using semiconductor on insulator [SOI] technology

Industry

CPC
H01L21/7624

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7624using semiconductor on insulator [SOI] technology

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method of forming backside power rails
- Patent number 12,224,324
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,703
- Issue date Oct 22, 2024
- Renesas Electronics Corporation
- Shibun Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 12,074,036
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap spacer for backside contact structure
- Patent number 12,046,644
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,046,505
- Issue date Jul 23, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator wafer with cavity structures
- Patent number 12,027,580
- Issue date Jul 2, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,009,251
- Issue date Jun 11, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained semiconductor using elastic edge relaxation of a stressor...
- Patent number 11,978,800
- Issue date May 7, 2024
- ACORN SEMI, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a polysilicon SOI substrate including a ca...
- Patent number 11,978,658
- Issue date May 7, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,978,659
- Issue date May 7, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 11,948,998
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,948,830
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 11,935,781
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator with crystalline silicon oxide
- Patent number 11,923,236
- Issue date Mar 5, 2024
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
- Patent number 11,887,885
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a CFET device
- Patent number 11,876,020
- Issue date Jan 16, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical detection element and GOI device for ultra-small on-chip op...
- Patent number 11,860,109
- Issue date Jan 2, 2024
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,854,816
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FDSOI device structure and preparation method thereof
- Patent number 11,855,212
- Issue date Dec 26, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,837,497
- Issue date Dec 5, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator
- Patent number 11,817,346
- Issue date Nov 14, 2023
- Kabushiki Kaisha Toshiba
- Akira Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,817,345
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,804,518
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jungmin Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure with shared well
- Patent number 11,798,948
- Issue date Oct 24, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Kaustubh Shanbhag
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...
- Publication number 20250056858
- Publication date Feb 13, 2025
- SOITEC
- Christelle Veytizou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054808
- Publication date Feb 13, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250006744
- Publication date Jan 2, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387171
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387182
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...
- Publication number 20240379651
- Publication date Nov 14, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Peng GOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...
- Publication number 20240371883
- Publication date Nov 7, 2024
- ATOMERA INCORPORATED
- DONGHUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240355669
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Yasutaka MIZOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR BASED ON COMPACT DRAIN AND HETERO-MATERIAL STRUCTURE
- Publication number 20240322031
- Publication date Sep 26, 2024
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Jea Gun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES
- Publication number 20240297216
- Publication date Sep 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. STAMPER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR SOI
- Publication number 20240297091
- Publication date Sep 5, 2024
- Qorvo US, Inc.
- Baker Scott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...
- Publication number 20240250152
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...
- Publication number 20240250172
- Publication date Jul 25, 2024
- Acorn Semi, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
- Publication number 20240243006
- Publication date Jul 18, 2024
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING...
- Publication number 20240186180
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240105592
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Masaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SOI WAFER
- Publication number 20240038581
- Publication date Feb 1, 2024
- Korea Advanced Institute of Science and Technology
- Jungchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...
- Publication number 20240030282
- Publication date Jan 25, 2024
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...
- Publication number 20240030027
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20230369418
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
- Publication number 20230360962
- Publication date Nov 9, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Kurt Moen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230352339
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structure of MOS Transistors Having Different Working Vo...
- Publication number 20230335641
- Publication date Oct 19, 2023
- Shanghai Huali Intergrated Circuit Corporation
- Qi Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298889
- Publication date Sep 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Shibun TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET ISOLATION STRUCTURE
- Publication number 20230261111
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SIMULTANEOUS GENERATION OF A TRAP-RICH LAYER AND A BOX...
- Publication number 20230245922
- Publication date Aug 3, 2023
- pSemi Corporation
- Sebastien KOUASSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230223276
- Publication date Jul 13, 2023
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS

using semiconductor on insulator [SOI] technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming backside power rails

Backside electrical contacts to buried power rails

RF devices with enhanced performance and methods of forming the sam...

Method of manufacturing semiconductor device

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Gap spacer for backside contact structure

RF devices with enhanced performance and methods of forming the sam...

Semiconductor on insulator wafer with cavity structures

Methods of forming material within openings extending into a semico...

RF devices with enhanced performance and methods of forming the sam...

Strained semiconductor using elastic edge relaxation of a stressor...

Method for manufacturing a polysilicon SOI substrate including a ca...

RF devices with enhanced performance and methods of forming the sam...

Isolation structures in multi-gate semiconductor devices and method...

RF devices with enhanced performance and methods of forming the sam...

Radio frequency silicon on insulator structure with superior perfor...

Integrated circuit structure with backside dielectric layer having...

Silicon-on-insulator with crystalline silicon oxide

Radio frequency silicon on insulator wafer platform with superior p...

Method for manufacturing a CFET device

Optical detection element and GOI device for ultra-small on-chip op...

Semiconductor devices and methods of manufacturing thereof

FDSOI device structure and preparation method thereof

Semiconductor structure with an air gap

Wafer scale bonded active photonics interposer

Semiconductor device

Isolator

Multiple thickness semiconductor-on-insulator field effect transist...

Semiconductor device and method of manufacturing the same

Semiconductor structure with shared well

Patents Applicationslast 30 patents

GROUP III-NITRIDE SEMICONDUCTOR STRUCTURE ON SILICON-ON-INSULATOR A...

SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...

METHODS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING LOCALIZED SEMICO...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

TRANSISTOR BASED ON COMPACT DRAIN AND HETERO-MATERIAL STRUCTURE

SEMICONDUCTOR ON INSULATOR WAFER WITH CAVITY STRUCTURES

HEAT SINK FOR SOI

Methods of Forming Material Within Openings Extending into a Semico...

ISOLATION STRUCTURES IN MULTI-GATE SEMICONDUCTOR DEVICES AND METHOD...

STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE DIELECTRIC LAYER HAVING...

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

ISOLATOR

METHOD OF MANUFACTURING SOI WAFER

BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...

FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...

Method of Forming Backside Power Rails

SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Integrated Structure of MOS Transistors Having Different Working Vo...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FINFET ISOLATION STRUCTURE

METHODS FOR SIMULTANEOUS GENERATION OF A TRAP-RICH LAYER AND A BOX...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME