using means for thermal conduction connection in the thickness direction of the substrate

Industry

CPC
H05K1/0204

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0204using means for thermal conduction connection in the thickness direction of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
System for driving power devices
- Patent number 12,363,819
- Issue date Jul 15, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Lifeng Qiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assemblies
- Patent number 12,328,847
- Issue date Jun 10, 2025
- Ametek, Inc.
- Joo-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electrical circuitry in a quantum computing system
- Patent number 12,308,505
- Issue date May 20, 2025
- Rigetti & Co, LLC
- Tristan Ossama El Bouayadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control device
- Patent number 12,302,488
- Issue date May 13, 2025
- Hitachi Astemo, Ltd.
- Minami Teranishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure and an electronic device including the same
- Patent number 12,302,495
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yeonkyung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Support assembly, unit, and light module for a motor vehicle lighti...
- Patent number 12,267,944
- Issue date Apr 1, 2025
- HELLA GMBH & CO. KGAA
- Sebastian Bartscher
- F21 - LIGHTING
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electronic device assemblies having heat spreaders and electr...
- Patent number 12,238,906
- Issue date Feb 25, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink and electronic device
- Patent number 12,238,853
- Issue date Feb 25, 2025
- Huawei Technologies Co., Ltd.
- Hui Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,144,158
- Issue date Nov 12, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation apparatus and methods for UV-LED photoreactors
- Patent number 12,134,572
- Issue date Nov 5, 2024
- The University of British Columbia
- Fariborz Taghipour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory card and memory system
- Patent number 12,136,606
- Issue date Nov 5, 2024
- Kioxia Corporation
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-OLED display module thermal management
- Patent number 12,127,430
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an electronic board and a heat sink, and motor-fan unit...
- Patent number 12,108,519
- Issue date Oct 1, 2024
- Valeo Systemes Thermiques
- Ismaël Franco
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interposer for electronic device
- Patent number 12,108,576
- Issue date Oct 1, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wireless controllable lighting device
- Patent number 12,104,776
- Issue date Oct 1, 2024
- Lutron Technology Company LLC
- Ryan M. Bocock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing structure
- Patent number 12,096,550
- Issue date Sep 17, 2024
- DTECH PRECISION INDUSTRIES CO., LTD.
- Ting-Jui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics device assemblies including dual graphite layers...
- Patent number 12,096,596
- Issue date Sep 17, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermal Management Enhancement of Electronic Components
- Publication number 20250240867
- Publication date Jul 24, 2025
- Wolfspeed, Inc.
- Kenneth P. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board assembly
- Publication number 20250240868
- Publication date Jul 24, 2025
- COOLER MASTER TECHNOLOGY INC.
- Yi-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250240869
- Publication date Jul 24, 2025
- Murata Manufacturing Co., Ltd.
- Akihito NAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE-LEVEL THERMAL MANAGEMENT MECHANISM
- Publication number 20250234452
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Mark A. Tverdy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20250227850
- Publication date Jul 10, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...
- Publication number 20250203752
- Publication date Jun 19, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...
- Publication number 20250185151
- Publication date Jun 5, 2025
- NOF Corporation
- Toshinobu FUJIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING ASSEMBLY FOR CIRCUIT
- Publication number 20250168964
- Publication date May 22, 2025
- Schneider Electric (China) Co., Ltd.
- Zhibao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink Fixing Structure and Heat Dissipation Apparatus
- Publication number 20250125219
- Publication date Apr 17, 2025
- ZTE Corporation
- Weifeng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embeddable Electrically Insulating Thermal Connector and Circuit Bo...
- Publication number 20250106979
- Publication date Mar 27, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250089162
- Publication date Mar 13, 2025
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...
- Publication number 20250089153
- Publication date Mar 13, 2025
- Delta Electronics, Inc.
- Jui-Chien HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES
- Publication number 20250081327
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Mandar Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL UNIT
- Publication number 20250071882
- Publication date Feb 27, 2025
- HELLA GmbH & Co. KGaA
- Etienne Doyard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT IRRADIATING APPARATUS
- Publication number 20250026134
- Publication date Jan 23, 2025
- HOYA CORPORATION
- Norio KOBAYASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240422893
- Publication date Dec 19, 2024
- EPIRUS, INC.
- Shawn Warren Merritt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS
- Publication number 20240414837
- Publication date Dec 12, 2024
- Bitmain Technologies Inc.
- Shitao TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407077
- Publication date Dec 5, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS CONTROLLABLE LIGHTING DEVICE
- Publication number 20240401791
- Publication date Dec 5, 2024
- Lutron Technology Company LLC
- Ryan M. Bocock
- F21 - LIGHTING
Information Patent Application
GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...
- Publication number 20240397604
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...
- Publication number 20240373542
- Publication date Nov 7, 2024
- HELLA GmbH & Co. KGaA
- Sebastian BARTSCHER
- F21 - LIGHTING
Information Patent Application
COLD PLATE HAVING OPENING AND RELATED SYSTEMS
- Publication number 20240357729
- Publication date Oct 24, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...
- Publication number 20240332121
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FROM ACTIVE DEVICES CONNECTED TO CONNECTORS
- Publication number 20240334590
- Publication date Oct 3, 2024
- Reflex Photonics, Inc.
- David Robert Rolston
- H01 - BASIC ELECTRIC ELEMENTS

