using etching to form a recess at the gate location

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CPC
H01L29/66621

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/66621using etching to form a recess at the gate location

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,967,583
- Issue date Apr 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,967,628
- Issue date Apr 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,961,827
- Issue date Apr 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator device with partially recessed gate
- Patent number 11,948,977
- Issue date Apr 2, 2024
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate for an MV device
- Patent number 11,948,938
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,916,045
- Issue date Feb 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,869,952
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup device and method of tracking subject thereof
- Patent number 11,860,511
- Issue date Jan 2, 2024
- MAXELL, LTD.
- Hiroshi Shimizu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts for semiconductor devices and methods of forming the same
- Patent number 11,855,162
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with a recessed gate electrode that has high thickness unifo...
- Patent number 11,846,871
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Shu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor component and manufacturing method thereof
- Patent number 11,848,380
- Issue date Dec 19, 2023
- Sony Group Corporation
- Koichi Amari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,830,919
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with deeply depleted channel and manufacturing...
- Patent number 11,798,983
- Issue date Oct 24, 2023
- United Semiconductor Japan Co., Ltd.
- Fumitaka Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,784,082
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and method for manufacturing the same
- Patent number 11,784,232
- Issue date Oct 10, 2023
- Nippon Telegraph and Telephone Corporation
- Takuya Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,784,169
- Issue date Oct 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,735,462
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,728,429
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Yul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,710,788
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Kyujin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,676,945
- Issue date Jun 13, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,664,218
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Ting Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,652,100
- Issue date May 16, 2023
- Renesas Electronics Corporation
- Hiroyoshi Kudou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 11,646,309
- Issue date May 9, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20240128237
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240105490
- Publication date Mar 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
Contacts for Semiconductor Devices and Methods of Forming the Same
- Publication number 20240088244
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240088290
- Publication date Mar 14, 2024
- SONY GROUP CORPORATION
- Koichi Amari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND METHOD OF TRACKING SUBJECT THEREOF
- Publication number 20240069412
- Publication date Feb 29, 2024
- Maxell, Ltd.
- Hiroshi SHIMIZU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE WITH A RECESSED GATE ELECTRODE THAT HAS HIGH THICKNESS UNIFO...
- Publication number 20240061320
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Shu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20240055291
- Publication date Feb 15, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047542
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHIH-BIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRESHOLD VOLTAGE MODULATION BY GATE HEIGHT VARIATION
- Publication number 20240014256
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH DEEPLY DEPLETED...
- Publication number 20240014259
- Publication date Jan 11, 2024
- United Semiconductor Japan Co., Ltd.
- Fumitaka Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20230420283
- Publication date Dec 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230395572
- Publication date Dec 7, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20230386886
- Publication date Nov 30, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH AT LEAST TWO SINGLE-CR...
- Publication number 20230352333
- Publication date Nov 2, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20230343632
- Publication date Oct 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230335535
- Publication date Oct 19, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20230307283
- Publication date Sep 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH PERFORMANCE DEVICE WITH DOUBLE SIDE CONTACTS
- Publication number 20230282716
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230268321
- Publication date Aug 24, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING FORMING A RE...
- Publication number 20230260828
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Youngin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS
- Publication number 20230187414
- Publication date Jun 15, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20230187256
- Publication date Jun 15, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REPLACEMENT GATES
- Publication number 20230170243
- Publication date Jun 1, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20230170244
- Publication date Jun 1, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20230130626
- Publication date Apr 27, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REDUNDANCY
- Publication number 20230104210
- Publication date Apr 6, 2023
- Monolithic 3D Inc.
- Ziv Or-Bach
- G11 - INFORMATION STORAGE

using etching to form a recess at the gate location

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Manufacturing method of semiconductor structure

3D semiconductor device and structure with metal layers

Silicon on insulator device with partially recessed gate

Recessed gate for an MV device

3D semiconductor device and structure with bonding

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with memory

3D semiconductor device and structure with single-crystal layers

Semiconductor structure and method for forming same

Image pickup device and method of tracking subject thereof

Method for producing a 3D semiconductor device and structure with m...

Contacts for semiconductor devices and methods of forming the same

Methods for producing a 3D semiconductor device and structure with...

Device with a recessed gate electrode that has high thickness unifo...

Semiconductor component and manufacturing method thereof

Semiconductor device and method for fabricating the same

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

Semiconductor device with deeply depleted channel and manufacturing...

3D semiconductor device and structure with bonding

Field effect transistor and method for manufacturing the same

3D semiconductor device and structure with metal layers

3D semiconductor device and structure with single-crystal layers

Method of fabricating semiconductor device

Semiconductor device and method of fabricating the same

3D semiconductor device and structure with metal layers

Semiconductor device and method

Semiconductor device and method of manufacturing the same

3D semiconductor devices and structures with metal layers

Patents Applicationslast 30 patents

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

Contacts for Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREOF

IMAGE PICKUP DEVICE AND METHOD OF TRACKING SUBJECT THEREOF

DEVICE WITH A RECESSED GATE ELECTRODE THAT HAS HIGH THICKNESS UNIFO...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THRESHOLD VOLTAGE MODULATION BY GATE HEIGHT VARIATION

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH DEEPLY DEPLETED...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH AT LEAST TWO SINGLE-CR...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

HIGH PERFORMANCE DEVICE WITH DOUBLE SIDE CONTACTS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE INCLUDING FORMING A RE...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REPLACEMENT GATES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH REDUNDANCY