Via connections in a multilevel interconnection structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5226Via connections in a multilevel interconnection structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing system, method of manufacturing a semic...
- Patent number 12,217,962
- Issue date Feb 4, 2025
- Kioxia Corporation
- Shingo Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked planar capacitors based multi-function linear threshold gat...
- Patent number 12,218,045
- Issue date Feb 4, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
- Patent number 12,218,051
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming trench in IC chip through multiple trench formation and dep...
- Patent number 12,219,709
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 12,218,008
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device containing resonant tunneling barri...
- Patent number 12,219,756
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,218,046
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Eui Bok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 12,218,052
- Issue date Feb 4, 2025
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component inter-digitated vias and leads
- Patent number 12,218,056
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Christopher Kinney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Read-only memory circuit
- Patent number 12,218,122
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jacklyn Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Routing structure of semiconductor device and forming method thereof
- Patent number 12,216,978
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Anurag Verma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 12,218,050
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,219,775
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure having common connection...
- Patent number 12,218,186
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,210
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,218,034
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an individualization zone of an integrated circuit
- Patent number 12,218,083
- Issue date Feb 4, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nicolas Posseme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory chip and semiconductor package including the same
- Patent number 12,219,774
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Min Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with finned support pillar structur...
- Patent number 12,213,320
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Seiji Shimabukuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective removal of an etching stop layer for improving overlay sh...
- Patent number 12,211,700
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,213,317
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral double diffused MOS device
- Patent number 12,211,909
- Issue date Jan 28, 2025
- NuVolta Technologies (Hefei) Co., Ltd.
- John Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated fabricating method
- Patent number 12,211,935
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Liang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked vias with bottom portions formed using selective growth
- Patent number 12,211,786
- Issue date Jan 28, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...
- Publication number 20250038074
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE
- Publication number 20250038106
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250038131
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20250038046
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiangning Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE...
- Publication number 20250038105
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...
- Publication number 20250038109
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Paolo Tessariol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20250038133
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Chi-Shun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250038148
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250040224
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
- Publication number 20250038044
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yingcheng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...
- Publication number 20250029924
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250029870
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Feng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS
- Publication number 20250029894
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250029906
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyounglim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY FOR INTEGRATED CIRCUIT
- Publication number 20250029931
- Publication date Jan 23, 2025
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20250031378
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF PREVENTING CHARGING DAMAGE TH...
- Publication number 20250031458
- Publication date Jan 23, 2025
- UNITED MICROELECTRONICS CORP.
- Ming-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTERCONNECT VIA
- Publication number 20250029872
- Publication date Jan 23, 2025
- IMEC vzw
- Anshul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250029956
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Yasunori IWASHITA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...
- Publication number 20250024672
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024681
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022794
- Publication date Jan 16, 2025
- RENESAS ELECTRONICS CORPORATION
- Takayuki IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20250022825
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...
- Publication number 20250022878
- Publication date Jan 16, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS

Via connections in a multilevel interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing system, method of manufacturing a semic...

Stacked planar capacitors based multi-function linear threshold gat...

Method of manufacturing a semiconductor device including a pluralit...

Forming trench in IC chip through multiple trench formation and dep...

Method of forming an integrated circuit device having an etch-stop...

Memory device including self-aligned conductive contacts

Three dimensional memory device containing resonant tunneling barri...

Semiconductor device and method of fabricating the same

Advanced lithography and self-assembled devices

Component inter-digitated vias and leads

Read-only memory circuit

Routing structure of semiconductor device and forming method thereof

Manufacturing method for semiconductor device

Integrated chip with graphene based interconnect

Semiconductor device and method for manufacturing the same

Microelectronic devices with a polysilicon structure above a stairc...

Semiconductor device

Semiconductor structure and method of forming the same

Back-end-of-line passive device structure having common connection...

Semiconductor device

Semiconductor structure and method for manufacturing semiconductor...

Method of making an individualization zone of an integrated circuit

Integrated circuit device

Nonvolatile memory chip and semiconductor package including the same

Three-dimensional memory device with finned support pillar structur...

Selective removal of an etching stop layer for improving overlay sh...

Memory arrays and methods used in forming a memory array comprising...

Lateral double diffused MOS device

Semiconductor structure and associated fabricating method

Stacked vias with bottom portions formed using selective growth

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH BACKSIDE INTERCONNECT STRUCTURE AND THRO...

BOND STRUCTURE

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

METHODS FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD MAKING THE...

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED ELECTRON...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME

MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES

CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...

INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE ASSEMBLY FOR INTEGRATED CIRCUIT

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SEMICONDUCTOR MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF PREVENTING CHARGING DAMAGE TH...

METHOD FOR PRODUCING AN INTERCONNECT VIA

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING HORIZONTAL SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

SEAL RING STRUCTURE AND METHOD OF FORMING SAME

USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR...