim H Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic vibration mode for wire bonding
Patent number
6,685,083
Issue date
Feb 3, 2004
Micron Technology, Inc.
Tongbi Jiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnections to copper IC's
Patent number
6,620,720
Issue date
Sep 16, 2003
Agere Systems Inc.
Ralph Salvatore Moyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to improve the reliability of thermosonic gold to aluminum w...
Patent number
6,593,222
Issue date
Jul 15, 2003
Lattice Corporation
Richard C. Smoak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic vibration mode for wire bonding
Patent number
6,367,685
Issue date
Apr 9, 2002
Tongbi Jiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic vibration mode for wire bonding
Patent number
6,244,498
Issue date
Jun 12, 2001
Micron Semiconductor, Inc.
Tongbi Jiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for high frequency bonding
Patent number
6,079,607
Issue date
Jun 27, 2000
Texas Instruments Incorporated
Larry W. Nichter
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High frequency, low temperature thermosonic ribbon bonding process...
Patent number
5,894,983
Issue date
Apr 20, 1999
Harris Corporation
Donald J. Beck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
Patent number
5,884,835
Issue date
Mar 23, 1999
Hitachi, Ltd.
Ryoichi Kajiwara
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrasonic bonding process
Patent number
5,660,319
Issue date
Aug 26, 1997
Texas Instruments Incorporated
Robert J. Falcone
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for enhanced intermetallic growth in IC interconnections
Patent number
5,201,454
Issue date
Apr 13, 1993
Texas Instruments Incorporated
Rafael C. Alfaro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for transducer heating in low temperature bonding
Patent number
5,186,378
Issue date
Feb 16, 1993
Texas Instruments Incorporated
Rafael C. Alfaro
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CONNECTING DEVICE AND CIRCUIT CHIP CONNECTING METHOD USING CONNECTI...
Publication number
20180211933
Publication date
Jul 26, 2018
SAMSUNG DISPLAY CO., LTD.
Seung Hwa HA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20180182733
Publication date
Jun 28, 2018
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20180026006
Publication date
Jan 25, 2018
Kulicke and Soffa Industries, Inc.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20170179072
Publication date
Jun 22, 2017
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
Publication number
20160254252
Publication date
Sep 1, 2016
KULICKE AND SOFFA INDUSTRIES, INC.
Robert N. Chylak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
Publication number
20130328218
Publication date
Dec 12, 2013
RENESAS ELECTRONICS CORPORATION
Hiroaki NARITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...
Publication number
20130040426
Publication date
Feb 14, 2013
RENESAS ELECTRONICS CORPORATION
HIROAKI NARITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
Publication number
20120286023
Publication date
Nov 15, 2012
KULICKE AND SOFFA INDUSTRIES, INC.
Dominick A. DeAngelis
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE...
Publication number
20120125977
Publication date
May 24, 2012
KULICKE AND SOFFA INDUSTRIES, INC.
Dominick A. DeAngelis
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Pressure-Sensitive Adhesive Tape
Publication number
20100323191
Publication date
Dec 23, 2010
Nitto Denko Corporation
Yuki Sugo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20100167468
Publication date
Jul 1, 2010
Renesas Technology Corp.
Hirohisa Shimokawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD F...
Publication number
20100047968
Publication date
Feb 25, 2010
Yasuhiro Amano
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
METHOD AND DEVICE FOR CONTROLLING THE GENERATION OF ULTRASONIC WIRE...
Publication number
20100025453
Publication date
Feb 4, 2010
Technische Universitaet Berlin
Ute Geissler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE WIRE BONDING
Publication number
20080191367
Publication date
Aug 14, 2008
STATS ChipPAC, Ltd.
Taehun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device
Publication number
20070187823
Publication date
Aug 16, 2007
Naotaka Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor device
Publication number
20070178623
Publication date
Aug 2, 2007
RENESAS TECHNOLOGY CORP.
Hirohisa Shimokawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire bonding method and liquid-jet head
Publication number
20050195247
Publication date
Sep 8, 2005
Seiko Epson Corporation
Isao Yanagisawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire bonding simulation
Publication number
20050133566
Publication date
Jun 23, 2005
Manjula N. Variyam
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device
Publication number
20050001314
Publication date
Jan 6, 2005
Naotaka Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and a method of manufacturing the same
Publication number
20040142551
Publication date
Jul 22, 2004
Hitachi, Ltd.
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and a method of manufacturing the same
Publication number
20030168740
Publication date
Sep 11, 2003
Yasuyuki Nakajima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to improve the reliability of thermosonic gold to aluminum w...
Publication number
20030049923
Publication date
Mar 13, 2003
Richard C. Smoak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Room temperature gold wire bonding
Publication number
20030006271
Publication date
Jan 9, 2003
Kim H. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Room temperature gold wire bonding
Publication number
20030006267
Publication date
Jan 9, 2003
Kim H. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Novel ultrasonic vibration mode for wire bonding
Publication number
20020096554
Publication date
Jul 25, 2002
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS