using semiconductor on insulator [SOI] technology

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CPC
H01L21/7624

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/7624using semiconductor on insulator [SOI] technology

Industries

Patents Grantslast 30 patents

Information Patent Grant
Strained semiconductor using elastic edge relaxation of a stressor...
- Patent number 11,978,800
- Issue date May 7, 2024
- ACORN SEMI, LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a polysilicon SOI substrate including a ca...
- Patent number 11,978,658
- Issue date May 7, 2024
- Robert Bosch GmbH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,978,659
- Issue date May 7, 2024
- Qorvo US, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures in multi-gate semiconductor devices and method...
- Patent number 11,948,998
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,948,830
- Issue date Apr 2, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator structure with superior perfor...
- Patent number 11,942,360
- Issue date Mar 26, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside dielectric layer having...
- Patent number 11,935,781
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator with crystalline silicon oxide
- Patent number 11,923,236
- Issue date Mar 5, 2024
- TURUN YLIOPISTO
- Pekka Laukkanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon on insulator wafer platform with superior p...
- Patent number 11,887,885
- Issue date Jan 30, 2024
- GlobalWafers Co., Ltd.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a CFET device
- Patent number 11,876,020
- Issue date Jan 16, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical detection element and GOI device for ultra-small on-chip op...
- Patent number 11,860,109
- Issue date Jan 2, 2024
- Korea Advanced Institute of Science and Technology
- Sanghyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FDSOI device structure and preparation method thereof
- Patent number 11,855,212
- Issue date Dec 26, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,854,816
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,837,497
- Issue date Dec 5, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator
- Patent number 11,817,346
- Issue date Nov 14, 2023
- Kabushiki Kaisha Toshiba
- Akira Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple thickness semiconductor-on-insulator field effect transist...
- Patent number 11,817,345
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,804,518
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jungmin Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure with shared well
- Patent number 11,798,948
- Issue date Oct 24, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Kaustubh Shanbhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of single crystal semiconductors using planar vapor liqui...
- Patent number 11,784,045
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Martin Christopher Holland
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for manufacturing body-source-tied SOI transistor
- Patent number 11,756,823
- Issue date Sep 12, 2023
- Newport Fab, LLC
- Allan K Calvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures with well boundary distal to substrat...
- Patent number 11,749,671
- Issue date Sep 5, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Kaustubh Shanbhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked field effect transistors
- Patent number 11,728,348
- Issue date Aug 15, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming backside power rails
- Patent number 11,728,394
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,721,576
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of radiofrequency device including mold compou...
- Patent number 11,715,709
- Issue date Aug 1, 2023
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor-on-insulator (SOI) substrate
- Patent number 11,710,656
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 11,705,362
- Issue date Jul 18, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,705,361
- Issue date Jul 18, 2023
- Renesas Electronics Corporation
- Hitoshi Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240105592
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Masaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SOI WAFER
- Publication number 20240038581
- Publication date Feb 1, 2024
- Korea Advanced Institute of Science and Technology
- Jungchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...
- Publication number 20240030282
- Publication date Jan 25, 2024
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...
- Publication number 20240030027
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Martin Christopher Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Backside Power Rails
- Publication number 20230369418
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
- Publication number 20230360962
- Publication date Nov 9, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Kurt Moen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230352339
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structure of MOS Transistors Having Different Working Vo...
- Publication number 20230335641
- Publication date Oct 19, 2023
- Shanghai Huali Intergrated Circuit Corporation
- Qi Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298889
- Publication date Sep 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Shibun TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET ISOLATION STRUCTURE
- Publication number 20230261111
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SIMULTANEOUS GENERATION OF A TRAP-RICH LAYER AND A BOX...
- Publication number 20230245922
- Publication date Aug 3, 2023
- pSemi Corporation
- Sebastien KOUASSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230223276
- Publication date Jul 13, 2023
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFOR...
- Publication number 20230215759
- Publication date Jul 6, 2023
- GLOBALWAFERS CO., LTD.
- Michael R. Seacrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bulk Nanosheet with Dielectric Isolation
- Publication number 20230197781
- Publication date Jun 22, 2023
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAM...
- Publication number 20230163021
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR...
- Publication number 20230154748
- Publication date May 18, 2023
- Shin-Etsu Handotai Co., Ltd.
- Miho NIITANI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20230154761
- Publication date May 18, 2023
- Shin-Etsu Handotai Co., Ltd.
- Hiroji AGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230155038
- Publication date May 18, 2023
- Kabushiki Kaisha Toshiba
- Kumiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF SURFACE TREATMENT OF SOI WAFER
- Publication number 20230133916
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Isolation Structure of Hybrid Epitaxial Ar...
- Publication number 20230132891
- Publication date May 4, 2023
- Shanghai Huali Integrated Circuit Corporation
- Yongyue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body-Source-Tied Transistor
- Publication number 20230128785
- Publication date Apr 27, 2023
- NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR
- Allan K. Calvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20230126031
- Publication date Apr 27, 2023
- Shanghai Huali Integrated Circuit Corporation
- Zhonghua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...
- Publication number 20230088569
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ELECTRICAL CONTACTS TO BURIED POWER RAILS
- Publication number 20230093101
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Ruilong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR DEVICE WITH LIGHTLY DOPED EXTENSION REGION
- Publication number 20230075374
- Publication date Mar 9, 2023
- Ralf Rudolf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESIS...
- Publication number 20230072964
- Publication date Mar 9, 2023
- GLOBALWAFERS CO., LTD.
- Igor Peidous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230067984
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SILICON ON INSULATOR WAFER PLATFORM WITH SUPERIOR P...
- Publication number 20230062816
- Publication date Mar 2, 2023
- GLOBALWAFERS CO., LTD.
- Michael R. Seacrist
- C30 - CRYSTAL GROWTH
Information Patent Application
STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...
- Publication number 20230020403
- Publication date Jan 19, 2023
- Acorn Semi, LLC
- Paul A. Clifton
- H01 - BASIC ELECTRIC ELEMENTS

