Universal aspects

Industry

CPC
H05K2201/09945

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09945Universal aspects

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film
- Patent number 10,985,128
- Issue date Apr 20, 2021
- Dexerials Corporation
- Koji Ejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,791,628
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and an electronic device and a joint str...
- Patent number 10,756,462
- Issue date Aug 25, 2020
- Murata Manufacturing Co., Ltd.
- Chu Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Archimedean spiral design for deformable electronics
- Patent number 10,660,200
- Issue date May 19, 2020
- Arizona Board of Regents on behalf of Arizona State University
- Hanqing Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit
- Patent number 10,506,709
- Issue date Dec 10, 2019
- Zodiac Aerotechnics
- Zoran Racic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint structure of a resin multilayer substrate and a circuit board
- Patent number 10,505,298
- Issue date Dec 10, 2019
- Murata Manufacturing Co., Ltd.
- Chu Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate module and flexible display device
- Patent number 10,426,034
- Issue date Sep 24, 2019
- Joled Inc
- Shunsuke Itakura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,426,030
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 10,334,724
- Issue date Jun 25, 2019
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrical connection box
- Patent number 9,873,394
- Issue date Jan 23, 2018
- Sumitomo Wiring Systems, Ltd.
- Yoshikazu Hachiya
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 9,706,647
- Issue date Jul 11, 2017
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Conductive adhesive film and solar cell module
- Patent number 9,173,302
- Issue date Oct 27, 2015
- Hitachi Chemical Company, Ltd.
- Takehiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor containing a large number of filamentous conductors and m...
- Patent number 8,638,542
- Issue date Jan 28, 2014
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 8,362,369
- Issue date Jan 29, 2013
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted structure
- Patent number 8,304,664
- Issue date Nov 6, 2012
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode (LED) circuit board with multi-directional ele...
- Patent number 8,168,894
- Issue date May 1, 2012
- Safety Traffic Equipment Co., Ltd.
- Hsiao-Wan Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,138,609
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal mold for injection molding of solder
- Patent number 7,694,869
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method therefor
- Patent number 7,516,542
- Issue date Apr 14, 2009
- JTEKT Corporation
- Koji Temba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive coatings and electronic devices
- Patent number 7,408,263
- Issue date Aug 5, 2008
- E. I. Du Pont de Nemours and Company
- Jeffrey Scott Meth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a monolayer of particles having at least two diff...
- Patent number 6,977,025
- Issue date Dec 20, 2005
- Loctite (R&D) Limited
- Ciaran Bernard McArdle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards containing vias and methods for producing same
- Patent number 6,797,616
- Issue date Sep 28, 2004
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards containing vias and methods for producing same
- Patent number 6,774,486
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
6680534
- Patent number 6,680,534
- Issue date Jan 20, 2004
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a monolayer of particles, and products formed the...
- Patent number 6,402,876
- Issue date Jun 11, 2002
- Loctite (R&D) Ireland
- Ciaran B. McArdle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder strip exclusively for semiconductor packaging
- Patent number 6,329,631
- Issue date Dec 11, 2001
- Ray Yueh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Z-axis compressible polymer with fine metal matrix suspension
- Patent number 6,270,363
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a monolayer of particles, and products formed the...
- Patent number 6,180,226
- Issue date Jan 30, 2001
- Loctite (R&D) Limited
- Ciaran B. McArdle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Interposer For Printed Circuit Boards
- Publication number 20220104361
- Publication date Mar 31, 2022
- SoftIron Limited
- Robert Drury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND AN ELECTRONIC DEVICE AND A JOINT STR...
- Publication number 20200076097
- Publication date Mar 5, 2020
- Murata Manufacturing Co., Ltd.
- Chu XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT
- Publication number 20190150277
- Publication date May 16, 2019
- ZODIAC AEROTECHNICS
- Zoran RACIC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS
- Publication number 20180092205
- Publication date Mar 29, 2018
- MC10, Inc.
- YUNG-YU HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20160143174
- Publication date May 19, 2016
- SAMSUNG DISPLAY CO., LTD.
- Youngmin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140027169
- Publication date Jan 30, 2014
- BENQ MATERIALS CORPORATION
- Chien-Huang HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF
- Publication number 20110117357
- Publication date May 19, 2011
- FUJIFILM Corporation
- Yusuke Hatanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095419
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...
- Publication number 20110095433
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE (LED) CIRCUIT BOARD WITH MULTI-DIRECTIONAL ELE...
- Publication number 20110013406
- Publication date Jan 20, 2011
- Hsiao-Wan KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110012266
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110013340
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20100307808
- Publication date Dec 9, 2010
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTED STRUCTURE
- Publication number 20100294552
- Publication date Nov 25, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE
- Publication number 20090288697
- Publication date Nov 26, 2009
- HITACHI CHEMICAL CO., Ltd.
- Takehiro Shimizu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE ADHESIVE FILM, METHOD OF PRODUCING CONDUCTIVE ADHESIVE F...
- Publication number 20090208731
- Publication date Aug 20, 2009
- SEIKO EPSON CORPORATION
- Munehide Saimen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Universal mold for injection molding of solder
- Publication number 20070246516
- Publication date Oct 25, 2007
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Conductive Film and a Method of Manufacturing the Same
- Publication number 20070212521
- Publication date Sep 13, 2007
- TOKAI RUBBER INDUSTRIES, LTD.
- Hisami Bessho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic conductive coatings and electronic devices
- Publication number 20060249301
- Publication date Nov 9, 2006
- Jeffrey Scott Meth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and manufacturing method therefor
- Publication number 20060091544
- Publication date May 4, 2006
- KOYO SEIKO CO., LTD.
- Koji Temba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connector sheet and wiring board, and production processes of the same
- Publication number 20050057906
- Publication date Mar 17, 2005
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standardized circuit board core
- Publication number 20040178000
- Publication date Sep 16, 2004
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming a monolayer of particles having at least two diff...
- Publication number 20030180508
- Publication date Sep 25, 2003
- Ciaran Bernard McArdle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropically conductive film
- Publication number 20030178221
- Publication date Sep 25, 2003
- Cindy Chia-Wen Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropically conductive film
- Publication number 20030155656
- Publication date Aug 21, 2003
- Cindy Chia-Wen Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit boards containing vias and methods for producing same
- Publication number 20030068877
- Publication date Apr 10, 2003
- Larry D. Kinsman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit boards containing vias and methods for producing same
- Publication number 20030067074
- Publication date Apr 10, 2003
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal ball attach manufacturing process
- Publication number 20030052155
- Publication date Mar 20, 2003
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Universal aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film and connection structure

