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H01L2224/82102

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82102using jetting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package
- Patent number 11,508,687
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning component carrier structure with known-good sections and c...
- Patent number 11,430,703
- Issue date Aug 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Control device
- Patent number 11,327,468
- Issue date May 10, 2022
- Omron Corporation
- Wakahiro Kawai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned structure for electronic device and manufacturing method...
- Patent number 10,818,497
- Issue date Oct 27, 2020
- Winbond Electronics Corp.
- Yen-Jui Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Interconnection structures and methods for transfer-printed integra...
- Patent number 10,418,331
- Issue date Sep 17, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 10,334,733
- Issue date Jun 25, 2019
- Omron Corporation
- Wakahiro Kawai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,951,382
- Issue date Apr 24, 2018
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structures and methods for transfer-printed integra...
- Patent number 9,899,329
- Issue date Feb 20, 2018
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 9,865,832
- Issue date Jan 9, 2018
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Preparation method of a thin power device
- Patent number 9,854,686
- Issue date Dec 26, 2017
- Alpha and Omega Semiconductor (Cayman) LTD
- Yuping Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective die electrical insulation by additive process
- Patent number 9,490,230
- Issue date Nov 8, 2016
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Interconnect Structure for High Power GaN Module
- Publication number 20210175195
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aligning Component Carrier Structure With Known-Good Sections and C...
- Publication number 20200357706
- Publication date Nov 12, 2020
- Marco Gavagnin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...
- Publication number 20180130751
- Publication date May 10, 2018
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...
- Publication number 20140327356
- Publication date Nov 6, 2014
- NITTO DENKO CORPORATION
- Takahiro Nakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...
- Publication number 20140267683
- Publication date Sep 18, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140167275
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Sang Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device with a Carrier Havin...
- Publication number 20140021634
- Publication date Jan 23, 2014
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130338046
- Publication date Dec 19, 2013
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...
- Publication number 20130328213
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS
- Publication number 20130265134
- Publication date Oct 10, 2013
- Glenn W. Gengel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130244379
- Publication date Sep 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Woojin CHANG
- H01 - BASIC ELECTRIC ELEMENTS

using jetting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for manufacturing display device

Method for producing an electrically conductive connection on a sub...

Light emitting diode display with redundancy scheme

Semiconductor package

Aligning component carrier structure with known-good sections and c...

Light emitting diode display with redundancy scheme

Control device

Light emitting diode display with redundancy scheme

Method and fixture for chip attachment to physical objects

Patterned structure for electronic device and manufacturing method...

System and method for the fluidic assembly of micro-LEDs utilizing...

Interconnection structures and methods for transfer-printed integra...

Light emitting diode display with redundancy scheme

Circuit structure

Laser assisted transfer welding process

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Conductive connections, structures with such connections, and metho...

Laminate electronic device

Methods and apparatus for measuring analytes using large scale FET...

Method and apparatus for printing integrated circuit bond connections

Interconnection structures and methods for transfer-printed integra...

Discrete device mounted on substrate

Light emitting diode display with redundancy scheme

Preparation method of a thin power device

Integrated circuit with printed bond connections

Semiconductor package with conductive clip

Conductive connections, structures with such connections, and metho...

Electrical connector between die pad and z-interconnect for stacked...

Selective die electrical insulation by additive process

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Circuits Including Micropatterns and Using Partial Curing to Adhere...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Interconnect Structure for High Power GaN Module

Aligning Component Carrier Structure With Known-Good Sections and C...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...

Method and apparatus for printing integrated circuit bond connections

EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME

Electronic Assembly with Three Dimensional Inkjet Printed Traces

INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...

DISCRETE DEVICE MOUNTED ON SUBSTRATE

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

LAMINATE ELECTRONIC DEVICE

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...

Electronic Assembly With Three Dimensional Inkjet Printed Traces

Method of Manufacturing a Semiconductor Device with a Carrier Havin...

MOUNT BOARD AND ELECTRONIC DEVICE

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...

RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME