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H01L2924/405

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/405Wavelength

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 11,114,341
- Issue date Sep 7, 2021
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure, optical module, and method for manufactu...
- Patent number 10,720,751
- Issue date Jul 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrate for transfer of semiconductor devices
- Patent number 10,354,895
- Issue date Jul 16, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improved direct transfer of semiconductor die
- Patent number 10,290,615
- Issue date May 14, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for direct transfer of semiconductor devices with needle...
- Patent number 10,242,971
- Issue date Mar 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for direct transfer of semiconductor device di...
- Patent number 10,170,454
- Issue date Jan 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for light diffusion
- Patent number 10,157,896
- Issue date Dec 18, 2018
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Flexible support substrate for transfer of semiconductor devices
- Patent number 10,062,588
- Issue date Aug 28, 2018
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 9,985,003
- Issue date May 29, 2018
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices
- Patent number 9,871,023
- Issue date Jan 16, 2018
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
- Patent number 9,865,564
- Issue date Jan 9, 2018
- GLOBALFOUNDRIES Inc.
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with embedded die and its methods of fabrication
- Patent number 9,780,054
- Issue date Oct 3, 2017
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices
- Patent number 9,748,210
- Issue date Aug 29, 2017
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip integration with through silicon via (TSV) die embedded i...
- Patent number 9,716,084
- Issue date Jul 25, 2017
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate manufacturing method, semiconductor element man...
- Patent number 9,455,229
- Issue date Sep 27, 2016
- Namiki Seimitsu Houseki Kabushiki Kaisha
- Hideo Aida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220302095
- Publication date Sep 22, 2022
- Japan Display Inc.
- Kenichi TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...
- Publication number 20220285181
- Publication date Sep 8, 2022
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20200135563
- Publication date Apr 30, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with Array of LEDs for Backlighting a Display Device
- Publication number 20180301439
- Publication date Oct 18, 2018
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20180286838
- Publication date Oct 4, 2018
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DI...
- Publication number 20180261581
- Publication date Sep 13, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED DIRECT TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20180261579
- Publication date Sep 13, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES WITH NEEDLE...
- Publication number 20180261580
- Publication date Sep 13, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH ARRAY OF LEDS FOR BACKLIGHTING A DISPLAY DEVICE
- Publication number 20180233495
- Publication date Aug 16, 2018
- Rohinni, LLC.
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Multi-Direct Transfer of Semiconductors
- Publication number 20180053752
- Publication date Feb 22, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device on String Circuit and Method of Making the Same
- Publication number 20170365586
- Publication date Dec 21, 2017
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20170256524
- Publication date Sep 7, 2017
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRANSFER OF SEMICONDUCTOR DEVICES
- Publication number 20170256523
- Publication date Sep 7, 2017
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH ARRAY OF LEDS FOR BACKLIGHTING A DISPLAY DEVICE
- Publication number 20170053901
- Publication date Feb 23, 2017
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...
- Publication number 20150348893
- Publication date Dec 3, 2015
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...
- Publication number 20150171067
- Publication date Jun 18, 2015
- Intel Corporation
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20150162300
- Publication date Jun 11, 2015
- International Business Machines Corporation
- Maxime Cadotte
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...
- Publication number 20150076662
- Publication date Mar 19, 2015
- NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA
- Hideo Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...
- Publication number 20150072515
- Publication date Mar 12, 2015
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION
- Publication number 20150050781
- Publication date Feb 19, 2015
- lintel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...
- Publication number 20140332975
- Publication date Nov 13, 2014
- Digvijay A. Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20120111496
- Publication date May 10, 2012
- International Business Machines Corporation
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package with embedded die and its methods of fabrication
- Publication number 20110215464
- Publication date Sep 8, 2011
- Intel Corporation
- John Stephen Guzek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus, and method of manufacturing...

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Method for improved transfer of semiconductor die

Laser processing method

Apparatus for direct transfer of semiconductor device die

Optical package structure, optical module, and method for manufactu...

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Support substrate for transfer of semiconductor devices

Semiconductor device on string circuit and method of making the same

Method and apparatus for improved direct transfer of semiconductor die

Apparatus for direct transfer of semiconductor devices with needle...

Method and apparatus for direct transfer of semiconductor device di...

Method and apparatus for light diffusion

Flexible support substrate for transfer of semiconductor devices

Substrate with array of LEDs for backlighting a display device

Method for transfer of semiconductor devices

Laser ashing of polyimide for semiconductor manufacturing

Semiconductor package with embedded die and its methods of fabrication

Method for transfer of semiconductor devices

Multichip integration with through silicon via (TSV) die embedded i...

Composite substrate manufacturing method, semiconductor element man...

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS, AND METHOD OF MANUFACTURING...

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

LASER PROCESSING METHOD

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

Substrate with Array of LEDs for Backlighting a Display Device

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD AND APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DI...

METHOD AND APPARATUS FOR IMPROVED DIRECT TRANSFER OF SEMICONDUCTOR DIE

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES WITH NEEDLE...

SUBSTRATE WITH ARRAY OF LEDS FOR BACKLIGHTING A DISPLAY DEVICE

Apparatus for Multi-Direct Transfer of Semiconductors

Semiconductor Device on String Circuit and Method of Making the Same

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE AND METHOD OF MAKING THE SAME

METHOD AND APPARATUS FOR TRANSFER OF SEMICONDUCTOR DEVICES

SUBSTRATE WITH ARRAY OF LEDS FOR BACKLIGHTING A DISPLAY DEVICE

METHOD OF MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT COMPRI...

MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MAN...

LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNIN...

SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION

MULTICHIP INTEGRATION WITH THROUGH SILICON VIA (TSV) DIE EMBEDDED I...

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

Semiconductor package with embedded die and its methods of fabrication