used as a support during build up manufacturing of active devices

Industry

CPC
H01L2221/6835

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/6835used as a support during build up manufacturing of active devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate sheet and method of use thereof
- Patent number 11,961,771
- Issue date Apr 16, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,955,349
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with transistors
- Patent number 11,956,976
- Issue date Apr 9, 2024
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through vias
- Patent number 11,948,876
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of LED display
- Patent number 11,942,352
- Issue date Mar 26, 2024
- Industry-Academic Cooperation Foundation, Yonsei University
- Dahl Young Khang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
- Patent number 11,923,287
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Takayuki Tajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,915,998
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-resolution micro-LED display panel and manufacturing method of...
- Patent number 11,915,962
- Issue date Feb 27, 2024
- KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD.
- Xiaosong Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, display panel and manufacturing method of...
- Patent number 11,901,479
- Issue date Feb 13, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
InFO-POP structures with TIVs having cavities
- Patent number 11,901,302
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240136215
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...
- Publication number 20240120437
- Publication date Apr 11, 2024
- EPISTAR CORPORATION
- Chia-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF
- Publication number 20240120230
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Tae Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20240088002
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Carriers and Methods of Making and Using
- Publication number 20240055292
- Publication date Feb 15, 2024
- UTAC Headquarters Pte. Ltd.
- Roel Adeva Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240047852
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...
- Publication number 20240047227
- Publication date Feb 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...
- Publication number 20240038569
- Publication date Feb 1, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Screen, Method for Manufacturing Same, and Display Terminal
- Publication number 20240030205
- Publication date Jan 25, 2024
- Huawei Technologies Co., Ltd
- Haohui Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20240021512
- Publication date Jan 18, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...
- Publication number 20240021443
- Publication date Jan 18, 2024
- Resonac Corporation
- Shogo SOBUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD
- Publication number 20240006217
- Publication date Jan 4, 2024
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Ping ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPON WAFER AND METHOD OF PREPARATION THEREOF
- Publication number 20230420305
- Publication date Dec 28, 2023
- ROCKLEY PHOTONICS LIMITED
- Ludovic CARO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
- Publication number 20230420284
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS
- Publication number 20230402310
- Publication date Dec 14, 2023
- CreeLED, Inc.
- Colin Blakely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR
- Publication number 20230402408
- Publication date Dec 14, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20230395520
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230387098
- Publication date Nov 30, 2023
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
VIA STRUCTURE FOR EMBEDDED COMPONENT AND METHOD FOR MAKING SAME
- Publication number 20230387027
- Publication date Nov 30, 2023
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS

used as a support during build up manufacturing of active devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Info structure with copper pillar having reversed profile

Encapsulated package including device dies connected via interconne...

Stacked via structure

Package structure with improved antenna patterns performance

Laminate sheet and method of use thereof

Semiconductor package and manufacturing method thereof

Via for semiconductor device connection and methods of forming the...

Integrated circuit package and method

Anisotropic carrier for high aspect ratio fanout

3D semiconductor devices and structures with transistors

Advanced info POP and method of forming thereof

Package structure with through vias

Semiconductor package and method

Manufacturing method of LED display

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

Semiconductor package and method

Photonics integrated circuit package

Semiconductor device including binding agent adhering an integrated...

Method for manufacturing semiconductor device having chip stacked a...

LTHC as charging barrier in info package formation

Semiconductor device and a method of manufacturing a semiconductor...

High-resolution micro-LED display panel and manufacturing method of...

Method for fabricating a chip package

Package structure and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Substrate assembly with encapsulated magnetic feature

Semiconductor structure, display panel and manufacturing method of...

InFO-POP structures with TIVs having cavities

Integrated fan-out package

Patents Applicationslast 30 patents

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

TRANSFER OF MICRO DEVICES

InFO-POP Structures with TIVs Having Cavities

LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...

APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF

DIE SUCTION ASSISTANCE DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Carriers and Methods of Making and Using

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

PACKAGE SUBSTRATE WITH EMBEDDED DEVICE, AND MANUFACTURING METHOD TH...

MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...

Display Screen, Method for Manufacturing Same, and Display Terminal

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

CURABLE RESIN FILM, FILM MATERIAL FOR SEMICONDUCTOR DEVICE PRODUCTI...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

PACKAGE STRUCTURE

MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD

COUPON WAFER AND METHOD OF PREPARATION THEREOF

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS

SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

VIA STRUCTURE FOR EMBEDDED COMPONENT AND METHOD FOR MAKING SAME