using marks formed on the semiconductor or solid-state body

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H01L2224/8013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8013using marks formed on the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having multiple chips and method for manufacturing th...
- Patent number 11,942,466
- Issue date Mar 26, 2024
- Kioxia Corporation
- Mutsumi Okajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding interface
- Patent number 11,876,049
- Issue date Jan 16, 2024
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 11,862,599
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 11,817,338
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding semiconductor devices
- Patent number 11,756,921
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched wafer and bonding support structure to improve wafer stacking
- Patent number 11,682,652
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through semiconductor via and method for...
- Patent number 11,664,364
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method for fabricating the same
- Patent number 11,640,943
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Jung-A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel semiconductor device and structure with image sensors an...
- Patent number 11,605,663
- Issue date Mar 14, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 11,600,525
- Issue date Mar 7, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post bond inspection of devices for panel packaging
- Patent number 11,552,043
- Issue date Jan 10, 2023
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding alignment structure, chip bonding structure and method...
- Patent number 11,462,513
- Issue date Oct 4, 2022
- United Microelectronics Corp.
- Chin-Chia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having multiple chips and method for manufacturing th...
- Patent number 11,387,227
- Issue date Jul 12, 2022
- Kioxia Corporation
- Mutsumi Okajima
- G11 - INFORMATION STORAGE
Information Patent Grant
Alignment apparatus and method of manufacturing semiconductor device
- Patent number 11,387,131
- Issue date Jul 12, 2022
- Kioxia Corporation
- Miki Toshima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,373,981
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,367,712
- Issue date Jun 21, 2022
- Kioxia Corporation
- Takashi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and manufacturing apparatus for stacked substr...
- Patent number 11,362,059
- Issue date Jun 14, 2022
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,335,656
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding alignment marks at bonding in interface
- Patent number 11,289,422
- Issue date Mar 29, 2022
- Yangtze Memory Technologies Co., Ltd.
- Meng Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING
- Publication number 20240387336
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240297143
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240194637
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subsurface alignment metrology system for packaging applications
- Publication number 20240170317
- Publication date May 23, 2024
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ALIGNMENT APPARATUS AND METHOD FOR PACKAGING
- Publication number 20240079258
- Publication date Mar 7, 2024
- Korea Atomic Energy Research Institute
- Chang Goo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240055363
- Publication date Feb 15, 2024
- Kioxia Corporation
- Susumu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20240047257
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240030179
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD
- Publication number 20230402394
- Publication date Dec 14, 2023
- Yangtze Memory Technologies Co., Ltd.
- Chuanhai SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20230387071
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding to Alignment Marks with Dummy Alignment Marks
- Publication number 20230378122
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307412
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299010
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method and Bonded Device Structure
- Publication number 20230299041
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
- Publication number 20230275064
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230238353
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20230223377
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS AND MEMOR...
- Publication number 20230187397
- Publication date Jun 15, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME
- Publication number 20230163095
- Publication date May 25, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20230131499
- Publication date Apr 27, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230119548
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20230116581
- Publication date Apr 13, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS

using marks formed on the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanoscale-aligned three-dimensional stacked integrated circuit

Microdevice transfer setup and integration of micro-devices into sy...

Guide apparatus for transferring light-emitting devices onto a subs...

Bonding tool and bonding method thereof

Bond enhancement structure in microelectronics for trapping contami...

Wafer bonding apparatus and method

Memory device having multiple chips and method for manufacturing th...

Semiconductor device and method of manufacturing

Bonding alignment marks at bonding interface

Bonding to alignment marks with dummy alignment marks

Stacked semiconductor device

Bonding system and bonding method

Bonding apparatus and method of fabricating display device using th...

System and method for bonding semiconductor devices

Notched wafer and bonding support structure to improve wafer stacking

Semiconductor device with through semiconductor via and method for...

Semiconductor wafer and method for fabricating the same

Multilevel semiconductor device and structure with image sensors an...

Nanoscale-aligned three-dimensional stacked integrated circuit

Post bond inspection of devices for panel packaging

Chip bonding alignment structure, chip bonding structure and method...

Memory device having multiple chips and method for manufacturing th...

Alignment apparatus and method of manufacturing semiconductor device

Package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Manufacturing method and manufacturing apparatus for stacked substr...

Semiconductor device and method of manufacturing

Method of assembly by direct bonding between two elements, each ele...

Bond enhancement structure in microelectronics for trapping contami...

Bonding alignment marks at bonding in interface

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

BONDING TOOL AND BONDING METHOD THEREOF

STACKED SEMICONDUCTOR DEVICE

WAFER BONDING APPARATUS AND METHOD

Subsurface alignment metrology system for packaging applications

SEMICONDUCTOR CHIP ALIGNMENT APPARATUS AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

BONDING SYSTEM

BONDING TOOL AND BONDING METHOD THEREOF

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD

System and Method for Bonding Semiconductor Devices

Bonding to Alignment Marks with Dummy Alignment Marks

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Wafer Bonding Method and Bonded Device Structure

Wafer Bonding Method and Bonded Device Structure

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE

WAFER BONDING DEVICE AND WAFER BONDING METHOD

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH LOGIC CIRCUITS AND MEMOR...

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

DIE BONDING SYSTEMS, AND METHODS OF USING THE SAME

WAFER BONDING APPARATUS AND METHOD

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT