6680534

Information

• Patent Grant
• 6680534

• References
• Source

• Patent Number

  6,680,534

• Date Filed

  Not available

• Date Issued

  Tuesday, January 20, 2004
  20 years ago

• CPC

  • H05K1/115 - Via connections; Lands around holes or via connections
  • H01L23/49827 - Via connections through the substrates
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H05K3/4602 - characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
  • H05K2201/0949 - Pad close to a hole, not surrounding the hole
  • H05K2201/09609 - Via grid
  • H05K2201/09836 - Oblique hole, via or bump
  • H05K2201/09945 - Universal aspects