using tape automated bonding [TAB]

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H01L2224/86

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/86using tape automated bonding [TAB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,696,402
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,664,313
- Issue date May 30, 2023
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,457,531
- Issue date Sep 27, 2022
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,347,120
- Issue date May 31, 2022
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup apparatus, endoscope, and method for manufacturing ima...
- Patent number 11,134,829
- Issue date Oct 5, 2021
- Olympus Corporation
- Takuro Suyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 11,069,664
- Issue date Jul 20, 2021
- LUMENS CO., LTD.
- Daewon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 11,056,467
- Issue date Jul 6, 2021
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device including fiber-containing build-up layers
- Patent number 11,004,792
- Issue date May 11, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Adhesive substrate, transfer device having adhesive substrate, and...
- Patent number 10,818,618
- Issue date Oct 27, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,782,573
- Issue date Sep 22, 2020
- Samsung Display Co., Ltd.
- Han Ho Park
- G02 - OPTICS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,643,942
- Issue date May 5, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
- Patent number 10,529,685
- Issue date Jan 7, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
- Patent number 10,522,510
- Issue date Dec 31, 2019
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through silicon vias and package-level c...
- Patent number 10,483,241
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Kevin G. Duesman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,468,342
- Issue date Nov 5, 2019
- Compass Technology Company, Ltd.
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 10,306,763
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,303,017
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated electrical assembly
- Patent number 9,992,875
- Issue date Jun 5, 2018
- Semblant Limited
- Elizabeth Williams-Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 9,974,175
- Issue date May 15, 2018
- Samsung Display Co., Ltd.
- Han-Sung Bae
- G02 - OPTICS
Information Patent Grant
Display panel, electronic device including the same, and bonding me...
- Patent number 9,894,792
- Issue date Feb 13, 2018
- Samsung Display Co., Ltd.
- Han Sung Bae
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
- Publication number 20230087198
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE INCLUDING FIBER-CONTAINING BUILD-UP LAYERS
- Publication number 20210242132
- Publication date Aug 5, 2021
- Intel Corporation
- Sri Chaitra Jyotsna CHAVALI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING APPARATUS
- Publication number 20190206829
- Publication date Jul 4, 2019
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20180263116
- Publication date Sep 13, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20180226376
- Publication date Aug 9, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20180149901
- Publication date May 31, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
- Publication number 20180151541
- Publication date May 31, 2018
- Intel Corporation
- Kimin JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with chip for the high-frequency range
- Publication number 20150181712
- Publication date Jun 25, 2015
- ROHDE & SCHWARZ GMBH & CO. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130187259
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
- Publication number 20120157804
- Publication date Jun 21, 2012
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method for Connecting a Die Assembly to a Substrate in an Integrate...
- Publication number 20110097848
- Publication date Apr 28, 2011
- Alvin Seah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING APPARATUS AND METHOD
- Publication number 20110023296
- Publication date Feb 3, 2011
- Nobuhiko Muraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC ALIGNMENT OF SUBSTRATE INTERCONNECT TO SEMICONDUCTOR DIE
- Publication number 20080248612
- Publication date Oct 9, 2008
- LSI Corporation
- Gary S. Delp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20080017973
- Publication date Jan 24, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SEMICONDUCTOR DEVICE
- Publication number 20070272994
- Publication date Nov 29, 2007
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Write™ System
- Publication number 20070181060
- Publication date Aug 9, 2007
- Optomec Design Company
- Michael J. Renn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for making stacked integrated circuits (ICs) using prepackag...
- Publication number 20070102803
- Publication date May 10, 2007
- Irvine Sensors Corporation
- Keith D. Gann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Asymmetric alignment of substrate interconnect to semiconductor die
- Publication number 20070096303
- Publication date May 3, 2007
- LSI Logic Corporation
- Gary S. Delp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic-part built-in substrate and manufacturing method therefor
- Publication number 20070096292
- Publication date May 3, 2007
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD HAVING ELECTRONIC PARTS MOUNTED BY USING UNDER-FILL MATERIAL...
- Publication number 20070045867
- Publication date Mar 1, 2007
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring board
- Publication number 20070044303
- Publication date Mar 1, 2007
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using tape automated bonding [TAB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component, electric device including the same, and bondi...

Display device

Electronic component, electric device including the same, and bondi...

Microelectronic device including fiber-containing build-up layers

Electronic component, electric device including the same, and bondi...

Bonding and indexing apparatus

Display device

Apparatus and method for transferring semiconductor devices from a...

Image pickup apparatus, endoscope, and method for manufacturing ima...

Micro-LED module and method for fabricating the same

Semiconductor devices with through silicon vias and package-level c...

Semiconductor packages with an intermetallic layer

Microelectronic device including fiber-containing build-up layers

Chip-on film and display device including the same

High-speed, high-resolution electrophysiology in-vivo using conform...

Adhesive substrate, transfer device having adhesive substrate, and...

Display device

Power electronics assembly having an adhesion layer, and method for...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Apparatus for the material-bonded connection of connection partners...

Apparatus and method for transfering semiconductor devices from a s...

Heterogeneous integration of ultrathin functional block by solid ph...

Semiconductor devices with through silicon vias and package-level c...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Electronic component, electric device including the same, and bondi...

Display device

Discrete flexible interconnects for modules of integrated circuits

Coated electrical assembly

Electronic component, electric device including the same, and bondi...

Display panel, electronic device including the same, and bonding me...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME

BONDING AND INDEXING METHOD

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

MICROELECTRONIC DEVICE INCLUDING FIBER-CONTAINING BUILD-UP LAYERS

THERMOCOMPRESSION BONDING DEVICE

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

BONDING AND INDEXING APPARATUS

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

DISPLAY DEVICE

CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY

Semiconductor component with chip for the high-frequency range

Electronic Device and a Method for Fabricating an Electronic Device

High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...

Method for Connecting a Die Assembly to a Substrate in an Integrate...

COMPONENT MOUNTING APPARATUS AND METHOD

ASYMMETRIC ALIGNMENT OF SUBSTRATE INTERCONNECT TO SEMICONDUCTOR DIE

Semiconductor device and manufacturing method therefor

SENSOR SEMICONDUCTOR DEVICE

Direct Write™ System

Method for making stacked integrated circuits (ICs) using prepackag...

Asymmetric alignment of substrate interconnect to semiconductor die

Electronic-part built-in substrate and manufacturing method therefor

BOARD HAVING ELECTRONIC PARTS MOUNTED BY USING UNDER-FILL MATERIAL...

Method of manufacturing wiring board