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H01L2224/0347

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0347using a lift-off mask

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 12,170,207
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit features with obtuse angles and method of formin...
- Patent number 12,087,715
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,080,636
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Koichi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode containing a grating and methods of making the...
- Patent number 11,695,100
- Issue date Jul 4, 2023
- Nanosys, Inc.
- Zhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 11,616,129
- Issue date Mar 28, 2023
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit features with obtuse angles and method of formin...
- Patent number 11,495,558
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,430,670
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device load terminal
- Patent number 11,315,892
- Issue date Apr 26, 2022
- Infineon Technologies AG
- Roman Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with UBM and methods of forming
- Patent number 11,164,832
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,133,234
- Issue date Sep 28, 2021
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...
- Publication number 20240363561
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF
- Publication number 20240203920
- Publication date Jun 20, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THI...
- Publication number 20240178166
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
- Publication number 20240006421
- Publication date Jan 4, 2024
- HKC Corporation Limited
- ZHONGXIE XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20230386864
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230253269
- Publication date Aug 10, 2023
- Sony Semiconductor Solutions Corporation
- YUTAKA OOTAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING SAME, AND WAFER ON WAFE...
- Publication number 20230137875
- Publication date May 4, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuanhao GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Features with Obtuse Angles and Method of Formin...
- Publication number 20230116270
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
- Publication number 20220375767
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...
- Publication number 20220084921
- Publication date Mar 17, 2022
- Sony Semiconductor Solutions Corporation
- KOICHI IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20210335737
- Publication date Oct 28, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...
- Publication number 20210226107
- Publication date Jul 22, 2021
- GLO AB
- Zhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20210104416
- Publication date Apr 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Features with Obtuse Angles and Method of Formin...
- Publication number 20210074656
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Features With Obtuse Angles and Method Forming Same
- Publication number 20200161260
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND APPLICATION THEREFOR
- Publication number 20200098949
- Publication date Mar 26, 2020
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
- Publication number 20200066548
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

using a lift-off mask

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor devices and methods of forming same

Semiconductor device assembly with die support structures

Integrated circuit features with obtuse angles and method of formin...

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor product with interlocking metal-to-metal bonds and me...

Structure and method of forming a joint assembly

Multiple plated via arrays of different wire heights on a same subs...

Fingerprint sensor and manufacturing method thereof

Multi-metal contact structure

Stacked semiconductor devices and methods of forming same

Light emitting diode containing a grating and methods of making the...

Power semiconductor chip, method for producing a power semiconducto...

Contact photolithography-based nanopatterning using photoresist fea...

Semiconductor device bonding area including fused solder film and m...

Integrated circuit features with obtuse angles and method of formin...

Semiconductor device

Stacked semiconductor devices and methods of forming same

Fingerprint sensor and manufacturing method thereof

Structure and method of forming a joint assembly

Semiconductor device and bump formation process

Semiconductor package and method of fabricating the same

Power semiconductor device load terminal

Mechanisms for forming post-passivation interconnect structure

Interconnect crack arrestor structure and methods

Method of manufacturing wafer level low melting temperature interco...

Package with UBM and methods of forming

Methods for bump planarity control

Semiconductor device and semiconductor device manufacturing method

Multi-metal contact structure in microelectronic component

Semiconductor packages with an intermetallic layer

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

Structure and Method of Forming a Joint Assembly

PASSIVE ELEMENT AND ELECTRONIC DEVICE

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR DEVICE AND Manufacturing METHOD THEREOF

SEMICONDUCTOR PACKAGE CONDUCTIVE TERMINALS WITH REDUCED PLATING THI...

METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE

STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING SAME, AND WAFER ON WAFE...

Integrated Circuit Features with Obtuse Angles and Method of Formin...

Stacked Semiconductor Devices and Methods of Forming Same

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PAC...

MULTI-METAL CONTACT STRUCTURE

LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

Integrated Circuit Features with Obtuse Angles and Method of Formin...

SEMICONDUCTOR DEVICE

Interconnect Structures and Methods of Forming Same

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

Integrated Circuit Features With Obtuse Angles and Method Forming Same

Semiconductor Device and Bump Formation Process

LIGHT-EMITTING DIODE AND APPLICATION THEREFOR

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

Stacked Semiconductor Devices and Methods of Forming Same