using means for applying energy being within the device

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81234using means for applying energy being within the device

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Patents Grantslast 30 patents

Information Patent Grant
Heated pins to couple with solder elements
- Patent number 11,830,846
- Issue date Nov 28, 2023
- Intel Corporation
- Feroz Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array as standby heater for reliability
- Patent number 11,488,839
- Issue date Nov 1, 2022
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with at least one voltage-guided conductive fi...
- Patent number 9,356,001
- Issue date May 31, 2016
- HGST Netherlands B.V.
- Luiz M. Franca-Neto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components using suspend...
- Patent number 9,165,915
- Issue date Oct 20, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 9,010,618
- Issue date Apr 21, 2015
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In system reflow of low temperature eutectic bond balls
- Patent number 8,671,560
- Issue date Mar 18, 2014
- Research Triangle Institute
- Robert O. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compress bonding
- Patent number 8,556,158
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic attachment structure
- Patent number 8,434,668
- Issue date May 7, 2013
- Intel Corporation
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and assembling method thereof
- Patent number 8,415,795
- Issue date Apr 9, 2013
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compress bonding
- Patent number 8,381,965
- Issue date Feb 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled electrical contacts
- Patent number 8,318,595
- Issue date Nov 27, 2012
- The United States of America as represented by the Secretary of the Army
- Christopher J. Morris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board incorporating a heating resistor
- Patent number 8,059,424
- Issue date Nov 15, 2011
- Hispano Suiza
- Bernard Glever
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding metallic terminals by using elastic contact
- Patent number 7,810,701
- Issue date Oct 12, 2010
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carrier including an integrated heater for die rework and w...
- Patent number 7,474,540
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, device mounting structure, device mounting method, a...
- Patent number 7,411,295
- Issue date Aug 12, 2008
- Fujitsu Limited
- Mitsuo Suehiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for wafer bonding by localized induction heating
- Patent number 7,332,411
- Issue date Feb 19, 2008
- Hewlett-Packard Development Company, L.P.
- James McKinnell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for separating electronic component from organic board
- Patent number 7,234,218
- Issue date Jun 26, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component installation, removal, and replacement apparatus and method
- Patent number 6,911,624
- Issue date Jun 28, 2005
- Micron Technology, Inc.
- Michel Koopmans
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the electrical and/or mechanical interconnection of comp...
- Patent number 6,423,938
- Issue date Jul 23, 2002
- STMicroelectronics S.r.l.
- Bruno Murari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro soldering method and apparatus
- Patent number 6,423,939
- Issue date Jul 23, 2002
- Agilent Technologies, Inc.
- Yaoling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit pad structure with high temperature heating elem...
- Patent number 5,951,893
- Issue date Sep 14, 1999
- Motorola, Inc.
- Gordon Bitko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self regulating temperature heater as an integral part of a printed...
- Patent number 5,010,233
- Issue date Apr 23, 1991
- AMP Incorporated
- Homer E. Henschen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit chip
- Patent number 4,582,975
- Issue date Apr 15, 1986
- Honeywell Inc.
- James M. Daughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit chip
- Patent number 4,506,139
- Issue date Mar 19, 1985
- Honeywell Inc.
- James M. Daughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control of solid state circuit chips
- Patent number 4,481,403
- Issue date Nov 6, 1984
- Honeywell Inc.
- Lou A. Del Monte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD
- Publication number 20220020723
- Publication date Jan 20, 2022
- Skiileux Electricity Inc.
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATED PINS TO COUPLE WITH SOLDER ELEMENTS
- Publication number 20200381388
- Publication date Dec 3, 2020
- Intel Corporation
- Feroz MOHAMMAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20180350767
- Publication date Dec 6, 2018
- Intel Corporation
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20170179069
- Publication date Jun 22, 2017
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT
- Publication number 20160099228
- Publication date Apr 7, 2016
- HGST NETHERLANDS B.V.
- Luiz M. FRANCA-NETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...
- Publication number 20140220737
- Publication date Aug 7, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20130224444
- Publication date Aug 29, 2013
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Compress Bonding
- Publication number 20130126591
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF
- Publication number 20120161336
- Publication date Jun 28, 2012
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Compress Bonding
- Publication number 20120018494
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ATTACHMENT STRUCTURE
- Publication number 20110278044
- Publication date Nov 17, 2011
- Aleksandar Aleksov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
In system reflow of low temperature eutectic bond balls
- Publication number 20110239456
- Publication date Oct 6, 2011
- siXis, Inc.
- Robert O. Conn
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100309643
- Publication date Dec 9, 2010
- Rene Todt
- G02 - OPTICS
Information Patent Application
Self-Assembled Electrical Contacts
- Publication number 20100139954
- Publication date Jun 10, 2010
- Christopher J. Morris
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT
- Publication number 20090250154
- Publication date Oct 8, 2009
- Alps Electric Co., Ltd.
- Shinichi Nagano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon Carrier Including An Integrated Heater For Die Rework And W...
- Publication number 20090178275
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC BOARD INCORPORATING A HEATING RESISTOR
- Publication number 20080187772
- Publication date Aug 7, 2008
- HISPANO-SUIZA
- Bernard Glever
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL WIRING DESIGN FOR MODULE REMOVAL AND REPLACEMENT FROM OR...
- Publication number 20060200965
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-reflowing printed circuit board and application methods
- Publication number 20060065431
- Publication date Mar 30, 2006
- Horacio Andres Trucco
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and methods for wafer bonding by localized induction heating
- Publication number 20060033201
- Publication date Feb 16, 2006
- James McKinnell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Circuit board, device mounting structure, device mounting method, a...
- Publication number 20050224971
- Publication date Oct 13, 2005
- FUJITSU LIMITED
- Mitsuo Suehiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component installation, removal, and replacement apparatus and method
- Publication number 20040035840
- Publication date Feb 26, 2004
- Michel Koopmans
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using means for applying energy being within the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heated pins to couple with solder elements