Trace/via hybrid structure multichip carrier

Resin multilayer substrate and an electronic device and a joint str...

Archimedean spiral design for deformable electronics

Electronic circuit

Joint structure of a resin multilayer substrate and a circuit board

Circuit substrate module and flexible display device

Trace/via hybrid structure multichip carrier

Conformal electronics including nested serpentine interconnects

Electrical connection box

Conformal electronics including nested serpentine interconnects

Conductive adhesive film and solar cell module

Capacitor containing a large number of filamentous conductors and m...

Wiring board

Electronic component mounted structure

Light emitting diode (LED) circuit board with multi-directional ele...

Semiconductor device and method of manufacturing semiconductor device

Universal mold for injection molding of solder

Wiring board and manufacturing method therefor

Anisotropic conductive coatings and electronic devices

Method of forming a monolayer of particles having at least two diff...

Circuit boards containing vias and methods for producing same

Circuit boards containing vias and methods for producing same

6680534

Method of forming a monolayer of particles, and products formed the...

Solder strip exclusively for semiconductor packaging

Z-axis compressible polymer with fine metal matrix suspension

Method of forming a monolayer of particles, and products formed the...

Patents Applicationslast 30 patents

Interposer For Printed Circuit Boards

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

RESIN MULTILAYER SUBSTRATE AND AN ELECTRONIC DEVICE AND A JOINT STR...

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

ELECTRONIC CIRCUIT

CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE HAVING THE SAME

ANISOTROPIC CONDUCTIVE FILM

MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DE...

LIGHT EMITTING DIODE (LED) CIRCUIT BOARD WITH MULTI-DIRECTIONAL ELE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

ELECTRONIC COMPONENT MOUNTED STRUCTURE

CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE

CONDUCTIVE ADHESIVE FILM, METHOD OF PRODUCING CONDUCTIVE ADHESIVE F...

Universal mold for injection molding of solder

Anisotropic Conductive Film and a Method of Manufacturing the Same

Anisotropic conductive coatings and electronic devices

Wiring board and manufacturing method therefor

Connector sheet and wiring board, and production processes of the same

Standardized circuit board core

Method of forming a monolayer of particles having at least two diff...

Anisotropically conductive film

Anisotropically conductive film

Circuit boards containing vias and methods for producing same

Circuit boards containing vias and methods for producing same

Universal ball attach manufacturing process