used to support a device or wafer when forming electrical connections thereto

Industry

CPC
H01L2221/68372

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68372used to support a device or wafer when forming electrical connections thereto

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,973,042
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jingu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 11,955,433
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 11,955,467
- Issue date Apr 9, 2024
- STATS ChipPAC Pte. Ltd.
- Junghwan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,433
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,942,434
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Sangkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,923,315
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,908,836
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
InFO-POP structures with TIVs having cavities
- Patent number 11,901,302
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,301
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,894,310
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Myung Sam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacture
- Patent number 11,894,312
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with embedded die substrate on interposer
- Patent number 11,894,311
- Issue date Feb 6, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
- Patent number 11,894,354
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,881,458
- Issue date Jan 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 11,862,599
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,855,003
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structure for integrated circuit package and method...
- Patent number 11,854,994
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240153882
- Publication date May 9, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Khim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
- Publication number 20240145305
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145397
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jeongho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
InFO-POP Structures with TIVs Having Cavities
- Publication number 20240136298
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Dp., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096822
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20240088002
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071954
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE
- Publication number 20240071953
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF FORMING SEMICON...
- Publication number 20240063043
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038674
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR
- Publication number 20240038683
- Publication date Feb 1, 2024
- NXP B.V.
- Tzu Ya Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
- Publication number 20240030175
- Publication date Jan 25, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...
- Publication number 20240030188
- Publication date Jan 25, 2024
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE
- Publication number 20240021512
- Publication date Jan 18, 2024
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME
- Publication number 20240021576
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20240021523
- Publication date Jan 18, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH UNDERFILL
- Publication number 20240021529
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230420413
- Publication date Dec 28, 2023
- Intel Corporation
- Alois Nitsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...
- Publication number 20230411356
- Publication date Dec 21, 2023
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230395535
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230395573
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20230384684
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Bonding to Alignment Marks with Dummy Alignment Marks
- Publication number 20230378122
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

used to support a device or wafer when forming electrical connections thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Package structure and manufacturing method thereof

Semiconductor package

Package structure with improved antenna patterns performance

Semiconductor package and manufacturing method thereof

Package-on-package device

Semiconductor device and method of forming vertical interconnect st...

Package structure

Integrated circuit package and method

Method of manufacturing a semiconductor package

Semiconductor package and method

Photonics integrated circuit package

Semiconductor device including binding agent adhering an integrated...

Semiconductor package and manufacturing method thereof

Method for fabricating a chip package

Package structure and method of manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

InFO-POP structures with TIVs having cavities

Semiconductor package

Fan-out semiconductor package

Semiconductor packages and method of manufacture

Microelectronic device with embedded die substrate on interposer

Optoelectronic device package and method of manufacturing the same

Coreless organic packages with embedded die and magnetic inductor s...

Semiconductor devices and methods of manufacturing semiconductor de...

Package structure

Semiconductor components having conductive vias with aligned back s...

Bonding to alignment marks with dummy alignment marks

Package structure and method of fabricating the same

Redistribution structure for integrated circuit package and method...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

InFO-POP Structures with TIVs Having Cavities

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

Three-Dimensional Semiconductor Device and Method

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

METHOD OF FABRICATING MEMORY DEVICE AND PACKAGE STRUCTURE

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF FORMING SEMICON...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR

INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES

MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...

DIE PACKAGE AND METHOD OF FORMING A DIE PACKAGE

THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

PACKAGE STRUCTURE WITH UNDERFILL

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

MONOLITHIC CHIP STACKING USING A DIE WITH DOUBLE-SIDED INTERCONNECT...

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

Bonding to Alignment Marks with Dummy Alignment Marks