using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/89using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86

Industries

Patents Grantslast 30 patents

Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,942,463
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyun Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,942,454
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package including promoters and method of manu...
- Patent number 11,923,274
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,876,077
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 11,854,795
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap
- Patent number 11,830,837
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridging apparatus
- Patent number 11,804,469
- Issue date Oct 31, 2023
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding semiconductor elements to a substrate, including...
- Patent number 11,776,933
- Issue date Oct 3, 2023
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,758,732
- Issue date Sep 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inactive structure on SoIC
- Patent number 11,756,933
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating LED module
- Patent number 11,728,371
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jihye Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,710,757
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Ohguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via design for stacking integrated circuits
- Patent number 11,705,449
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package structure
- Patent number 11,699,694
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 11,694,997
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING AN ELECTRONIC DEVICE
- Publication number 20240162186
- Publication date May 16, 2024
- STMicroelectronics (Crolles 2) SAS
- Sandrine LHOSTIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUI...
- Publication number 20240105643
- Publication date Mar 28, 2024
- Canon Kabushiki Kaisha
- Takeru Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM
- Publication number 20240087879
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006379
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Formed Through Package-In-Package Formation
- Publication number 20230387082
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230363169
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20230361086
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT FOR THERMAL DISPLACEMENT IN A MULTI-WAFER STACKED...
- Publication number 20230290755
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230268333
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Hyun Mog PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20230260938
- Publication date Aug 17, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Control for Package Formation
- Publication number 20230145063
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING PROMOTERS AND METHOD OF MANU...
- Publication number 20230088723
- Publication date Mar 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230087468
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...
- Publication number 20230078865
- Publication date Mar 16, 2023
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220384327
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inactive Structure on SOIC
- Publication number 20220367418
- Publication date Nov 17, 2022
- Taiwan Semicondutor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20220359646
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING HYBRID BONDED STRUCTURE
- Publication number 20220359601
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Tsung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20220359377
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220344293
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336395
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220336414
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...
- Publication number 20220328441
- Publication date Oct 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20220320048
- Publication date Oct 6, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS

using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Offset interposers for large-bottom packages and large-die package-...

Bond enhancement structure in microelectronics for trapping contami...

Via for semiconductor device connection and methods of forming the...

Method for producing a connection between component parts, and comp...

Semiconductor devices

Package and manufacturing method thereof

MEMS device having a metallization structure embedded in a dielectr...

Semiconductor device package including promoters and method of manu...

Semiconductor device and method of manufacturing the same

Integrate rinse module in hybrid bonding platform

Seal ring structures and methods of forming same

Conductive barrier direct hybrid bonding

Semiconductor package with air gap

3DIC formation with dies bonded to formed RDLs

Active bridging apparatus

Offset interposers for large-bottom packages and large-die package-...

Methods and structures for improved electrical contact between bond...

Stacking structure, package structure and method of fabricating the...

Methods of bonding semiconductor elements to a substrate, including...

Method of fabricating a semiconductor package

Semiconductor device, manufacturing method, solid state image senso...

Hybrid bonding contact structure of three-dimensional memory device

Inactive structure on SoIC

Semiconductor device with a protection mechanism and associated sys...

Method of fabricating LED module

Semiconductor package and method of fabricating the same

Through silicon via design for stacking integrated circuits

Method of manufacturing semiconductor package structure

Backside contact for thermal displacement in a multi-wafer stacked...

Integrated circuit bond pad with multi-material toothed structure

Patents Applicationslast 30 patents

METHOD OF FABRICATING AN ELECTRONIC DEVICE

CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUI...

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

System Formed Through Package-In-Package Formation

CHIP BONDING METHOD

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

BACKSIDE CONTACT FOR THERMAL DISPLACEMENT IN A MULTI-WAFER STACKED...

SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

Process Control for Package Formation

SEMICONDUCTOR DEVICE PACKAGE INCLUDING PROMOTERS AND METHOD OF MANU...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...

Semiconductor Device and Method of Manufacture

Inactive Structure on SOIC

BACKSIDE CAPACITOR TECHNIQUES

METHOD FOR FABRICATING HYBRID BONDED STRUCTURE

Via for Semiconductor Device Connection and Methods of Forming the...

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

PACKAGE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR ISOLATION OF BIT-LINE DRIVERS FOR A THREE-...

Wafer Level Integration of Passive Devices

3D Integrated Circuit and Methods of Forming the Same