Reflowable grid array to support grid heating

Reflowable grid array as standby heater for reliability

Integrated circuit packages with temperature sensor traces

Mounted substrate, mounted-substrate production method, and mounted...

Flip chip interconnection with reduced current density

Semiconductor device with at least one voltage-guided conductive fi...

Flip-chip hybridization of microelectronic components using suspend...

Flip-chip hybridization of microelectronic components by local heat...

Magnetic attachment structure

In system reflow of low temperature eutectic bond balls

Thermal compress bonding

Magnetic attachment structure

Semiconductor device and assembling method thereof

Thermal compress bonding

Self-assembled electrical contacts

Electronic board incorporating a heating resistor

Method for bonding metallic terminals by using elastic contact

Silicon carrier including an integrated heater for die rework and w...

Circuit board, device mounting structure, device mounting method, a...

Systems and methods for wafer bonding by localized induction heating

Method for separating electronic component from organic board

Component installation, removal, and replacement apparatus and method

Method for the electrical and/or mechanical interconnection of comp...

Micro soldering method and apparatus

Integrated circuit pad structure with high temperature heating elem...

Self regulating temperature heater as an integral part of a printed...

Circuit chip

Circuit chip

Temperature control of solid state circuit chips

Patents Applicationslast 30 patents

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

CHIP-CARRYING STRUCTURE AND CHIP-BONDING METHOD

HEATED PINS TO COUPLE WITH SOLDER ELEMENTS

BALL GRID ARRAY SOLDER ATTACHMENT

BALL GRID ARRAY SOLDER ATTACHMENT

METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS USING SUSPEND...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

In System Reflow of Low Temperature Eutectic Bond Balls

MAGNETIC ATTACHMENT STRUCTURE

Thermal Compress Bonding

SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF

Thermal Compress Bonding

MAGNETIC ATTACHMENT STRUCTURE

In system reflow of low temperature eutectic bond balls

MULTI-CHIP HYBRID-MOUNTED DEVICE AND METHOD OF MANUFACTURING THE SAME

Self-Assembled Electrical Contacts

METHOD FOR BONDING METALLIC TERMINALS BY USING ELASTIC CONTACT

Silicon Carrier Including An Integrated Heater For Die Rework And W...

ELECTRONIC BOARD INCORPORATING A HEATING RESISTOR

ELECTRICAL WIRING DESIGN FOR MODULE REMOVAL AND REPLACEMENT FROM OR...

Self-reflowing printed circuit board and application methods

Systems and methods for wafer bonding by localized induction heating

Circuit board, device mounting structure, device mounting method, a...

Component installation, removal, and replacement apparatus and method