using a powder

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CPC
H01L2224/27332

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27332using a powder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Multi-step processes for high temperature bonding and bonded substr...
- Patent number 10,043,731
- Issue date Aug 7, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,636,784
- Issue date May 2, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method for electronic component
- Patent number 9,355,987
- Issue date May 31, 2016
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip package
- Patent number 9,245,868
- Issue date Jan 26, 2016
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,142,493
- Issue date Sep 22, 2015
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a solder joint
- Patent number 8,925,793
- Issue date Jan 6, 2015
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,569,109
- Issue date Oct 29, 2013
- Infineon Technologies AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sintering silver paste material and method for bonding semiconducto...
- Patent number 8,303,854
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste of high thermal conductivity and electronic part u...
- Patent number 6,368,704
- Issue date Apr 9, 2002
- NEC Corporation
- Satoshi Murata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220045027
- Publication date Feb 10, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- SHOZO OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20200152352
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE
- Publication number 20170348806
- Publication date Dec 7, 2017
- Sumitomo Metal Mining Co., Ltd.
- Masato TAKAMORI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT
- Publication number 20170092611
- Publication date Mar 30, 2017
- Infineon Technologies Americas Corp.
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Step Processes For High Temperature Bonding And Bonded Substr...
- Publication number 20170062304
- Publication date Mar 2, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...
- Publication number 20150200177
- Publication date Jul 16, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
- Publication number 20140374775
- Publication date Dec 25, 2014
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140367701
- Publication date Dec 18, 2014
- Mitsubishi Electrict Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140001634
- Publication date Jan 2, 2014
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Metallic Film as Die Attach and Interconnect
- Publication number 20130256894
- Publication date Oct 3, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Gretchen Adema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
Method For Making A Solder Joint
- Publication number 20130175330
- Publication date Jul 11, 2013
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
- Publication number 20110290863
- Publication date Dec 1, 2011
- Ryoichi KAJIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED ALLOY SOLDER PASTE
- Publication number 20110268985
- Publication date Nov 3, 2011
- HONGWEN ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
- Publication number 20090242121
- Publication date Oct 1, 2009
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Nanoscale metal paste for interconnect and method of use
- Publication number 20070183920
- Publication date Aug 9, 2007
- Guo-Quan Lu
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Nano-metal composite made by deposition from colloidal suspensions
- Publication number 20050127134
- Publication date Jun 16, 2005
- Guo-Quan Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using a powder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Sintering materials and attachment methods using same

Low pressure sintering powder

Anisotropic electrically conductive film, method for producing same...

Electronic element and electronic device comprising the same

Conductive paste for bonding

Method for producing a connecting medium on an assembly partner, me...

Mixed alloy solder paste

Multi-step processes for high temperature bonding and bonded substr...

Mixed alloy solder paste

Electronic device and method for fabricating an electronic device

Electronic component and manufacturing method for electronic component

Method for manufacturing a chip package

Semiconductor device

Method for making a solder joint

Method for attaching a metal surface to a carrier, a method for att...

Sintering silver paste material and method for bonding semiconducto...

Conductive paste of high thermal conductivity and electronic part u...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

SOLDER PASTE

POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT

Multi-Step Processes For High Temperature Bonding And Bonded Substr...

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

Method for Producing a Connecting Medium on an Assembly Partner, Me...

WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Pre-Sintered Semiconductor Die Structure

CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE

Porous Metallic Film as Die Attach and Interconnect

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

Method For Making A Solder Joint

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...

MIXED ALLOY SOLDER PASTE

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...

Nanoscale metal paste for interconnect and method of use

Nano-metal composite made by deposition from colloidal suspensions