using semiconductor on insulator [SOI] technology

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H01L21/7624

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7624using semiconductor on insulator [SOI] technology

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bulk nanosheet with dielectric isolation
- Patent number 12,369,367
- Issue date Jul 22, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating germanium/silicon on insulator in radio freq...
- Patent number 12,362,225
- Issue date Jul 15, 2025
- Indian Institute of Technology Bombay
- Udayan Ganguly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,362,189
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,354,882
- Issue date Jul 8, 2025
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 12,349,384
- Issue date Jul 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTUIRNG CO., LTD.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing isolation structure of hybrid epitaxial ar...
- Patent number 12,308,281
- Issue date May 20, 2025
- Shanghai Huali Integrated Circuit Corporation
- Yongyue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 12,308,287
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including element isolation film and method fo...
- Patent number 12,310,004
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Tae Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of single crystal semiconductors using planar vapor liqui...
- Patent number 12,266,526
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-bit weight cell for neuromorphic computing
- Patent number 12,260,324
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Borna J. Obradovic
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,249,660
- Issue date Mar 11, 2025
- Kabushiki Kaisha Toshiba
- Kumiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut-fin isolation regions and method forming same
- Patent number 12,237,416
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,230,509
- Issue date Feb 18, 2025
- United Microelectronics Corp.
- Ming Thai Chai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,703
- Issue date Oct 22, 2024
- Renesas Electronics Corporation
- Shibun Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 12,074,036
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap spacer for backside contact structure
- Patent number 12,046,644
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,046,505
- Issue date Jul 23, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator wafer with cavity structures
- Patent number 12,027,580
- Issue date Jul 2, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,009,251
- Issue date Jun 11, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor using elastic edge relaxation of a stressor...
- Patent number 11,978,800
- Issue date May 7, 2024
- ACORN SEMI, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a polysilicon SOI substrate including a ca...
- Patent number 11,978,658
- Issue date May 7, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,978,659
- Issue date May 7, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 11,948,998
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,948,830
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 11,935,781
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...
- Publication number 20250226217
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Martin Christopher Holland
- C30 - CRYSTAL GROWTH
Information Patent Application
DEVICE WITH ELECTRICAL COMPONENT FORMED OVER A CAVITY AND METHOD TH...
- Publication number 20250210409
- Publication date Jun 26, 2025
- NXP USA, Inc.
- Philippe RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE DEVICE REGIONS AND METHOD OF FAB...
- Publication number 20250203987
- Publication date Jun 19, 2025
- NXP USA, Inc.
- Jianwei Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Backside Power Rails
- Publication number 20250185330
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT-FIN ISOLATION REGIONS AND METHOD FORMING SAME
- Publication number 20250159924
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250149344
- Publication date May 8, 2025
- UNITED MICROELECTRONICS CORP.
- MING THAI CHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
- Publication number 20250063821
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...
- Publication number 20250056858
- Publication date Feb 13, 2025
- SOITEC
- Christelle Veytizou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054808
- Publication date Feb 13, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250006744
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387171
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387182
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...
- Publication number 20240379651
- Publication date Nov 14, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Peng GOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...
- Publication number 20240371883
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240355669
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Yasutaka MIZOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR BASED ON COMPACT DRAIN AND HETERO-MATERIAL STRUCTURE
- Publication number 20240322031
- Publication date Sep 26, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Jea Gun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES
- Publication number 20240297216
- Publication date Sep 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. STAMPER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR SOI
- Publication number 20240297091
- Publication date Sep 5, 2024
- Qorvo US, Inc.
- Baker Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20240250152
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...
- Publication number 20240250172
- Publication date Jul 25, 2024
- Acorn Semi, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240243006
- Publication date Jul 18, 2024
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING...
- Publication number 20240186180
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240105592
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Masaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SOI WAFER
- Publication number 20240038581
- Publication date Feb 1, 2024
- Korea Advanced Institute of Science and Technology
- Jungchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...
- Publication number 20240030282
- Publication date Jan 25, 2024
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...
- Publication number 20240030027
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20230369418
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS

using semiconductor on insulator [SOI] technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bulk nanosheet with dielectric isolation

Method for fabricating germanium/silicon on insulator in radio freq...

Semiconductor devices and methods of manufacturing thereof

Semiconductor structure and method for forming the same

Isolation structures in multi-gate semiconductor devices and method...

Method for manufacturing isolation structure of hybrid epitaxial ar...

Integrated circuit structure with backside dielectric layer having...

Semiconductor device including element isolation film and method fo...

Formation of single crystal semiconductors using planar vapor liqui...

Monolithic multi-bit weight cell for neuromorphic computing

Semiconductor device

Cut-fin isolation regions and method forming same

Method for fabricating semiconductor device

Method of forming backside power rails

Backside electrical contacts to buried power rails

RF devices with enhanced performance and methods of forming the sam...

Method of manufacturing semiconductor device

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Gap spacer for backside contact structure

RF devices with enhanced performance and methods of forming the sam...

Semiconductor on insulator wafer with cavity structures

Methods of forming material within openings extending into a semico...

RF devices with enhanced performance and methods of forming the sam...

Strained semiconductor using elastic edge relaxation of a stressor...

Method for manufacturing a polysilicon SOI substrate including a ca...

RF devices with enhanced performance and methods of forming the sam...

Isolation structures in multi-gate semiconductor devices and method...

RF devices with enhanced performance and methods of forming the sam...

Radio frequency silicon on insulator structure with superior perfor...

Integrated circuit structure with backside dielectric layer having...

Patents Applicationslast 30 patents

FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...

DEVICE WITH ELECTRICAL COMPONENT FORMED OVER A CAVITY AND METHOD TH...

SEMICONDUCTOR DEVICE WITH MULTIPLE DEVICE REGIONS AND METHOD OF FAB...

Method Of Forming Backside Power Rails

CUT-FIN ISOLATION REGIONS AND METHOD FORMING SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE

GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...

SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...

METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

TRANSISTOR BASED ON COMPACT DRAIN AND HETERO-MATERIAL STRUCTURE

Methods of Forming Material Within Openings Extending into a Semico...

SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES

HEAT SINK FOR SOI

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING...

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

ISOLATOR

METHOD OF MANUFACTURING SOI WAFER

BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...

FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...

Method of Forming Backside Power Rails