Ultrasonic horns

Industry

CPC
H01L2224/78353

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78353Ultrasonic horns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capillary transport device, capillary mounting device, capillary re...
- Patent number 11,127,709
- Issue date Sep 21, 2021
- Kaijo Corporation
- Go Takemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection of foreign particles during wire bonding
- Patent number 10,658,328
- Issue date May 19, 2020
- ASM Technology Singapore Pte. Ltd.
- Tact Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary transport device, capillary mounting device, capillary re...
- Patent number 10,529,684
- Issue date Jan 7, 2020
- Kaijo Corporation
- Go Takemoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball forming device, wire-bonding apparatus, and ball formation method
- Patent number 10,410,992
- Issue date Sep 10, 2019
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding component
- Patent number 10,147,701
- Issue date Dec 4, 2018
- KYOCERA Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor device, and wire-bonding apparatus
- Patent number 9,922,952
- Issue date Mar 20, 2018
- Shinkawa Ltd.
- Yoshihito Hagiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drive mechanism and manufacturing device
- Patent number 9,772,012
- Issue date Sep 26, 2017
- Kaijo Corporation
- Shuichi Takanami
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...
- Publication number 20240203933
- Publication date Jun 20, 2024
- SHINKAWA LTD.
- Hikaru MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230343742
- Publication date Oct 26, 2023
- SHINKAWA LTD.
- Yuhei ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230178510
- Publication date Jun 8, 2023
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20230125756
- Publication date Apr 27, 2023
- SHINKAWA LTD.
- Osamu KAKUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...
- Publication number 20220310552
- Publication date Sep 29, 2022
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...
- Publication number 20200203307
- Publication date Jun 25, 2020
- SHINKAWA LTD.
- Shinsuke TEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
- Publication number 20200091107
- Publication date Mar 19, 2020
- KAIJO CORPORATION
- Go TAKEMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING
- Publication number 20190139929
- Publication date May 9, 2019
- ASM Technology Singapore Pte Ltd
- Tact LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRASONIC VIBRATION BONDING APPARATUS
- Publication number 20180272463
- Publication date Sep 27, 2018
- TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
- Akihiro ICHINOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING COMPONENT
- Publication number 20180019224
- Publication date Jan 18, 2018
- Kyocera Corporation
- Hidekazu Shigeyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS
- Publication number 20160365330
- Publication date Dec 15, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DETECTING WIRE BONDING FAILURES
- Publication number 20140131425
- Publication date May 15, 2014
- ASM Technology Singapore Pte Ltd
- Wei LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ultrasonic horns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus, method for measuring opening amount of clam...

Wire bonding apparatus

Ultrasonic horn and manufacturing apparatus of semiconductor device

Force sensor in an ultrasonic wire bonding device

Method for bonding insulated coating wire, connection structure, me...

Wire bonding apparatus and manufacturing method for semiconductor a...

Method of vertically vibrating a bonding arm

Bonding process with rotating bonding stage

Method for calibrating wire clamp device

Bonding apparatus with rotating bonding stage

Capillary transport device, capillary mounting device, capillary re...

Ultrasonic vibration bonding apparatus

Wire bonding apparatus

Detection of foreign particles during wire bonding

Discharge examination device, wire-bonding apparatus, and discharge...

Capillary transport device, capillary mounting device, capillary re...

Ball forming device, wire-bonding apparatus, and ball formation method

Wedge bonding component

Method for producing semiconductor device, and wire-bonding apparatus

Drive mechanism and manufacturing device

Patents Applicationslast 30 patents

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

WIRE BONDING APPARATUS

WIRE BONDING APPARATUS, METHOD FOR MEASURING OPENING AMOUNT OF CLAM...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

WIRE BONDING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR A...

CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...

DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING

ULTRASONIC VIBRATION BONDING APPARATUS

WIRE BONDING APPARATUS

WEDGE BONDING COMPONENT

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND WIRE-BONDING APPARATUS

DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...

SEMICONDUCTOR DEVICE

METHOD OF DETECTING WIRE BONDING FAILURES