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H01L2224/49097

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

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Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,721,672
- Issue date Aug 8, 2023
- Kioxia Corporation
- Yuichi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with ultrasonically welded terminals
- Patent number 9,949,385
- Issue date Apr 17, 2018
- ABB Schweiz AG
- Samuel Hartmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 9,935,075
- Issue date Apr 3, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with rigid layers used for protection...
- Patent number 9,824,974
- Issue date Nov 21, 2017
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,437,586
- Issue date Sep 6, 2016
- Samsung Electronics Co., Ltd.
- Min gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,287,249
- Issue date Mar 15, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kinoshita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having optimized wire bond positioning
- Patent number 6,812,580
- Issue date Nov 2, 2004
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. Wenzel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH METAL INTERPOSER
- Publication number 20230134332
- Publication date May 4, 2023
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220285320
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20190393184
- Publication date Dec 26, 2019
- Mitsubishi Electric Corporation
- Satoshi KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180197834
- Publication date Jul 12, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding Method and Apparatus for Electromagnetic Interference...
- Publication number 20180033764
- Publication date Feb 1, 2018
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150108663
- Publication date Apr 23, 2015
- Min Gi HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150062437
- Publication date Mar 5, 2015
- PANASONIC CORPORATION
- Tomohiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor module with ultrasonically welded terminals

Wire bonding method and apparatus for electromagnetic interference...

Integrated circuit assemblies with rigid layers used for protection...

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor package having optimized wire bond positioning

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

LEADFRAME PACKAGE WITH METAL INTERPOSER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POWER MODULE AND POWER CONVERSION APPARATUS

Wire Bonding Method and Apparatus for Electromagnetic Interference...

Wire Bonding Method and Apparatus for Electromagnetic Interference...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE