using marks formed on the semiconductor or solid-state body

Industry

CPC
H01L2224/8213

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8213using marks formed on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process for semiconductor packaging and structures resu...
- Patent number 11,158,600
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,114,407
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,765,006
- Issue date Sep 1, 2020
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of measuring misalignment of chips, a method of fabricating...
- Patent number 10,720,365
- Issue date Jul 21, 2020
- Samsung Electronics Co., Ltd.
- Younghoon Sohn
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,163,857
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,085,345
- Issue date Sep 25, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 9,691,706
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and methods of making and using the same
- Patent number 9,666,516
- Issue date May 30, 2017
- General Electric Company
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device packaging using through-substrate posts
- Patent number 9,515,006
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting devices in substrate and device-mounting substra...
- Patent number 9,119,332
- Issue date Aug 25, 2015
- Sony Corporation
- Katsuhiro Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diode for a printable composition
- Patent number 9,105,812
- Issue date Aug 11, 2015
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing an electronic module
- Patent number 8,959,757
- Issue date Feb 24, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diode for a printable composition
- Patent number 8,723,408
- Issue date May 13, 2014
- NthDegree Technologies Worldwide Inc.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Diode for a printable composition
- Patent number 8,674,593
- Issue date Mar 18, 2014
- NthDegree Technologies Worldwide Inc.
- Mark D. Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Devices and methods for embedding semiconductors in printed circuit...
- Patent number 8,664,656
- Issue date Mar 4, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies and methods of forming electronic assemblies
- Patent number 8,523,071
- Issue date Sep 3, 2013
- intelliPaper, LLC
- Andrew DePaula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diode for a printable composition
- Patent number 8,415,879
- Issue date Apr 9, 2013
- NthDegree Technologies Worldwide Inc.
- Mark D. Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Module with embedded semiconductor IC and method of fabricating the...
- Patent number 7,547,975
- Issue date Jun 16, 2009
- TDK Corporation
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210398942
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY PROCESS FOR SEMICONDUCTOR PACKAGING AND STRUCTURES RESU...
- Publication number 20200105711
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190385975
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20190109118
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module
- Publication number 20180376597
- Publication date Dec 27, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component-Embedded Substrate Manufacturing Method and Component-Emb...
- Publication number 20140299367
- Publication date Oct 9, 2014
- Meiko Electronics Co., Ltd.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140291644
- Publication date Oct 2, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20140138666
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...
- Publication number 20140134760
- Publication date May 15, 2014
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGN...
- Publication number 20140061877
- Publication date Mar 6, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Fan Out Package and Methods of Forming the Same
- Publication number 20130187270
- Publication date Jul 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20130170147
- Publication date Jul 4, 2013
- RF Micro Devices, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20130168658
- Publication date Jul 4, 2013
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diode for a Printable Composition
- Publication number 20120161113
- Publication date Jun 28, 2012
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Diode for a Printable Composition
- Publication number 20120161112
- Publication date Jun 28, 2012
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Mark David Lowenthal
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Assemblies and Methods of Forming Electronic Assemblies
- Publication number 20120081868
- Publication date Apr 5, 2012
- Andrew DePaula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...
- Publication number 20110266039
- Publication date Nov 3, 2011
- SONY CORPORATION
- Katsuhiro TOMODA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module with embedded semiconductor IC and method of fabricating the...
- Publication number 20050029642
- Publication date Feb 10, 2005
- Minoru Takaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using marks formed on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package and manufacturing method thereof

Embedded packaging module and manufacturing method for the same

Lithography process for semiconductor packaging and structures resu...

Integrated fan-out package and manufacturing method thereof

Electronic module

Electronic module and method for producing same

Precision alignment of multi-chip high density interconnects

Multi-chip fan out package and methods of forming the same

Electronic module

Method of measuring misalignment of chips, a method of fabricating...

Method for producing a circuit board element

Multi-chip fan out package and methods of forming the same

Electronic module

Redistribution layer system in package

Multi-chip fan out package and methods of forming the same

Electronic packages and methods of making and using the same

Manufacturing method for component incorporated substrate and compo...

Component-embedded substrate manufacturing method

3D device packaging using through-substrate posts

Method of mounting devices in substrate and device-mounting substra...

Diode for a printable composition

Method of manufacturing an electronic module

Diode for a printable composition

Diode for a printable composition

Devices and methods for embedding semiconductors in printed circuit...

Electronic assemblies and methods of forming electronic assemblies

Diode for a printable composition

Module with embedded semiconductor IC and method of fabricating the...

Patents Applicationslast 30 patents

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

LITHOGRAPHY PROCESS FOR SEMICONDUCTOR PACKAGING AND STRUCTURES RESU...

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Chip Fan Out Package and Methods of Forming the Same

Electronic module

Apparatus and Associated Methods

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...

Component-Embedded Substrate Manufacturing Method and Component-Emb...

Diode for a Printable Composition

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Diode for a Printable Composition

DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...

WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGN...

Multi-Chip Fan Out Package and Methods of Forming the Same

RDL SYSTEM IN PACKAGE

Diode for a Printable Composition

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

Diode for a Printable Composition

Diode for a Printable Composition

Electronic Assemblies and Methods of Forming Electronic Assemblies

METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRA...

Module with embedded semiconductor IC and method of fabricating the...