using a reflow oven

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H01L2224/8321

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8321using a reflow oven

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device resistant to thermal cracking and manufacturin...
- Patent number 11,581,247
- Issue date Feb 14, 2023
- Mitsubishi Electric Corporation
- Ryuichi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 11,430,723
- Issue date Aug 30, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronics assembly and method for embedding electrical...
- Patent number 11,172,572
- Issue date Nov 9, 2021
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 10,998,284
- Issue date May 4, 2021
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Acrylic composition for encapsulation, sheet material, laminated sh...
- Patent number 10,870,756
- Issue date Dec 22, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED backplane having planar bonding surfaces and method of making t...
- Patent number 10,707,190
- Issue date Jul 7, 2020
- GLO AB
- Tsun Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including support films
- Patent number 10,707,194
- Issue date Jul 7, 2020
- Japan Display Inc.
- Kazuhiro Odaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and die bonding method
- Patent number 10,615,144
- Issue date Apr 7, 2020
- Kaken Tech Co., Ltd.
- Shigeo Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic assembly with enhanced thermal dissipation
- Patent number 10,461,021
- Issue date Oct 29, 2019
- Deere & Company
- Robert K. Kinyanjui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement method for circuit carrier and circuit carrier
- Patent number 10,217,675
- Issue date Feb 26, 2019
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240136322
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20220415769
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP
- Publication number 20220259477
- Publication date Aug 18, 2022
- SOLVAY SPECIALTY POLYMERS ITALY S.P.A.
- Vito TORTELLI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20220115300
- Publication date Apr 14, 2022
- Mitsubishi Electric Corporation
- Ryuichi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...
- Publication number 20200010675
- Publication date Jan 9, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- SHIGERU YAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20190043793
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...
- Publication number 20180146547
- Publication date May 24, 2018
- Crane Electronics, Inc.
- Ernest Clyde Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180108640
- Publication date Apr 19, 2018
- Japan Display Inc.
- Kazuhiro ODAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Apparatuses For High Temperature Bonding Controlled Pro...
- Publication number 20170129031
- Publication date May 11, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Hannes Martin Hinrich Greve
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160351540
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Koji OGISO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
- Publication number 20160126197
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLACEMENT METHOD FOR CIRCUIT CARRIER AND CIRCUIT CARRIER
- Publication number 20150364384
- Publication date Dec 17, 2015
- A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung
- Andreas KARCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPT...
- Publication number 20150028084
- Publication date Jan 29, 2015
- FEW FAHRZEUGELEKTRIKWERK GMBH & CO. KG
- Andre Jenrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-Chip Semiconductor Power Device
- Publication number 20140284777
- Publication date Sep 25, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140217156
- Publication date Aug 7, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Aya MUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

using a reflow oven

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low pressure sintering powder

Semiconductor device with a semiconductor die embedded between an e...

Diffusion soldering with contaminant protection

Thermosetting resin composition, semiconductor device, and electric...

Diffusion soldering with contaminant protection

Adhesive for semiconductor device, and high productivity method for...

Semiconductor device resistant to thermal cracking and manufacturin...

Alternative compositions for high temperature soldering applications

Semiconductor device with a semiconductor die embedded between an e...

Multilayer electronics assembly and method for embedding electrical...

Bonded structure and method of manufacturing the same

Low pressure sintering powder

Acrylic composition for encapsulation, sheet material, laminated sh...

Semiconductor packaging structure and process

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Sintering pastes with high metal loading for semiconductor die atta...

LED backplane having planar bonding surfaces and method of making t...

Wafer level flat no-lead semiconductor packages and methods of manu...

Display device including support films

Engineered polymer-based electronic materials

Method for manufacturing semiconductor device including heating and...

Conductive paste and die bonding method

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Electronic assembly with enhanced thermal dissipation

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Wafer level flat no-lead semiconductor packages and methods of manu...

Placement method for circuit carrier and circuit carrier

Micro-transfer printing with volatile adhesive layer

Semiconductor packaging structure and process

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

POWER MODULE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

HEAT EXCHANGE METHOD USING FLUORINATED COMPOUNDS HAVING A LOW GWP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

DIE BONDING APPARATUS AND DIE BONDING METHOD

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

ACRYLIC COMPOSITION FOR ENCAPSULATION, SHEET MATERIAL, LAMINATED SH...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

DIE BONDING TO A BOARD

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

DIE BONDING APPARATUS AND DIE BONDING METHOD

Semiconductor Packaging Structure and Process

Methods And Apparatuses For High Temperature Bonding Controlled Pro...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE

PLACEMENT METHOD FOR CIRCUIT CARRIER AND CIRCUIT CARRIER

METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPT...

Anisotropic Conductive Adhesive with Reduced Migration

Multi-Chip Semiconductor Power Device

Semiconductor Device and Manufacturing Method Thereof

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Electrical Connecting Element and Method for Manufacturing the Same

JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD