used in a transfer process involving at least two transfer steps

Industry

CPC
H01L2221/68368

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68368used in a transfer process involving at least two transfer steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, display panel and manufacturing method of...
- Patent number 11,901,479
- Issue date Feb 13, 2024
- PlayNitride Display Co., Ltd.
- Bo-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,892,497
- Issue date Feb 6, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Light-emitting diode testing circuit, light-emitting diode testing...
- Patent number 11,862,751
- Issue date Jan 2, 2024
- Epistar Corporation
- Chia-Chen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with selective component removal
- Patent number 11,854,855
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having a semiconductor light emitting source
- Patent number 11,848,316
- Issue date Dec 19, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrating control circuits with light emissive circuits with diss...
- Patent number 11,842,989
- Issue date Dec 12, 2023
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for transfer of micro-devices
- Patent number 11,843,025
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing thin film transistor, biometric device, an...
- Patent number 11,830,763
- Issue date Nov 28, 2023
- Beijing Boe Display Technology Co., Ltd.
- Shan Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,817,440
- Issue date Nov 14, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro light emitting diodes
- Patent number 11,810,809
- Issue date Nov 7, 2023
- Macroblock, Inc.
- Shih-Sian Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor man...
- Patent number 11,804,471
- Issue date Oct 31, 2023
- Kioxia Corporation
- Masaya Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure for an optoelectronic device
- Patent number 11,791,438
- Issue date Oct 17, 2023
- Sensor Electronic Technology, Inc.
- Mikhail Gaevski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 11,776,989
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 11,764,095
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using mask layer
- Patent number 11,756,982
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,742,219
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 11,742,233
- Issue date Aug 29, 2023
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,735,462
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
- Publication number 20240133940
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...
- Publication number 20240120437
- Publication date Apr 11, 2024
- EPISTAR CORPORATION
- Chia-Chen TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...
- Publication number 20240079403
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SELF-SUPPORTING GALLIUM NITRIDE SUBSTRATE
- Publication number 20240063016
- Publication date Feb 22, 2024
- SINO NITRIDE SEMICONDUCTOR CO., LTD.
- Junjie REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE CARTRIDGE MAPPING AND COMPENSATION
- Publication number 20240047261
- Publication date Feb 8, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Screen, Method for Manufacturing Same, and Display Terminal
- Publication number 20240030205
- Publication date Jan 25, 2024
- Huawei Technologies Co., Ltd
- Haohui Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD
- Publication number 20240006217
- Publication date Jan 4, 2024
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Ping ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
- Publication number 20230420284
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS
- Publication number 20230402310
- Publication date Dec 14, 2023
- CreeLED, Inc.
- Colin Blakely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER BY LEVITATION
- Publication number 20230402302
- Publication date Dec 14, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
- Publication number 20230395418
- Publication date Dec 7, 2023
- EV GROUP E. THALLNER GMBH
- Boris Povazay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230387098
- Publication date Nov 30, 2023
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG-FLIPPING OF DIES PRIOR TO BONDING
- Publication number 20230360950
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Transfer Method and Electronic Device
- Publication number 20230352334
- Publication date Nov 2, 2023
- Huawei Technologies Co., Ltd
- Haohui Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
- Publication number 20230341456
- Publication date Oct 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER SYSTEM AND MASS TRANSFER METHOD
- Publication number 20230343891
- Publication date Oct 26, 2023
- TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
- Peixuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230317497
- Publication date Oct 5, 2023
- AUO Corporation
- Bo-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING TH...
- Publication number 20230317499
- Publication date Oct 5, 2023
- AUO Corporation
- Shih-Lun Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
- Publication number 20230307234
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning Components on a Substrate and Substrates Sui...
- Publication number 20230290664
- Publication date Sep 14, 2023
- IMEC vzw
- Tom Sterken
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20230274962
- Publication date Aug 31, 2023
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274970
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274969
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275071
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS

used in a transfer process involving at least two transfer steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced info POP and method of forming thereof

Dynamic release tapes for assembly of discrete components

3D semiconductor device and structure with bonding

3D semiconductor device and structure with memory

Semiconductor structure, display panel and manufacturing method of...

Micro device arrangement in donor substrate

3D semiconductor device and structure with single-crystal layers

Light-emitting diode testing circuit, light-emitting diode testing...

Method for producing a 3D semiconductor device and structure with m...

Micro-transfer printing with selective component removal

Methods for producing a 3D semiconductor device and structure with...

Display apparatus having a semiconductor light emitting source

Integrating control circuits with light emissive circuits with diss...

Methods for transfer of micro-devices

Methods of manufacturing thin film transistor, biometric device, an...

3D semiconductor device and structure with bonding

Display apparatus and manufacturing method thereof

Method for transferring micro light emitting diodes

Methods for producing a 3D semiconductor device and structure with...

Method for manufacturing semiconductor device and semiconductor man...

Heterostructure for an optoelectronic device

DBI to SI bonding for simplified handle wafer

3D semiconductor device and structure with bonding

Light emitting diode display with redundancy scheme

Methods of parallel transfer of micro-devices using treatment

Wet alignment method for micro-semiconductor chip and display trans...

Methods of parallel transfer of micro-devices using mask layer

Integrated fan-out package and manufacturing method thereof

Method of mechanical separation for a double layer transfer

3D semiconductor device and structure with single-crystal layers

Patents Applicationslast 30 patents

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE

LIGHT-EMITTING DIODE TESTING CIRCUIT, LIGHT-EMITTING DIODE TESTING...

METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

METHOD FOR MANUFACTURING SELF-SUPPORTING GALLIUM NITRIDE SUBSTRATE

MICRODEVICE CARTRIDGE MAPPING AND COMPENSATION

Display Screen, Method for Manufacturing Same, and Display Terminal

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

MICRO LED TRANSFER METHOD, DISPLAY PANEL AND FABRICATION METHOD

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

MASS TRANSFER OF SEMICONDUCTOR DIE USING TRANSFER ELEMENTS

ELECTRONIC COMPONENT TRANSFER BY LEVITATION

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

GANG-FLIPPING OF DIES PRIOR TO BONDING

Chip Transfer Method and Electronic Device

MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE

MASS TRANSFER SYSTEM AND MASS TRANSFER METHOD

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

DISPLAY APPARATUS

LIGHT-EMITTING DEVICE ARRAY SUBSTRATE AND METHOD FOR FABRICATING TH...

SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS

Method for Positioning Components on a Substrate and Substrates Sui...

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF