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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/2747
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method
Patent number
11,855,014
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package process, DAF replacement
Patent number
11,552,040
Issue date
Jan 10, 2023
Western Digital Technologies, Inc.
Siqi Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device including etching an ed...
Patent number
11,387,207
Issue date
Jul 12, 2022
NANYA TECHNOLOGY CORPORATION
Sheng-Fu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable support substrate for formation and transfer of semiconduc...
Patent number
10,910,272
Issue date
Feb 2, 2021
SanDisk Technologies LLC
Fei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
10,867,941
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive paste for bonding
Patent number
10,696,875
Issue date
Jun 30, 2020
E. I. Du Pont de Nemours and Company
Yumi Matsuura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Hermetically sealed MEMS device and its fabrication
Patent number
10,427,932
Issue date
Oct 1, 2019
Texas Instruments Incorporated
John Charles Ehmke
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor devices and methods of forming thereof
Patent number
10,262,959
Issue date
Apr 16, 2019
Infineon Technologies AG
Evelyn Napetschnig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive connecting member and manufacturing method of same
Patent number
10,177,079
Issue date
Jan 8, 2019
Furukawa Electric Co., Ltd.
Hideo Nishikubo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
10,177,109
Issue date
Jan 8, 2019
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,153,266
Issue date
Dec 11, 2018
Infineon Technologies AG
Thomas Fischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
10,090,229
Issue date
Oct 2, 2018
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer to wafer bonding process and structures
Patent number
9,613,926
Issue date
Apr 4, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for processing a wafer and wafer structure
Patent number
9,589,880
Issue date
Mar 7, 2017
Infineon Technologies AG
Srinivasa Reddy Yeduru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level die attach metallization
Patent number
9,536,783
Issue date
Jan 3, 2017
Cree, Inc.
Fabian Radulescu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
Patent number
9,524,940
Issue date
Dec 20, 2016
Infineon Technologies AG
Thomas Fischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of forming thereof
Patent number
9,484,316
Issue date
Nov 1, 2016
Infineon Technologies AG
Evelyn Napetschnig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device, and semiconductor...
Patent number
9,293,409
Issue date
Mar 22, 2016
Infineon Technologies AG
Thomas Fischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
Patent number
9,281,280
Issue date
Mar 8, 2016
Robert Bosch GmbH
Christoph Schelling
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
Patent number
9,093,562
Issue date
Jul 28, 2015
Oki Data Corporation
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Joining method and semiconductor device manufacturing method
Patent number
9,087,778
Issue date
Jul 21, 2015
Mitsubishi Electric Corporation
Aya Muto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure and substrate bonding method
Patent number
8,916,449
Issue date
Dec 23, 2014
Asia Pacific Microsystems, Inc.
Hung-Lin Yin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor chip device with solder diffusion protection
Patent number
8,759,962
Issue date
Jun 24, 2014
Advanced Micro Devices, Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joining method and semiconductor device manufacturing method
Patent number
8,746,538
Issue date
Jun 10, 2014
Mitsubishi Electric Corporation
Aya Muto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip device with solder diffusion protection
Patent number
8,299,633
Issue date
Oct 30, 2012
Advanced Micro Devices, Inc.
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Detection device and method for manufacturing the same
Patent number
8,174,118
Issue date
May 8, 2012
Sumitomo Electric Industries, Ltd
Youichi Nagai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for forming an underfill adhesive layer
Patent number
7,253,078
Issue date
Aug 7, 2007
National Semiconductor Corporation
Luu T. Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for forming an underfill adhesive layer
Patent number
6,352,881
Issue date
Mar 5, 2002
National Semiconductor Corporation
Luu Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240113066
Publication date
Apr 4, 2024
Sony Semiconductor Solutions Corporation
Takashi IMAHIGASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230369276
Publication date
Nov 16, 2023
Fuji Electric Co., Ltd.
Takashi SAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Display Device and Method of Manufacturing the Same
Publication number
20230215852
Publication date
Jul 6, 2023
LG Display Co., Ltd.
Byonghoo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Publication number
20220157761
Publication date
May 19, 2022
NANYA TECHNOLOGY CORPORATION
Sheng-Fu HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE PROCESS, DAF REPLACEMENT
Publication number
20220028819
Publication date
Jan 27, 2022
Western Digital Technologies, Inc.
Siqi ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Publication number
20200248040
Publication date
Aug 6, 2020
DUPONT ELECTRONICS, INC.
Yumi Matsuura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20180114766
Publication date
Apr 26, 2018
Mitsubishi Electric Corporation
Yosuke NAKATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20170301612
Publication date
Oct 19, 2017
Rohm Co., Ltd.
Motoharu HAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL DIE ATTACH METALLIZATION
Publication number
20140264868
Publication date
Sep 18, 2014
Cree, Inc.
Fabian Radulescu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20140217156
Publication date
Aug 7, 2014
MITSUBISHI ELECTRIC CORPORATION
Aya MUTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
Publication number
20140035168
Publication date
Feb 6, 2014
ROBERT BOSCH GmbH
Christoph Schelling
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
Publication number
20130313309
Publication date
Nov 28, 2013
Masayuki KITAJIMA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Package Structure and Substrate Bonding Method
Publication number
20130285248
Publication date
Oct 31, 2013
ASIA PACIFIC MICROSYSTEMS, INC.
Hung-Lin Yin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20130134210
Publication date
May 30, 2013
Aya Muto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION
Publication number
20130049229
Publication date
Feb 28, 2013
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
Publication number
20130001775
Publication date
Jan 3, 2013
Hideo Nishikubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURI...
Publication number
20120153461
Publication date
Jun 21, 2012
PANASONIC CORPORATION
Hidetoshi Kitaura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Chip Device with Solder Diffusion Protection
Publication number
20110147916
Publication date
Jun 23, 2011
Michael Z. Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
Publication number
20110081738
Publication date
Apr 7, 2011
Oki Data Corporation
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20100171097
Publication date
Jul 8, 2010
Sumitomo Electric Industries, Ltd.
Youichi NAGAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
Publication number
20060097354
Publication date
May 11, 2006
Mitsuhiko Ogihara
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS