used in a transfer process involving at least two transfer steps

Industry

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H01L2221/68368

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68368used in a transfer process involving at least two transfer steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic element module
- Patent number 12,132,144
- Issue date Oct 29, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for transferring micro device on curved surface and apparatu...
- Patent number 12,127,349
- Issue date Oct 22, 2024
- Korea Institute of Machinery & Materials
- Bongkyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing optoelectronic devices
- Patent number 12,112,968
- Issue date Oct 8, 2024
- Osram Opto Semiconductors GmbH
- Ralph Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Particle capture using transfer stamp
- Patent number 12,094,851
- Issue date Sep 17, 2024
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device structure and display apparatus
- Patent number 12,087,612
- Issue date Sep 10, 2024
- Industrial Technology Research Institute
- Ming-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 12,080,585
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device, and substrate for manufact...
- Patent number 12,080,580
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Hyunwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for repairing vacancies resulting from mass trans...
- Patent number 12,068,430
- Issue date Aug 20, 2024
- Xerox Corporation
- Evgeniy Bart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief die implementation
- Patent number 12,057,411
- Issue date Aug 6, 2024
- Intel Corporation
- Stephan Stoeckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 12,057,337
- Issue date Aug 6, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High throughput microprinting process
- Patent number 12,051,612
- Issue date Jul 30, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional error compensation in assembly of discrete components by...
- Patent number 12,046,504
- Issue date Jul 23, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED transfer method and display panel
- Patent number 12,033,882
- Issue date Jul 9, 2024
- BOE Technology Group Co., Ltd.
- Lili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,996,395
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Jin Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...
- Publication number 20240404865
- Publication date Dec 5, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
- Publication number 20240404864
- Publication date Dec 5, 2024
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR COMPONENT
- Publication number 20240395590
- Publication date Nov 28, 2024
- JI HUA LABORATORY
- Yanliang QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT MICROPRINTING PROCESS
- Publication number 20240347368
- Publication date Oct 17, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REPAIRING VACANCIES RESULTING FROM MASS TRANS...
- Publication number 20240339560
- Publication date Oct 10, 2024
- Xerox Corporation
- Evgeniy Bart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20240339345
- Publication date Oct 10, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...
- Publication number 20240312848
- Publication date Sep 19, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji Hayashishita
- G01 - MEASURING TESTING
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282760
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20240282616
- Publication date Aug 22, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Yubun Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-DEVICE SUBSTRATE STRUCTURES WITH POSTS AND INDENTATIONS
- Publication number 20240242998
- Publication date Jul 18, 2024
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...
- Publication number 20240234191
- Publication date Jul 11, 2024
- CHONGQING KONKA OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Guangchao DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING ST...
- Publication number 20240234219
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
- Publication number 20240213238
- Publication date Jun 27, 2024
- X Display Company Technology Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER METHOD FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENT
- Publication number 20240186173
- Publication date Jun 6, 2024
- ams-OSRAM International GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

used in a transfer process involving at least two transfer steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of mechanical separation for a double layer transfer

Methods for producing a 3D semiconductor memory device and structure

3D semiconductor device and structure with single-crystal layers

Manufacturing method of electronic element module

3D semiconductor device and structure with metal layers and memory...

Method for transferring micro device on curved surface and apparatu...

Package having an electronic component and an encapsulant encapsula...

Method for producing optoelectronic devices

Methods for producing a 3D semiconductor device and structure with...

Particle capture using transfer stamp

Micro device structure and display apparatus

Wet alignment method for micro-semiconductor chip and display trans...

Method for manufacturing display device, and substrate for manufact...

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Processed stacked dies

System and method for repairing vacancies resulting from mass trans...

3D semiconductor device and structure with bonding and DRAM memory...

Microdevice transfer setup and integration of micro-devices into sy...

Stress relief die implementation

Chip transferring method and the apparatus thereof

High throughput microprinting process

Positional error compensation in assembly of discrete components by...

Chip package with redistribution structure having multiple chips

Micro-LED transfer method and display panel

Methods for producing a 3D semiconductor device and structure with...

High density interconnection and wiring layers, package structures,...

Heterogeneous integration of components onto compact devices using...

Display device and manufacturing method thereof

Advanced info POP and method of forming thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

RECEPTOR SUBSTRATE, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE, TR...

PROCESSED STACKED DIES

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

DEVICE AND METHOD FOR TRANSFERRING SEMICONDUCTOR COMPONENT

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

SELECTIVE TRANSFER OF MICRO DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

CHIP PACKAGE HAVING MULTIPLE CHIPS

HIGH THROUGHPUT MICROPRINTING PROCESS

SYSTEM AND METHOD FOR REPAIRING VACANCIES RESULTING FROM MASS TRANS...

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PRODUCTION METHOD

MICRO-DEVICE SUBSTRATE STRUCTURES WITH POSTS AND INDENTATIONS

METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...

METHOD OF TRANSFERRING MICRO SEMICONDUCTOR CHIP AND TRANSFERRING ST...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES

TRANSFER METHOD FOR OPTOELECTRONIC SEMICONDUCTOR COMPONENT

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF