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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process, DAF replacement
- Patent number 11,552,040
- Issue date Jan 10, 2023
- Western Digital Technologies, Inc.
- Siqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device including etching an ed...
- Patent number 11,387,207
- Issue date Jul 12, 2022
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable support substrate for formation and transfer of semiconduc...
- Patent number 10,910,272
- Issue date Feb 2, 2021
- SanDisk Technologies LLC
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetically sealed MEMS device and its fabrication
- Patent number 10,427,932
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- John Charles Ehmke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,177,109
- Issue date Jan 8, 2019
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,153,266
- Issue date Dec 11, 2018
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,090,229
- Issue date Oct 2, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding process and structures
- Patent number 9,613,926
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level die attach metallization
- Patent number 9,536,783
- Issue date Jan 3, 2017
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
- Patent number 9,524,940
- Issue date Dec 20, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
- Patent number 9,293,409
- Issue date Mar 22, 2016
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 9,087,778
- Issue date Jul 21, 2015
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip device with solder diffusion protection
- Patent number 8,759,962
- Issue date Jun 24, 2014
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining method and semiconductor device manufacturing method
- Patent number 8,746,538
- Issue date Jun 10, 2014
- Mitsubishi Electric Corporation
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip device with solder diffusion protection
- Patent number 8,299,633
- Issue date Oct 30, 2012
- Advanced Micro Devices, Inc.
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device and method for manufacturing the same
- Patent number 8,174,118
- Issue date May 8, 2012
- Sumitomo Electric Industries, Ltd
- Youichi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming an underfill adhesive layer
- Patent number 7,253,078
- Issue date Aug 7, 2007
- National Semiconductor Corporation
- Luu T. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming an underfill adhesive layer
- Patent number 6,352,881
- Issue date Mar 5, 2002
- National Semiconductor Corporation
- Luu Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230369276
- Publication date Nov 16, 2023
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20230215852
- Publication date Jul 6, 2023
- LG Display Co., Ltd.
- Byonghoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220157761
- Publication date May 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS, DAF REPLACEMENT
- Publication number 20220028819
- Publication date Jan 27, 2022
- Western Digital Technologies, Inc.
- Siqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180114766
- Publication date Apr 26, 2018
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170301612
- Publication date Oct 19, 2017
- Rohm Co., Ltd.
- Motoharu HAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
- Publication number 20140264868
- Publication date Sep 18, 2014
- Cree, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130134210
- Publication date May 30, 2013
- Aya Muto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION
- Publication number 20130049229
- Publication date Feb 28, 2013
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURI...
- Publication number 20120153461
- Publication date Jun 21, 2012
- PANASONIC CORPORATION
- Hidetoshi Kitaura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Device with Solder Diffusion Protection
- Publication number 20110147916
- Publication date Jun 23, 2011
- Michael Z. Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100171097
- Publication date Jul 8, 2010
- Sumitomo Electric Industries, Ltd.
- Youichi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

using a lift-off mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Package process, DAF replacement

Method for fabricating semiconductor device including etching an ed...

Reusable support substrate for formation and transfer of semiconduc...

Semiconductor device and method

Conductive paste for bonding

Hermetically sealed MEMS device and its fabrication

Semiconductor devices and methods of forming thereof

Conductive connecting member and manufacturing method of same

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing the same

Wafer to wafer bonding process and structures

Method for processing a wafer and wafer structure

Wafer-level die attach metallization

Method for manufacturing a semiconductor device, and semiconductor...

Semiconductor devices and methods of forming thereof

Method for manufacturing a semiconductor device, and semiconductor...

Bonding pad for thermocompression bonding, process for producing a...

Semiconductor composite apparatus, method for manufacturing the sem...

Joining method and semiconductor device manufacturing method

Package structure and substrate bonding method

Semiconductor chip device with solder diffusion protection

Joining method and semiconductor device manufacturing method

Semiconductor chip device with solder diffusion protection

Detection device and method for manufacturing the same

Method and apparatus for forming an underfill adhesive layer

Method and apparatus for forming an underfill adhesive layer

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Device and Method of Manufacturing the Same

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

PACKAGE PROCESS, DAF REPLACEMENT

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WAFER-LEVEL DIE ATTACH METALLIZATION

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

Package Structure and Substrate Bonding Method

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURI...

Semiconductor Chip Device with Solder Diffusion Protection

Semiconductor composite apparatus, method for manufacturing the sem...

DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor composite apparatus, method for manufacturing the sem...