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SEMICONDUCTOR DEVICES
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Publication number 20240128332
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Sang Shin JANG
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT STRUCTURE
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Publication number 20240128214
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Publication date Apr 18, 2024
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UNITED MICROELECTRONICS CORP.
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Aaron Chen
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H01 - BASIC ELECTRIC ELEMENTS
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VERTICAL MEMORY DEVICE
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Publication number 20240130131
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Publication date Apr 18, 2024
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Samsung Electronics Co., Ltd.
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Jeawon JEONG
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G11 - INFORMATION STORAGE
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CRUCIFORM BONDING STRUCTURE FOR 3D-IC
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Publication number 20240128216
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Publication date Apr 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hao-Lin Yang
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP STRUCTURE
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Publication number 20240120277
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Publication date Apr 11, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Hong-Seng SHUE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240120318
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Kyung Don Mun
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240120319
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Hyunsoo CHUNG
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H01 - BASIC ELECTRIC ELEMENTS
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SKIP VIA WITH LATERAL LINE CONNECTION
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Publication number 20240120271
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Publication date Apr 11, 2024
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International Business Machines Corporation
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Nicholas Anthony Lanzillo
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240120274
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Eui Bok LEE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240120278
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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Bo Ram LEE
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H01 - BASIC ELECTRIC ELEMENTS
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