used to support a device or wafer when forming electrical connections thereto

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CPC
H01L2221/68372

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68372used to support a device or wafer when forming electrical connections thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,830
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing semiconductor package
- Patent number 12,243,788
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display with embedded pixel driver chips
- Patent number 12,243,863
- Issue date Mar 4, 2025
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,237,276
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,690
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,183,694
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,176,256
- Issue date Dec 24, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,176,301
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,170,251
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resistor layer, and method of manufacturing sem...
- Patent number 12,164,232
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,154,873
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,132,004
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structure and method of manufacture
- Patent number 12,131,984
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric vias for direct connection and method forming same
- Patent number 12,125,820
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,125,798
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070038
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250070050
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...
- Publication number 20250054832
- Publication date Feb 13, 2025
- Rogers Germany GmbH
- Vitalij GIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20250046737
- Publication date Feb 6, 2025
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250022790
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- George Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...
- Publication number 20240404898
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Hao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395727
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387391
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS
- Publication number 20240387193
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379575
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240371791
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation in Semiconductor Packages and Methods of Forming Same
- Publication number 20240371839
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240363573
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- KYUNG DON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20240363415
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363517
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240363574
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240355755
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS

used to support a device or wafer when forming electrical connections thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacture

Method of testing semiconductor package

Display with embedded pixel driver chips

Package structure

Integrated circuit structure

Package structure and methods of manufacturing the same

Package and method of forming same

Bonding to alignment marks with dummy alignment marks

Chip package structure having molding layer

Package structure

Package structure with reinforced element

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacture

Integrated circuit structure and method

Semiconductor package

Semiconductor package including antenna

Semiconductor devices and methods of manufacturing semiconductor de...

Die package and method of forming a die package

Package structure and method for forming the same

Semiconductor package

Method for removing resistor layer, and method of manufacturing sem...

Semiconductor package including antenna

Coreless architecture and processing strategy for EMIB-based substr...

Semiconductor devices and methods of manufacture

Heterogeneous fan-out structure and method of manufacture

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Package structure with fan-out feature

Semiconductor package and manufacturing method thereof

Through-dielectric vias for direct connection and method forming same

Semiconductor package and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

MOLDING COMPOSITION, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATIN...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

Semiconductor Devices and Methods of Manufacture

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES WITH EXTERNAL CONNECTORS

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Heat Dissipation in Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR PACKAGE DEVICE

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

METHOD OF FABRICATING PACKAGE STRUCTURE

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

PACKAGE

PACKAGE STRUCTURE

Semiconductor Package and Method

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...