using semiconductor on insulator [SOI] technology

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Strained semiconductor using elastic edge relaxation of a stressor...

Method for manufacturing a polysilicon SOI substrate including a ca...

RF devices with enhanced performance and methods of forming the sam...

Isolation structures in multi-gate semiconductor devices and method...

RF devices with enhanced performance and methods of forming the sam...

Radio frequency silicon on insulator structure with superior perfor...

Integrated circuit structure with backside dielectric layer having...

Silicon-on-insulator with crystalline silicon oxide

Radio frequency silicon on insulator wafer platform with superior p...

Method for manufacturing a CFET device

Optical detection element and GOI device for ultra-small on-chip op...

FDSOI device structure and preparation method thereof

Semiconductor devices and methods of manufacturing thereof

Semiconductor structure with an air gap

Wafer scale bonded active photonics interposer

Semiconductor device

Isolator

Multiple thickness semiconductor-on-insulator field effect transist...

Semiconductor device and method of manufacturing the same

Semiconductor structure with shared well

Formation of single crystal semiconductors using planar vapor liqui...

Method for manufacturing body-source-tied SOI transistor

Integrated circuit structures with well boundary distal to substrat...

Vertically stacked field effect transistors

Method of forming backside power rails

Semiconductor devices and methods of manufacturing thereof

Manufacturing method of radiofrequency device including mold compou...

Method of forming semiconductor-on-insulator (SOI) substrate

RF devices with enhanced performance and methods of forming the sam...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

ISOLATOR

METHOD OF MANUFACTURING SOI WAFER

BULK SEMICONDUCTOR SUBSTRATE WITH FULLY ISOLATED SINGLE-CRYSTALLINE...

FORMATION OF SINGLE CRYSTAL SEMICONDUCTORS USING PLANAR VAPOR LIQUI...

Method of Forming Backside Power Rails

SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

Integrated Structure of MOS Transistors Having Different Working Vo...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

FINFET ISOLATION STRUCTURE

METHODS FOR SIMULTANEOUS GENERATION OF A TRAP-RICH LAYER AND A BOX...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFOR...

Bulk Nanosheet with Dielectric Isolation

RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAM...

METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING SOI WAFER

SEMICONDUCTOR DEVICE

PROCESS OF SURFACE TREATMENT OF SOI WAFER

Method for Manufacturing Isolation Structure of Hybrid Epitaxial Ar...

Body-Source-Tied Transistor

FDSOI DEVICE STRUCTURE AND PREPARATION METHOD THEREOF

RADIO-FREQUENCY INTEGRATED CIRCUITS (RFICS) INCLUDING A POROSIFIED...

BACKSIDE ELECTRICAL CONTACTS TO BURIED POWER RAILS

SEMICONDUCTOR-ON-INSULATOR DEVICE WITH LIGHTLY DOPED EXTENSION REGION

SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESIS...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

RADIO FREQUENCY SILICON ON INSULATOR WAFER PLATFORM WITH SUPERIOR P...

STRAINED SEMICONDUCTOR USING ELASTIC EDGE RELAXATION OF A STRESSOR...