using means for thermal conduction connection in the thickness direction of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System for driving power devices

Circuit card assemblies

Baffles for electronic circuits immersed in cooling fluid in a tank

Connecting electrical circuitry in a quantum computing system

Electronic control device

Interposer structure and an electronic device including the same

Support assembly, unit, and light module for a motor vehicle lighti...

Component carrier with embedded semiconductor component and embedde...

Motor controller heat dissipating systems and methods

Power electronic device assemblies having heat spreaders and electr...

Circuit board and method for manufacturing the same

Heat sink and electronic device

Embeddable electrically insulating thermal connector and circuit bo...

Substrate for mounting electronic element, electronic device, and e...

Module

High powered RF part for improved manufacturability

Thermal Interface Material (TIM) filling structure for high warpage...

Power electronics assemblies having embedded power electronics devices

Electronic control of a compressor, compressor and cooling equipment

Electromagnetic interference shielding and thermal management syste...

Heat dissipation apparatus and methods for UV-LED photoreactors

Memory card and memory system

Micro-OLED display module thermal management

Flexible circuit board with thermally conductive connection to a he...

Assembly of an electronic board and a heat sink, and motor-fan unit...

Thermal interposer for electronic device

Wireless controllable lighting device

Fixing structure

Manufacturing method of insulated metal substrate

Power electronics device assemblies including dual graphite layers...

Patents Applicationslast 30 patents

Thermal Management Enhancement of Electronic Components

Printed circuit board assembly

ELECTRONIC DEVICE

MODULE-LEVEL THERMAL MANAGEMENT MECHANISM

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

Method for Embedding a Component in a Printed Circuit Board

Thermal Management in Circuit Board Assemblies

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND ME...

HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT BOARD, HEAT DI...

HEAT DISSIPATING ASSEMBLY FOR CIRCUIT

Heat Sink Fixing Structure and Heat Dissipation Apparatus

Embeddable Electrically Insulating Thermal Connector and Circuit Bo...

SUBSTRATE STRUCTURE

SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT B...

NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES

CONTROL UNIT

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

LIGHT IRRADIATING APPARATUS

ELECTRONIC SYSTEM ASSEMBLY

COMPUTING APPARATUS AND HEAT DISSIPATION APPARATUS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRELESS CONTROLLABLE LIGHTING DEVICE

GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

SUPPORT ASSEMBLY, UNIT, AND LIGHT MODULE FOR A MOTOR VEHICLE LIGHTI...

COLD PLATE HAVING OPENING AND RELATED SYSTEMS

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELE...

HEAT DISSIPATION FROM ACTIVE DEVICES CONNECTED TO CONNECTORS